公开(公告)号：US20210111154A1

公开(公告)日：2021-04-15

申请号：US17128558

申请日：2020-12-21

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Amr Elshazly ,  Arun Chandrasekhar ,  Shawna M. Liff ,  Johanna M. Swan

IPC: H01L25/065 ,  H01L23/498 ,  H01L25/00

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

公开(公告)号：US10921349B2

公开(公告)日：2021-02-16

申请号：US16096968

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Jelena Culic-Viskota ,  Thomas L. Sounart ,  Feras Eid ,  Sasha N. Oster

IPC: G01R15/20 ,  H01L41/06 ,  G01R15/14 ,  H01L41/113 ,  G01R15/24 ,  H01L41/12

Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.

公开(公告)号：US20200286871A1

公开(公告)日：2020-09-10

申请号：US16650698

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Adel A. Elsherbini ,  Johanna M. Swan

IPC: H01L25/16 ,  G02B6/43 ,  G02B6/42 ,  H01L23/00 ,  H01L23/538 ,  H01L21/48

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a photonic receiver; and a die coupled to the photonic receiver by interconnects, wherein the die comprises a device layer between a first interconnect layer of the die and a second interconnect layer of the die. In still some embodiments, a microelectronic assembly may include a photonic transmitter; and a die coupled to the photonic transmitter by interconnects, wherein the die comprises a device layer between a first interconnect layer of the die and a second interconnect layer of the die.

公开(公告)号：US20200279829A1

公开(公告)日：2020-09-03

申请号：US16649949

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan

IPC: H01L25/065 ,  H01L23/538

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a transmitter/receiver logic (TRL) die coupled to the first surface of the package substrate; a plurality of antenna elements adjacent the second surface of the package substrate; and a transmitter/receiver chain (TRC) die, wherein the TRC die is embedded in the package substrate, and wherein the TRC die is electrically coupled to the RF die and at least one of the plurality of antenna elements via conductive pathways in the package substrate. In some embodiments, a microelectronic assembly may further include a double-sided TRC die. In some embodiments, a microelectronic assembly may further include a TRC die having an amplifier. In some embodiments, a microelectronic assembly may further include a TRL die having a modem and a phase shifter.

公开(公告)号：US20200273840A1

公开(公告)日：2020-08-27

申请号：US16648464

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Amr Elshazly ,  Arun Chandrasekhar ,  Shawna M. Liff ,  Johanna M. Swan

IPC: H01L25/065 ,  H01L23/498 ,  H01L25/00

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

公开(公告)号：US20200235061A1

公开(公告)日：2020-07-23

申请号：US16651888

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Patrick Morrow ,  Henning Braunisch ,  Kimin Jun ,  Brennen Mueller ,  Shawna M. Liff ,  Johanna M. Swan ,  Paul B. Fischer

IPC: H01L23/64 ,  H01L23/34 ,  H01L23/66 ,  H01L49/02

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may a die having a front side and a back side, the die comprising a first material and conductive contacts at the front side; and a thermal layer attached to the back side of the die, the thermal layer comprising a second material and a conductive pathway, wherein the conductive pathway extends from a front side of the thermal layer to a back side of the thermal layer.

公开(公告)号：US20200227401A1

公开(公告)日：2020-07-16

申请号：US16650499

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Arun Chandrasekhar

IPC: H01L25/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L25/18 ,  H01L23/538

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.

公开(公告)号：US10594029B2

公开(公告)日：2020-03-17

申请号：US15283140

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Adel A. Elsherbini ,  Sasha N. Oster ,  Feras Eid ,  Georgios C. Dogiamis ,  Thomas L. Sounart ,  Johanna M. Swan

IPC: H01Q1/52 ,  H01L41/09 ,  H01L41/047 ,  H04L29/06 ,  H01Q1/27 ,  H04W12/12 ,  H04L29/08 ,  H01Q15/00 ,  H04W12/00

Abstract: Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.

公开(公告)号：US10566672B2

公开(公告)日：2020-02-18

申请号：US15277504

申请日：2016-09-27

Applicant: INTEL CORPORATION

Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Johanna M. Swan ,  Georgios C. Dogiamis ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Telesphor Kamgaing

IPC: H01P5/10 ,  H01Q13/08

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.

公开(公告)号：US20190385977A1

公开(公告)日：2019-12-19

申请号：US16008879

申请日：2018-06-14

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Feras Eid ,  Johanna M. Swan ,  Shawna M. Liff

IPC: H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01L23/00

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a first die having a first surface and an opposing second surface embedded in a first dielectric layer, where the first surface of the first die is coupled to the second surface of the package substrate by first interconnects; a second die having a first surface and an opposing second surface embedded in a second dielectric layer, where the first surface of the second die is coupled to the second surface of the first die by second interconnects; and a third die having a first surface and an opposing second surface embedded in a third dielectric layer, where the first surface of the third die is coupled to the second surface of the second die by third interconnects.