公开(公告)号：US11421376B2

公开(公告)日：2022-08-23

申请号：US16072165

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Feras Eid ,  Aleksandar Aleksov ,  Sasha N. Oster ,  Baris Bicen ,  Thomas L. Sounart ,  Valluri R. Rao ,  Johanna M. Swan

IPC: H01L41/047 ,  D06M10/06 ,  D06M11/46 ,  D06M11/47 ,  H01L41/316 ,  D06M17/00 ,  H01L41/087 ,  D06M11/83 ,  H01L41/187 ,  H01L41/29 ,  D01F11/00

Abstract: Embodiments of the invention include an active fiber with a piezoelectric layer that has a crystallization temperature that is greater than a melt or draw temperature of the fiber and methods of forming such active fibers. According to an embodiment, a first electrode is formed over an outer surface of a fiber. Embodiments may then include depositing a first amorphous piezoelectric layer over the first electrode. Thereafter, the first amorphous piezoelectric layer may be crystallized with a pulsed laser annealing process to form a first crystallized piezoelectric layer. In an embodiment, the pulsed laser annealing process may include exposing the first amorphous piezoelectric layer to radiation from an excimer laser with an energy density between approximately 10 and 100 mJ/cm2 and pulse width between approximately 10 and 50 nanoseconds. Embodiments may also include forming a second electrode over an outer surface of the crystallized piezoelectric layer.

公开(公告)号：US10992021B2

公开(公告)日：2021-04-27

申请号：US15745681

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Georgios C. Dogiamis

IPC: H01Q1/22 ,  H01Q1/52

Abstract: Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas.

公开(公告)号：US10950919B2

公开(公告)日：2021-03-16

申请号：US16325522

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Richard J. Dischler ,  Johanna M. Swan

IPC: H01P5/02 ,  H01P3/12 ,  H01P3/16 ,  H01P1/04 ,  H01P1/02 ,  H01P11/00

Abstract: An apparatus comprises a waveguide section including an outer layer of conductive material tubular in shape and having multiple ends; and a joining feature on at least one of the ends of the waveguide section configured for joining to a second separate waveguide section.

公开(公告)号：US10910305B2

公开(公告)日：2021-02-02

申请号：US16464972

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster

IPC: H01L23/64 ,  H01L23/522 ,  H01G4/33 ,  H01G4/38 ,  H01L23/488 ,  H01L23/50 ,  H01L23/00 ,  H01L49/02 ,  H05K1/16

Abstract: Embodiments of the invention include a microelectronic device that includes a substrate having transistor layers and interconnect layers including conductive layers to form connections to transistor layers. A capacitive bump is disposed on the interconnect layers. The capacitive bump includes a first electrode, a dielectric layer, and a second electrode. In another example, an inductive bump is disposed on the interconnect layers. The inductive bump includes a conductor and a magnetic layer that surrounds the conductor.

公开(公告)号：US10886606B2

公开(公告)日：2021-01-05

申请号：US16464678

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Sasha N. Oster ,  Georgios C. Dogiamis

IPC: H01Q1/38 ,  H01Q21/00 ,  H01Q1/24 ,  H01Q21/22 ,  H01L23/66 ,  H01L23/522 ,  H01Q9/04 ,  H01Q19/22 ,  H01L23/498 ,  H01Q1/22 ,  H01Q21/06

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10852495B2

公开(公告)日：2020-12-01

申请号：US15746792

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Shawna Liff ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Gaurav Chawla

IPC: G02B6/42 ,  G06F13/14 ,  H01P5/00 ,  H01Q13/10 ,  H04B1/40 ,  H04B7/00 ,  H04M9/06 ,  G06F13/00

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

公开(公告)号：US10721568B2

公开(公告)日：2020-07-21

申请号：US16096568

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Feras Eid ,  Adel A. Elsherbini ,  Johanna Swan ,  Shawna M. Liff ,  Thomas L. Sounart ,  Sasha N. Oster

IPC: H04R17/00 ,  B06B1/06

Abstract: Embodiments of the invention include an acoustic transducer device having a base structure that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. In one example, for a transmit mode, a voltage signal is applied between the first and second electrodes and this causes a stress in the piezoelectric material which causes a stack that is formed with the first electrode, the piezoelectric material, and the second electrode to vibrate and hence the base structure to vibrate and generate acoustic waves.

公开(公告)号：US10476545B2

公开(公告)日：2019-11-12

申请号：US15745980

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Brandon M. Rawlings ,  Georgios C. Dogiamis

IPC: H04B1/40 ,  H04B1/00 ,  H01L25/00 ,  H01L23/00

Abstract: Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.

公开(公告)号：US10461388B2

公开(公告)日：2019-10-29

申请号：US15394990

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster

IPC: H04B1/40 ,  H01P3/16 ,  H01P3/12 ,  H01P3/127

Abstract: Radio frequency (RF) data transfer between components in rack mounted systems is facilitated through the use of dielectric waveguides and millimeter Wave (mm-Wave) transceivers. A signal generator provides one or more data signals to a serializer/deserializer (SERDES) which serializes a plurality of parallel data signals to produce a single, serialized, signal containing data from each of the input signals to the SERDES. A mm-Wave die upconverts the serialized signal to a mm-Wave signal and a mm-Wave launcher launches the signal into the dielectric waveguide. At the receiving end the process is reversed such that the mm-Wave signal is first downconverted and passed through a SERDES to provide the original one or more signals to a recipient signal generator. Some or all of the components may be formed directly in the semiconductor package.

公开(公告)号：US20190198961A1

公开(公告)日：2019-06-27

申请号：US16329587

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01Q9/04 ,  H01P11/00

CPC classification number: H01P3/16 ,  H01P3/122 ,  H01P11/002 ,  H01P11/006 ,  H01Q9/045 ,  H04L67/10

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.