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    FLUID FLOW STRUCTURE
    183.
    发明申请
    FLUID FLOW STRUCTURE 有权
    流体流动结构

    公开(公告)号：US20170028725A1

    公开(公告)日：2017-02-02

    申请号：US15303316

    申请日：2014-04-22

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua CHEN ,  Michael W. Cumbie ,  Diane R. Hammerstad

    IPC: B41J2/14

    CPC classification number: B41J2/1433 ,  B41J2/1404 ,  B41J2002/14419 ,  B41J2202/20

    Abstract: In one example, a fluid flow structure includes a fluid dispensing micro device embedded in a molding having a channel therein through which fluid may flow directly to the device. The device contains multiple fluid ejectors and multiple fluid chambers each near an ejector. Each chamber has an inlet through which fluid from the channel may enter the chamber and an outlet through which fluid may be ejected from the chamber. A perimeter of the channel surrounds the inlets but is otherwise unconstrained in size by the size of the device.

    Abstract translation: 在一个示例中，流体流动结构包括嵌入在其中具有通道的模制件中的流体分配微型装置，流体可以通过该通道直接流向装置。 该装置包含多个流体喷射器和多个流体室，每个流体喷射器各自靠近喷射器。 每个室具有一个入口，来自该通道的流体可以通过该入口进入该室，一个出口，流体可通过该出口从该室排出。 通道的周边围绕入口，但是在尺寸上不受约束的尺寸。

    Molded printhead
    184.
    发明授权
    Molded printhead 有权
    模压打印头

    公开(公告)号：US09539814B2

    公开(公告)日：2017-01-10

    申请号：US14770762

    申请日：2013-12-13

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W. Cumbie

    IPC: B41J2/16 ,  B41J2/14

    CPC classification number: B41J2/1637 ,  B41J2/14 ,  B41J2/16 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20

    Abstract: In one example, a molded printhead includes a printhead die embedded in a molding and an external electrical contact electrically connected to the printhead die and exposed outside the molding to connect to circuitry external to the printhead. The molding has a channel therein through which fluid may pass to the back part of the die. The front part of the die is exposed outside the molding and the back part of the die is covered by the molding except at the channel and the thickness of the molding varies from a lesser thickness around the die to a greater thickness away from the die.

    Abstract translation: 在一个示例中，模制打印头包括嵌入模制件中的打印头模头和电连接到打印头模具的外部电触头，并暴露在模制件外部以连接到打印头外部的电路。 模制件具有通道，流体可以通过该通道传递到模具的后部。 模具的前部暴露在模制件的外部，并且模具的后部由模具覆盖，除了在通道之外，模制件的厚度从模具周围的较小厚度变化到离模具更大的厚度。

    MOLDED PRINTHEAD
    187.
    发明申请
    MOLDED PRINTHEAD 审中-公开
    模制打印

    公开(公告)号：US20160009086A1

    公开(公告)日：2016-01-14

    申请号：US14770608

    申请日：2013-09-27

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Silam J. Choy ,  Michael W. Cumbie ,  Devin Alexander Mourey ,  Chien-Hua Chen

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/1637 ,  B41J2/14 ,  B41J2/16 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20

    Abstract: In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.

    Abstract translation: 在一个示例中，打印头包括：打印头芯片，其具有可以从模具分配流体的前表面，模具模制成具有通道的整体模制件，流体可以通过该通道直接传递到模具的后部， 裸露在模具外部的模具的前表面和除了通道之外的由模制物覆盖的模具的后部; 暴露在模制件外部以连接到打印头外部的电路的电触头; 模制到模制品中的印刷电路板，印刷电路板具有与裸露的前表面共面并且围绕裸露的前表面的暴露的前表面和与触点电连接的导体; 以及在模具和完全封装在模制件中的印刷电路板导体之间的电连接。

    Communicating print component
    188.
    发明授权
    Communicating print component 有权

    公开(公告)号：US12183430B2

    公开(公告)日：2024-12-31

    申请号：US18135697

    申请日：2023-04-17

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Scott A. Linn ,  James Michael Gardner ,  Michael W. Cumbie

    IPC: G11C7/24 ,  B41J2/045 ,  G11C7/10 ,  G11C13/00

    Abstract: An integrated circuit to drive a number of fluid actuation devices, comprising a circuit configured to have a memory access state which can be set to one of an enabled state and disabled state. The integrated circuit to include a fluid actuation circuit to transmit selection information for a fluid actuation device, the selection information comprising a data state bit. The integrated circuit to include a memory cell array, configured so that each memory cell is accessible by the memory access state being enabled, and the data state bit being set.

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