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公开(公告)号：US11482280B2
公开(公告)日：2022-10-25
申请号：US16436734
申请日：2019-06-10
Applicant: Micron Technology, Inc.
Inventor： Innocenzo Tortorelli , Russell L. Meyer , Agostino Pirovano , Andrea Redaelli , Lorenzo Fratin , Fabio Pellizzer
Abstract: Disclosed herein is a memory cell including a memory element and a selector device. Data may be stored in both the memory element and selector device. The memory cell may be programmed by applying write pulses having different polarities and magnitudes. Different polarities of the write pulses may program different logic states into the selector device. Different magnitudes of the write pulses may program different logic states into the memory element. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities and magnitudes of the write pulses.
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公开(公告)号：US11217322B2
公开(公告)日：2022-01-04
申请号：US16990114
申请日：2020-08-11
Applicant: Micron Technology, Inc.
Inventor： Innocenzo Tortorelli , Agostino Pirovano , Andrea Redaelli , Fabio Pellizzer , Hongmei Wang
Abstract: Methods, systems, and devices for drift mitigation with embedded refresh are described. A memory cell may be written to and read from using write and read voltages, respectively, that are of different polarities. For example, a memory cell may be written to by applying a first write voltage and may be subsequently read from by applying a first read voltage of a first polarity. At least one additional (e.g., a second) read voltage—a setback voltage—of a second polarity may be utilized to return the memory cell to its original state. Thus the setback voltage may mitigate a shift in the voltage distribution of the cell caused by the first read voltage.
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公开(公告)号：US11200950B2
公开(公告)日：2021-12-14
申请号：US16518847
申请日：2019-07-22
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Agostino Pirovano , Innocenzo Tortorelli , Fabio Pellizzer
Abstract: Methods, systems, and devices for programming enhancement in memory cells are described. An asymmetrically shaped memory cell may enhance ion crowding at or near a particular electrode, which may be leveraged for accurately reading a stored value of the memory cell. Programming the memory cell may cause elements within the cell to separate, resulting in ion migration towards a particular electrode. The migration may depend on the polarity of the cell and may create a high resistivity region and low resistivity region within the cell. The memory cell may be sensed by applying a voltage across the cell. The resulting current may then encounter the high resistivity region and low resistivity region, and the orientation of the regions may be representative of a first or a second logic state of the cell.
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公开(公告)号：US20210183947A1
公开(公告)日：2021-06-17
申请号：US17187213
申请日：2021-02-26
Applicant: Micron Technology, Inc.
Inventor： Agostino Pirovano , Andrea Redaelli , Fabio Pellizzer , Innocenzo Tortorelli
IPC: H01L27/24 , H01L27/115 , H01L45/00
Abstract: In an example, a memory array may include a plurality of first dielectric materials and a plurality of stacks, where each respective first dielectric material and each respective stack alternate, and where each respective stack comprises a first conductive material and a storage material. A second conductive material may pass through the plurality of first dielectric materials and the plurality of stacks. Each respective stack may further include a second dielectric material between the first conductive material and the second conductive material.
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公开(公告)号：US20210183946A1
公开(公告)日：2021-06-17
申请号：US17108795
申请日：2020-12-01
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli
IPC: H01L27/24 , H01L45/00 , H01L27/108 , G11C5/02 , G11C13/00 , G11C11/408
Abstract: Memory devices for embedded applications are described. A memory device may include an array of memory cells having a first area and configured to operate at a first voltage, and circuitry having a second area that at least partially overlaps the first area. The circuitry may be configured to operate at a second voltage lower than the first voltage. The circuitry maybe be further configured to access the array of memory cells using decoder circuitry configured to operate at the first voltage. The array of memory cells and the circuitry may be on a single substrate. The circuitry may include microcontroller circuitry, cryptographic controller circuitry, and/or memory controller circuitry. The memory cells may be self-selecting memory cells that each include a storage and selector element having a chalcogenide material. The memory cells may not include separate cell selector circuitry.
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Patent Agency Ranking
公开(公告)号：US11011582B2
公开(公告)日：2021-05-18
申请号：US16785026
申请日：2020-02-07
Applicant: Micron Technology, Inc.
Inventor： Anna Maria Conti , Andrea Redaelli , Agostino Pirovano
Abstract: An example three-dimensional (3-D) memory array includes a first plurality of conductive lines separated from one other by an insulation material, a second plurality of conductive lines, and a plurality of pairs of conductive pillars arranged to extend substantially perpendicular to the first plurality of conductive lines and the second plurality of conductive lines. The conductive pillars of each respective pair are coupled to a same conductive line of the second plurality of conductive lines. A storage element material is formed partially around the conductive pillars of each respective pair.
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公开(公告)号：US20210119123A1
公开(公告)日：2021-04-22
申请号：US17088253
申请日：2020-11-03
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Anna Maria Conti , Agostino Pirovano
Abstract: Methods, systems, and devices for a tapered cell profile and fabrication are described. A memory storage component may contain multiple chalcogenide materials and may include a tapered profile. For example, a first chalcogenide material may be coupled with a second chalcogenide material. Each of the chalcogenide materials may be further coupled with a conductive material (e.g., an electrode). Through an etching process, the chalcogenide materials may tapered (e.g., step tapered). A pulse may be applied to the tapered chalcogenide materials resulting in a memory storage component that includes a mixture of the chalcogenide materials.
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公开(公告)号：US20210050521A1
公开(公告)日：2021-02-18
申请号：US16539932
申请日：2019-08-13
Applicant: Micron Technology, Inc.
Inventor： Stephen W. Russell , Andrea Redaelli , Innocenzo Tortorelli , Agostino Pirovano , Fabio Pellizzer , Lorenzo Fratin
Abstract: Methods, systems, and devices for techniques for forming self-aligned memory structures are described. Aspects include etching a layered assembly of materials including a first conductive material and a first sacrificial material to form a first set of channels along a first direction that creates a first set of sections. An insulative material may be deposited within each of the first set of channels and a second sacrificial material may be deposited onto the first set of sections and the insulating material. A second set of channels may be etched into the layered assembly of materials along a second direction that creates a second set of sections, where the second set of channels extend through the first and second sacrificial materials. Insulating material may be deposited in the second set of channels and the sacrificial materials removed leaving a cavity. A memory material may be deposited in the cavity.
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公开(公告)号：US20200381046A1
公开(公告)日：2020-12-03
申请号：US16998240
申请日：2020-08-20
Applicant: Micron Technology, Inc.
Inventor： Andrea Redaelli , Innocenzo Tortorelli , Agostino Pirovano , Fabio Pellizzer
Abstract: Methods, systems, and devices for multi-deck memory arrays are described. A multi-deck memory device may include a memory array with a cell having a self-selecting memory element and another array with a cell having a memory storage element and a selector device. The device may be programmed to store multiple combinations of logic states using cells of one or more decks. Both the first deck and second deck may be coupled to at least two access lines and may have one access line that is a common access line, coupling the two decks. Additionally, both decks may overlie control circuitry, which facilitates read and write operations. The control circuitry may be configured to write a first state or a second state to one or both of the memory decks via the access lines.
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公开(公告)号：US20200372966A1
公开(公告)日：2020-11-26
申请号：US16990114
申请日：2020-08-11
Applicant: Micron Technology, Inc.
Inventor： Innocenzo Tortorelli , Agostino Pirovano , Andrea Redaelli , Fabio Pellizzer , Hongmei Wang
Abstract: Methods, systems, and devices for drift mitigation with embedded refresh are described. A memory cell may be written to and read from using write and read voltages, respectively, that are of different polarities. For example, a memory cell may be written to by applying a first write voltage and may be subsequently read from by applying a first read voltage of a first polarity. At least one additional (e.g., a second) read voltage—a setback voltage—of a second polarity may be utilized to return the memory cell to its original state. Thus the setback voltage may mitigate a shift in the voltage distribution of the cell caused by the first read voltage.
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