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公开(公告)号：US20230412084A1
公开(公告)日：2023-12-21
申请号：US18209744
申请日：2023-06-14
Applicant: STMicroelectronics LTD
Inventor： Laurent GONTHIER
CPC classification number: H02M3/33571 , H02M3/315
Abstract: The present description concerns a circuit for converting from a first alternating voltage to a second voltage. The circuit includes: a first thyristor; a first control circuit of the first thyristor; a power factor correction circuit comprising a coil; and a first circuit configured to convert a third voltage into a fourth DC voltage. The third voltage corresponds to a difference between a potential at a first node connected to an output node of the coil and a reference potential. The fourth DC voltage is configured to supply the first control circuit of the first thyristor, and is referenced with respect to the same reference potential as the third voltage.
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公开(公告)号：US11775117B1
公开(公告)日：2023-10-03
申请号：US17859784
申请日：2022-07-07
Inventor： Pengcheng Wen , Yuan Yun Wang
IPC: G06F3/041 , G09G3/3233 , G06F3/044
CPC classification number: G06F3/04184 , G06F3/0443 , G06F3/04166 , G09G3/3233 , G09G2320/0247 , G09G2330/023 , G09G2354/00
Abstract: A method of operating a display includes performing a non-synchronized touch scan pattern on a display with a controller coupled to the display. The non-synchronized touch scan pattern schedules touch scans independent of a refresh rate of the display. Upon the controller detecting a first synchronization pulse from a display controller coupled to the controller and the display, a first pulse-checking timer is started. Upon detecting a second synchronization pulse from the display controller and before the first pulse-checking timer expires, a first display refresh rate for the display is obtained from an interval between the first synchronization pulse and the second synchronization pulse. A synchronized touch scan pattern is performed with the controller, and is scheduled to avoid touch scans coinciding with refreshes of the display performed at the first display refresh rate.
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183.发明授权公开(公告)号：US11774834B2
公开(公告)日：2023-10-03
申请号：US17479345
申请日：2021-09-20
Applicant: STMicroelectronics LTD , STMicroelectronics S.r.l.
Inventor： Alex Domnits , Elan Roth , Davide Terzi , Luca Molinari , Marco Boschi
CPC classification number: G03B21/142 , G01J1/0238 , G01J1/44 , G03B21/008 , G03B21/2033
Abstract: A scanning laser projector includes an optical module and projection engine. The optical module includes a laser generator outputting a laser beam, and a movable mirror scanning the laser beam across an exit window defined through the housing in a scanning pattern wider than the exit window such that the laser beam is directed through the exit window in a projection pattern that is smaller than and within the scanning pattern. A first light detector is positioned about a periphery of the exit window such that as the movable mirror scans the laser beam in the scan pattern, at a point in the scan pattern where the laser beam is scanned across an interior of the housing and not through the exit window, the laser beam impinges upon the first light detector. The projection engine adjusts driving of the movable mirror based upon output from the first light detector.
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公开(公告)号：US20230307302A1
公开(公告)日：2023-09-28
申请号：US18184436
申请日：2023-03-15
Applicant: STMICROELECTRONICS LTD , STMICROELECTRONICS PTE LTD
Inventor： David GANI , Hui-Tzu Wang
IPC: H01L23/04 , H01L25/065 , H01L23/00
CPC classification number: H01L23/04 , H01L25/0655 , H01L24/32 , H01L2924/16151 , H01L2924/16788 , H01L2224/32225
Abstract: A semiconductor package includes a silicon substrate with an active surface and an inactive surface. A semiconductor device, such as an image, light, or optical sensor, is formed in the active surface and disposed on the substrate. A glass plate is coupled to the substrate with adhesive. The glass plate includes a sensor area that corresponds to the area of the semiconductor device and holes through the glass plate that are generally positioned around the sensor area of the glass plate. During formation of the package, the holes through the glass plate allow gas released by the adhesive to escape the package and prevent formation of a gas bubble.
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公开(公告)号：US20220352232A1
公开(公告)日：2022-11-03
申请号：US17243195
申请日：2021-04-28
Applicant: STMICROELECTRONICS LTD.
Inventor： Yu-Tsung Lin
IPC: H01L27/146 , G02B3/00 , G03F7/00
Abstract: A method of forming a device, the method including: depositing a first photoresist layer over a substrate, forming an array of seed lenses by patterning and reflowing the first photoresist layer, a dimension of the array of seed lenses varying across the substrate, forming a second photoresist layer over the array of seed lenses, and forming a microlens array by patterning and reflowing the second photoresist layer.
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Patent Agency Ranking
公开(公告)号：US20220006988A1
公开(公告)日：2022-01-06
申请号：US17479176
申请日：2021-09-20
Applicant: STMicroelectronics LTD , STMicroelectronics S.r.l.
Inventor： Massimo RATTI , Eli YASER , Naomi PETRUSHEVSKY , Yotam NACHMIAS
Abstract: A light projection system includes a MEMS mirror operating on a mirror drive signal to generate a mirror sense signal resulting from operation of the MEMS mirror based on the mirror drive signal. A mirror driver generates the mirror drive signal from a drive control signal. A controller receives the mirror sense signal from the MEMS mirror, obtains a first sample of the mirror sense signal at a first phase thereof, obtains a second sample of the mirror sense signal at a second phase thereof, wherein the first and second phases are separated by a half period of the mirror drive signal, with the second phase occurring after the first phase, and generates the drive control signal based on a difference between the first and second samples to keep the mirror drive signal separated in phase from the mirror sense signal by a desired amount of phase separation.
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公开(公告)号：US11195809B2
公开(公告)日：2021-12-07
申请号：US16706594
申请日：2019-12-06
Applicant: STMICROELECTRONICS LTD
Inventor： Endruw Jahja , Cheng-Yang Su
IPC: H01L23/00
Abstract: A fan-out wafer level package includes a semiconductor die with a redistribution layer on a sidewall of the semiconductor die. A redistribution layer positioned over the die includes an extended portion that extends along the sidewall. The semiconductor die is encapsulated in a molding compound layer. The molding compound layer is positioned between the extended portion of the redistribution layer and the sidewall of the semiconductor die. Solder contacts, for electrically connecting the semiconductor device to an electronic circuit board, are positioned on the redistribution layer. The solder contacts and the sidewall of the redistribution layer can provide electrical contact on two different locations. Accordingly, the package can be used to improve interconnectivity by providing vertical and horizontal connections.
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公开(公告)号：US20210048737A1
公开(公告)日：2021-02-18
申请号：US16540557
申请日：2019-08-14
Applicant: STMicroelectronics LTD
Inventor： Eli YASER , Guy AMOR , Yotam NACHMIAS , Dadi SHARON , Sivan NAGOLA
Abstract: A control circuit includes a first control circuit generating a first drive control signal from a pre-drive signal (that is a frequency at which an opening angle of the first and second mirrors is equal) for the first mirror. A second control circuit generates a second drive control signal from the pre-drive signal for the second mirror. First and second drivers generate first and second drive signals for the first and second mirrors from the first and second drive control signals. The first and second drive control signals are generated so that the first and second drive signals each have a same frequency as the pre-drive signal but are different in amplitude from one another to cause the first and second mirrors to move at a same frequency, with a same and substantially constant given opening angle as one another, and in phase with one another.
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公开(公告)号：US20200301127A1
公开(公告)日：2020-09-24
申请号：US16897491
申请日：2020-06-10
Applicant: STMicroelectronics LTD
Inventor： Elik HARAN , Offir DUVDEVANY , Naomi PETRUSHEVSKY
IPC: G02B26/08 , G01R19/04 , H02P25/032 , G02B26/10
Abstract: An electronic device includes an analog to digital converter receiving an analog mirror sense signal from an oscillating mirror and generating a digital mirror sense signal therefrom, and a digital signal processing block. The digital signal processing block cooperates with the analog to digital converter to take a first sample of the digital mirror sense signal at a first time where a derivative of capacitance of the digital mirror sense signal crosses zero, take a second sample of the digital mirror sense signal at a second time between a peak of the digital mirror sense signal and the first time, and take a third sample of the digital mirror sense signal at a third time after the digital mirror sense signal has reached a minimum. Control circuitry determines an opening angle of the oscillating mirror as a function of the first, second, and third samples.
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190.发明授权公开(公告)号：US10469813B2
公开(公告)日：2019-11-05
申请号：US16032634
申请日：2018-07-11
Applicant: STMicroelectronics S.r.l. , STMicroelectronics Ltd
Inventor： Massimo Ratti , Naomi Petrushevsky , Eli Yaser , Yotam Nachimias
Abstract: A light projection system includes a light module emitting a light beam and a movable mirror reflecting the light beam toward a surface. A graphics processing unit processes video data to compensate for a response of the light module. The response is an optical power of the light beam produced by the light module for a given forward current through the light module. A light source driver controls the light module as a function of the processed video data. Colors of the images from the video data produced on the surface by the light beam would otherwise not look as they are intended to look due to changing of the response of the light module, but the processing of the video data alters the video data such that the colors of the images from the video data produced on the surface look as they are intended to look.
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