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    Integrated beam shaper and use thereof
    12.
    发明授权
    Integrated beam shaper and use thereof 失效
    集成光束整形器及其用途

    公开(公告)号：US6128134A

    公开(公告)日：2000-10-03

    申请号：US917865

    申请日：1997-08-27

    Applicant: Michael R. Feldman ,  Alan D. Kathman ,  W. Hudson Welch ,  Robert TeKolste

    Inventor： Michael R. Feldman ,  Alan D. Kathman ,  W. Hudson Welch ,  Robert TeKolste

    IPC: G02B6/42 ,  G02B27/09 ,  G11B7/135 ,  H01S3/00 ,  H01S3/02 ,  H01S5/00 ,  H01S5/022 ,  G02B6/12 ,  G02B27/30

    CPC classification number: G02B19/0009 ,  G02B19/0052 ,  G02B27/09 ,  G02B27/095 ,  G02B6/4206 ,  G11B7/1353 ,  G11B7/1362 ,  G11B7/1381 ,  G11B7/1398 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4232 ,  H01S5/02248 ,  H01S5/02292

    Abstract: A substrate having an optical element on an input surface thereof receives a light beam not having a desired beam shape and shapes the light beam into a predetermined intensity distribution. The substrate may further include a second optical element for providing a predetermined phase pattern to the light beam provided by the first optical element. The first optical element may, for example, circularize an elliptical light beam using a soft aperture for differential power attenuation or by altering the divergence of the light beam along the different axes of the light beam. When the divergence angles are altered and the collimating optical element is provided on the output surface, the thickness of the transparent substrate is determined in accordance with a resultant difference in the divergence and/or with the initial difference in beam size along each axis and with a required circularity. A light source is mounted close to the first optical element in order to minimize the amount of differing divergence present along the different axes of the light beam. The optical elements may be diffractive, refractive, or hybrids thereof and are preferably prepared photolithographically on the substrate itself. The light source may be mounted using fiducial marks and the photolithographic processes for forming the optical elements may also use fiducial marks. All elements of the integrated beam shaper may be formed on a planar, wafer level.

    Abstract translation: 在其输入表面上具有光学元件的基板接收不具有期望光束形状的光束并将光束形成为预定的强度分布。 基板还可以包括用于向由第一光学元件提供的光束提供预定相位图案的第二光学元件。 例如，第一光学元件可以使用用于差分功率衰减的软孔径或通过改变沿着光束的不同轴的光束的发散来使椭圆形光束圆化。 当发散角被改变并且准直光学元件设置在输出表面上时，透明衬底的厚度根据所得到的发散差异和/或沿着每个轴的光束尺寸的初始差异以及与 要求的圆形度。 光源安装在靠近第一光学元件的位置，以便沿着光束的不同轴线最小化存在的不同发散量。 光学元件可以是衍射，折射或混合，并且优选光刻地制备在衬底本身上。 光源可以使用基准标记安装，并且用于形成光学元件的光刻工艺也可以使用基准标记。 集成光束整形器的所有元件可以形成在平面晶片级上。

    Optical head structures including electronic devices adjacent transparent substrates and related methods
    13.
    发明授权
    Optical head structures including electronic devices adjacent transparent substrates and related methods 失效
    包括邻近透明基板的电子器件的光头结构及相关方法

    公开(公告)号：US5872762A

    公开(公告)日：1999-02-16

    申请号：US994205

    申请日：1997-12-29

    Applicant: Michael R. Feldman ,  Alan D. Kathman

    Inventor： Michael R. Feldman ,  Alan D. Kathman

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/43 ,  G11B7/12 ,  G11B7/135 ,  G11B7/22 ,  H01L31/12 ,  H01S5/00 ,  G11B7/00

    CPC classification number: G11B7/1372 ,  G02B6/4231 ,  G02B6/4232 ,  G11B7/123 ,  G11B7/1353 ,  G11B7/1374 ,  G11B7/22 ,  G02B2006/12102 ,  G02B2006/12107 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4238 ,  G02B6/4239 ,  G02B6/43 ,  H01S5/005

    Abstract: An integrated optical head, such as, for a disk drive, preferably includes an optically transparent substrate. The substrate has a diffractive optical element formed on one face and a plurality of electrical contact pads exposed on the other face. A light source is positioned to emit light through the substrate, through the diffractive optical element, and toward data storage media. The light source includes a plurality of electrical contact pads corresponding to the plurality of electrical contact pads exposed on the face of the substrate. An optical detector is positioned to detect light reflected from the data storage media, through the diffractive optical element, and through the substrate. The optical detector includes a plurality of exposed electrical contact pads corresponding to the plurality of electrical contact pads exposed on the face of the substrate. The substrate and the light source and optical detector are passively aligned using solder bumps between pairs of contact pads. A mechanical passive alignment arrangement is also disclosed.

    Abstract translation: 诸如用于磁盘驱动器的集成光学头优选地包括光学透明的基板。 衬底具有形成在一个面上的衍射光学元件和暴露在另一个面上的多个电接触焊盘。 光源被定位成通过基底，通过衍射光学元件和数据存储介质发光。 光源包括对应于暴露在基板的表面上的多个电接触焊盘的多个电接触焊盘。 光学检测器被定位成通过衍射光学元件和通过基底来检测从数据存储介质反射的光。 光学检测器包括对应于暴露在基板的表面上的多个电接触焊盘的多个暴露的电接触焊盘。 基板和光源和光学检测器被使用在成对的接触焊盘之间的焊料凸块被动对准。 还公开了一种机械被动对准装置。

    METHOD OF MAKING A SPATIALLY SENSITIVE APPARATUS
    14.
    发明申请
    METHOD OF MAKING A SPATIALLY SENSITIVE APPARATUS 审中-公开
    制作空间敏感装置的方法

    公开(公告)号：US20130130428A1

    公开(公告)日：2013-05-23

    申请号：US13737284

    申请日：2013-01-09

    Applicant: Robert D. TeKOLSTE ,  Alan D. KATHMAN

    Inventor： Robert D. TeKOLSTE ,  Alan D. KATHMAN

    IPC: H01L27/146

    CPC classification number: H01L27/14685 ,  G01J3/18 ,  G01J3/26 ,  G01J3/36 ,  G01J2003/1213

    Abstract: A spectrometer for use with a desired wavelength range includes an array of filters. Each filter outputs at least two non-contiguous wavelength peaks within the desired wavelength range. The array of filters is spectrally diverse over the desired wavelength range, and each filter in the array of filters outputs a spectrum of a first resolution. An array of detectors has a detector for receiving an output of a corresponding filter. A processor receives signals from each detector, and outputs a reconstructed spectrum having a second resolution, the second resolution being higher than any of the first resolution of each filter. Filters and detectors may be arranged into a plurality of imaging units, each imaging unit including first and second filters and first and second photosensing regions. A processor receives signals from each imaging unit, and generates a reconstructed spatial image comprised of discrete spatial units corresponding to each imaging unit.

    Abstract translation: 用于所需波长范围的光谱仪包括一组滤光片。 每个滤波器在期望的波长范围内输出至少两个不连续的波长峰值。 滤波器阵列在期望的波长范围内是频谱多样的，并且滤波器阵列中的每个滤波器输​​出第一分辨率的光谱。 检测器阵列具有用于接收相应滤波器的输出的检测器。 处理器从每个检测器接收信号，并输出具有第二分辨率的重建频谱，第二分辨率高于每个滤波器的第一分辨率。 滤光器和检测器可以被布置成多个成像单元，每个成像单元包括第一和第二滤光器以及第一和第二光敏区域。 处理器从每个成像单元接收信号，并且产生由对应于每个成像单元的离散空间单元组成的重构空间图像。

    Spectrometer including a plurality of spectrally diverse filters each outputting multiple discrete wavelength peaks, and associated methods
    17.
    发明授权
    Spectrometer including a plurality of spectrally diverse filters each outputting multiple discrete wavelength peaks, and associated methods 失效
    光谱仪包括多个频谱不同的滤波器，每个滤波器输​​出多个离散的波长峰值，以及相关联的方法

    公开(公告)号：US07453575B2

    公开(公告)日：2008-11-18

    申请号：US11723279

    申请日：2007-03-19

    Applicant: Robert D. Te Kolste ,  Alan D. Kathman

    Inventor： Robert D. Te Kolste ,  Alan D. Kathman

    IPC: G01B9/02

    CPC classification number: G01J3/36 ,  G01J3/18 ,  G01J3/26

    Abstract: A spectrometer for use with a desired wavelength range includes an array of filters. Each filter outputs at least two non-contiguous wavelength peaks within the desired wavelength range. The array of filters is spectrally diverse over the desired wavelength range, and each filter in the array of filters outputs a spectrum of a first resolution. An array of detectors has a detector for receiving an output of a corresponding filter. A processor receives signals from each detector, and outputs a reconstructed spectrum having a second resolution, the second resolution being higher than any of the first resolution of each filter.

    Abstract translation: 用于所需波长范围的光谱仪包括一组滤光片。 每个滤波器在期望的波长范围内输出至少两个不连续的波长峰值。 滤波器阵列在期望的波长范围内是频谱多样的，并且滤波器阵列中的每个滤波器输​​出第一分辨率的光谱。 检测器阵列具有用于接收相应滤波器的输出的检测器。 处理器从每个检测器接收信号，并输出具有第二分辨率的重建频谱，第二分辨率高于每个滤波器的第一分辨率。

    Simultaneous provision of controlled height bonding material at a wafer level and associated structures
    19.
    发明授权
    Simultaneous provision of controlled height bonding material at a wafer level and associated structures 有权
    同时在晶圆级别提供受控高度接合材料和相关结构

    公开(公告)号：US06669803B1

    公开(公告)日：2003-12-30

    申请号：US09672445

    申请日：2000-09-29

    Applicant: Alan D. Kathman ,  Harris R. Miller ,  Jay Matthews ,  Stacey Grabiner ,  Waddie Heyward

    Inventor： Alan D. Kathman ,  Harris R. Miller ,  Jay Matthews ,  Stacey Grabiner ,  Waddie Heyward

    IPC: B32B3118

    CPC classification number: H01L25/167 ,  G02B6/12 ,  G02B6/43 ,  H01L27/14625 ,  H01L2924/0002 ,  Y10T156/1052 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T156/1093 ,  H01L2924/00

    Abstract: Different techniques may be used to realize the simultaneous provision of bonding material at a controlled height on a wafer level. These techniques include photolithographically patterning a layer of bonding material and providing spacer elements on a wafer then contacting another surface having the bonding material provided thereon to transfer the bonding material to the spacer elements. The patterning of the bonding material may include using a mask direct contact with or spaced from the bonding material. The providing of the spacer elements may include forming the spacers in the wafer itself or attaching spacer elements, particularly a wafer of spacer elements. The resultant integrated structure has controlled spacing between the bonded elements.

    Abstract translation: 可以使用不同的技术来实现在晶片级上以受控的高度同时提供接合材料。 这些技术包括光刻地图案化一层接合材料并在晶片上提供间隔元件，然后接触另一个具有其上提供的接合材料的表面，以将接合材料转移到间隔元件。 接合材料的图案化可以包括使用与接合材料直接接触或间隔开的掩模。 间隔元件的提供可以包括在晶片本身中形成间隔物或者连接间隔元件，特别是间隔元件的晶片。 所得到的一体结构具有受控元件之间的间隔。

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