摘要:
A substrate having an optical element on an input surface thereof receives a light beam not having a desired beam shape and shapes the light beam into a predetermined intensity distribution. The substrate may further include a second optical element for providing a predetermined phase pattern to the light beam provided by the first optical element. The first optical element may, for example, circularize an elliptical light beam using a soft aperture for differential power attenuation or by altering the divergence of the light beam along the different axes of the light beam. When the divergence angles are altered and the collimating optical element is provided on the output surface, the thickness of the transparent substrate is determined in accordance with a resultant difference in the divergence and/or with the initial difference in beam size along each axis and with a required circularity. A light source is mounted close to the first optical element in order to minimize the amount of differing divergence present along the different axes of the light beam. The optical elements may be diffractive, refractive, or hybrids thereof and are preferably prepared photolithographically on the substrate itself. The light source may be mounted using fiducial marks and the photolithographic processes for forming the optical elements may also use fiducial marks. All elements of the integrated beam shaper may be formed on a planar, wafer level.
摘要:
An integrated optical imaging system includes a first substrate having first and second opposing surfaces, a second substrate having third and fourth opposing surfaces, a spacer between a substantially planar portion of the third surface of the second substrate and a substantially planar portion of the second surface of the first substrate, at least two of the spacer, the first substrate and the second substrate sealing an interior space between the third surface of the second substrate and the second surface of the first substrate, and an optical imaging system having n surfaces, where n is greater than or equal to two, at least two of the n surfaces of the optical imaging system are on respective ones of the first, second, third and fourth surfaces.
摘要:
An integrated optical apparatus includes an optically transparent substrate with a light source and a detector mounted adjacent thereto. The substrate includes an optical element in a transmit path from the light source to a remote target. The optical element splits the light into more than one beam. A detector receives beams reflected by the target. All optical elements needed to create the more then one beam, direct the more than one beam onto the target and direct the more than one beam from the target to the detector are on the substrate and/or any structure bonded to the substrate. Preferably, the optical element provides sufficient separation between the more than one beam such that each beam is delivered to a unique respective light detecting element of the detector. The return path from the remote target to the detector may include an optical element for each beam or no optical elements. An additional substrate may be included and bonded to the substrate. The active elements may be bonded to a bottom surface of the substrate, either directly or via spacer blocks, or may be provided on a support substrate, which is then bonded, either directly or via spacer blocks, to the substrate.
摘要:
An integrated optical apparatus includes an optically transparent substrate with a light source and a detector mounted adjacent thereto. The substrate includes an optical element in a transmit path from the light source to a remote target. The optical element splits the light into more than one beam. A detector receives beams reflected by the target. All optical elements needed to create the more then one beam, direct the more than one beam onto the target and direct the more than one beam from the target to the detector are on the substrate and/or any structure bonded to the substrate. Preferably, the optical element provides sufficient separation between the more than one beam such that each beam is delivered to a unique respective light detecting element of the detector. The return path from the remote target to the detector may include an optical element for each beam or no optical elements. An additional substrate may be included and bonded to the substrate. The active elements may be bonded to a bottom surface of the substrate, either directly or via spacer blocks, or may be provided on a support substrate, which is then bonded, either directly or via spacer blocks, to the substrate.
摘要:
An integrated optical apparatus includes an optically transparent substrate with a light source and a detector mounted adjacent thereto. The substrate includes an optical element in a transmit path from the light source to a remote target. The optical element splits the light into more than one beam. A detector receives beams reflected by the target. All optical elements needed to create the more then one beam, direct the more than one beam onto the target and direct the more than one beam from the target to the detector are on the substrate and/or any structure bonded to the substrate. Preferably, the optical element provides sufficient separation between the more than one beam such that each beam is delivered to a unique respective light detecting element of the detector. The return path from the remote target to the detector may include an optical element for each beam or no optical elements. An additional substrate may be included and bonded to the substrate. The active elements may be bonded to a bottom surface of the substrate, either directly or via spacer blocks, or may be provided on a support substrate, which is then bonded, either directly or via spacer blocks, to the substrate.
摘要:
An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.
摘要:
An analog controlled angle diffuser and associated methods provide a wavelength insensitive diffuser with a controlled output. The diffuser has free formed shaped analog fringes, i.e., fringes which have a continuous cross-section from their peak to their termination. Preferably, the depth of the analog fringes will be at least 2&pgr;, even more preferably at least 2O&pgr;. Advantageously, the pattern of the diffuser is computer-generated.
摘要:
An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers. An active element having a characteristic which changes in response to an applied field may be integrated on a bottom surface of the wafers. The resulting optical system may present a high numerical aperture. Preferably, one of the optical elements is a refractive element formed in a material having a high index of refraction.
摘要:
An integrated optical head, such as, for a disk drive, preferably includes an optically transparent substrate. The substrate has a diffractive optical element formed on one face and a plurality of electrical contact pads exposed on the other face. A light source is positioned to emit light through the substrate, through the diffractive optical element, and toward data storage media. The light source includes a plurality of electrical contact pads corresponding to the plurality of electrical contact-pads exposed on the face of the substrate. An optical detector is positioned to detect light reflected from the data storage media, through the diffractive optical element, and through the substrate. The optical detector includes a plurality of exposed electrical contact pads corresponding to the plurality of electrical contact pads exposed on the face of the substrate. The substrate and the light source and optical detector are passively aligned using solder bumps between pairs of contact pads. A mechanical passive alignment arrangement is also disclosed.
摘要:
An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.