公开(公告)号：US10706520B2

公开(公告)日：2020-07-07

申请号：US16405996

申请日：2019-05-07

Applicant: Butterfly Network, Inc.

Inventor： Alex Rothberg ,  Igor Lovchinsky ,  Jimmy Jia ,  Tomer Gafner ,  Matthew de Jonge ,  Jonathan M. Rothberg

IPC: G06T7/00 ,  G01S17/00 ,  A61B8/08

Abstract: Aspects of the technology described herein relate to techniques for calculating, during imaging, a quality of a sequence of images collected during the imaging. Calculating the quality of the sequence of images may include calculating a probability that a medical professional would use a given image for clinical evaluation and a confidence that an automated analysis segmentation performed on the given image is correct. Techniques described herein also include receiving a trigger to perform an automatic measurement on a sequence of images, calculating a quality of the sequence of images, determining whether the quality of the sequence of images exceeds a threshold quality, and performing the automatic measurement on the sequence of images based on determining that the quality of the sequence of images exceeds the threshold quality.

公开(公告)号：US20200205670A1

公开(公告)日：2020-07-02

申请号：US16728844

申请日：2019-12-27

Applicant: Butterfly Network, Inc.

Inventor： Tyler S. Ralston ,  Murad Omar ,  Lawrence C. West ,  Jonathan M. Rothberg

IPC: A61B5/00

Abstract: Methods and apparatuses are provided for photoacoustic imaging. One such apparatus may include an ultrasound-on-a-chip device attached to a housing, an optical emitter attached to the housing, and a controller enclosed at least partially in the housing. The ultrasound-on-a-chip device may include a plurality of ultrasonic transducers. The optical emitter may include an array of diodes arranged at a periphery of the plurality of ultrasonic transducers. The controller may be configured to control the optical emitter to emit pulses of light, to control the plurality of ultrasonic transducers to detect ultrasonic waves emitted from a target to be imaged in response to exposure to the pulses of light, and to convert the ultrasonic waves to digital signals. For example, the optical emitter may be controlled to emit chirped optical pulses. The digital signals may be processed by the controller to produce image-formation data.

公开(公告)号：USD885428S1

公开(公告)日：2020-05-26

申请号：US29662089

申请日：2018-08-31

Applicant: Butterfly Network, Inc.

Designer： David Elgena ,  Matthew de Jonge

公开(公告)号：USD885427S1

公开(公告)日：2020-05-26

申请号：US29662087

申请日：2018-08-31

Applicant: Butterfly Network, Inc.

Designer： David Elgena ,  Matthew de Jonge ,  Vineet Shah

公开(公告)号：US20200147641A1

公开(公告)日：2020-05-14

申请号：US16680956

申请日：2019-11-12

Applicant: Butterfly Network, Inc.

Inventor： Keith G. Fife ,  Lingyun Miao ,  Jianwei Liu ,  Jonathan M. Rothberg

IPC: B06B1/02 ,  B81B7/00 ,  B81C1/00 ,  A61B8/00

Abstract: A method of forming an ultrasonic transducer device includes bonding a membrane to seal a transducer cavity with at least a portion of a getter material layer being exposed, the getter material layer comprising a portion of a bilayer stack compatible for use in damascene processing.

公开(公告)号：US20200037987A1

公开(公告)日：2020-02-06

申请号：US16529867

申请日：2019-08-02

Applicant: Butterfly Network, Inc.

Inventor： Nathan Silberman ,  Tomer Gafner ,  Igor Lovchinsky ,  Ardavan Saeedi

IPC: A61B8/00 ,  A61B5/00

Abstract: Aspects of the technology described herein relate to guiding collection of ultrasound data collection using motion and/or orientation data. A first instruction for rotating or tilting the ultrasound imaging device to a default orientation may be provided. Based on determining that the ultrasound imaging device is in the default orientation, a second instruction for translating the ultrasound imaging device to a target position may be provided. Based on determining that the ultrasound imaging device is in the target position, a third instruction for rotating or tilting the ultrasound imaging device to a target orientation may be provided.

公开(公告)号：US10518292B2

公开(公告)日：2019-12-31

申请号：US15868989

申请日：2018-01-11

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00 ,  G10K11/18 ,  G10K9/12 ,  B81B7/00

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US10416298B2

公开(公告)日：2019-09-17

申请号：US15273377

申请日：2016-09-22

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Tyler S. Ralston ,  Nevada J. Sanchez ,  Andrew J. Casper

IPC: G01S7/00 ,  G01S7/52 ,  H03K5/13 ,  B06B1/06 ,  G10K11/34 ,  B06B1/02 ,  H03K5/00

Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.

公开(公告)号：US10398414B2

公开(公告)日：2019-09-03

申请号：US16243546

申请日：2019-01-09

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Keith G. Fife

IPC: A61B8/08 ,  A61B8/00 ,  H03M1/06 ,  H03M1/12 ,  G01S7/52

Abstract: A time gain compensation (TGC) circuit for an ultrasound device includes a first amplifier having an integrating capacitor and a control circuit configured to generate a TGC control signal that controls an integration time of the integrating capacitor, thereby controlling a gain of the first amplifier. The integration time is an amount of time an input signal is coupled to the first amplifier before the input signal is isolated from the first amplifier.

公开(公告)号：US20190164956A1

公开(公告)日：2019-05-30

申请号：US16197438

申请日：2018-11-21

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Susan A. Alie

IPC: H01L27/06 ,  H01L27/092 ,  H01L23/528 ,  H01L23/522 ,  H01L21/768 ,  B81C1/00 ,  B06B1/02 ,  H01L21/56 ,  H01L21/3213 ,  H01L21/8238 ,  A61B8/00 ,  B81B3/00 ,  B81B7/00

Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.