公开(公告)号：US20110318580A1

公开(公告)日：2011-12-29

申请号：US13254939

申请日：2009-03-09

Applicant: Sung-Hwan Choi ,  Ki-Jeong Moon ,  Hae-Sang Jeon ,  Chang-Hoon Sim

Inventor： Sung-Hwan Choi ,  Ki-Jeong Moon ,  Hae-Sang Jeon ,  Chang-Hoon Sim

IPC: B32B7/12

CPC classification number: C09J7/0242 ,  C08G2650/56 ,  C08L33/08 ,  C08L2312/06 ,  C08L2666/04 ,  C09J7/22 ,  C09J7/35 ,  C09J171/00 ,  C09J2463/00 ,  Y02P20/149 ,  Y10T428/2878

Abstract: There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.

Abstract translation: 提供了一种用于制造电子部件的胶带，包括耐热基材和含有设置在耐热基材上的粘合剂组合物的粘合剂层，其中粘合剂组合物包含苯氧树脂，固化剂，能量射线固化丙烯酸 树脂和光引发剂，并且其中粘合剂层通过加热和能量射线固化。

公开(公告)号：US07960023B2

公开(公告)日：2011-06-14

申请号：US11950470

申请日：2007-12-05

Applicant: Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jun ,  Jun-Ho Lee ,  Yun-Min Park

Inventor： Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jun ,  Jun-Ho Lee ,  Yun-Min Park

IPC: B32B7/12 ,  B32B7/00

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J2201/36 ,  C09J2461/00 ,  C09J2463/00 ,  H01L25/0657 ,  H01L2224/26135 ,  H01L2224/29083 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10T428/24975 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00

Abstract: There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.

Abstract translation: 提供了一种用于堆叠芯片的半导体层的粘合膜，包括：包含苯氧基树脂，环氧树脂和酚醛树脂的第一粘合剂层; 第二粘合剂层，其包含苯氧基树脂和紫外线固化性化合物; 以及包含苯氧基树脂，环氧树脂和酚醛树脂的第三粘合剂层，其中所述第二粘合剂层设置在所述第一粘合剂层和所述第三粘合剂层之间。

公开(公告)号：US20100247906A1

公开(公告)日：2010-09-30

申请号：US12159839

申请日：2007-08-22

Applicant: Jun-Ho Lee ,  Hae-Sang Jeun ,  Ki-Jeong Moon ,  Chang-Hoon Sim

Inventor： Jun-Ho Lee ,  Hae-Sang Jeun ,  Ki-Jeong Moon ,  Chang-Hoon Sim

IPC: C09J7/02 ,  B32B15/08 ,  B32B7/12

CPC classification number: H01L21/6835 ,  C09J7/22 ,  C09J7/30 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2401/006 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2477/006 ,  C09J2479/086 ,  C09J2481/006 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/2804 ,  Y10T428/2809 ,  H01L2924/00

Abstract: The present invention relates to a heat-resistant adhesive sheet (tape). More particularly, the invention relates to a heat-resistant adhesive sheet of high reliability and workability, in which crosslink reaction can be induced through irradiation of energy rays on an adhesive layer to achieve heat resistance at high temperature and also high dimension stability in parts, to achieve release without leaving any adhesive residues on an attached surface in releasing the layer and also to achieve no oxidation on the attached surface, e.g., a metallic surface at a high temperature. To this end, the heat-resistant adhesive sheet (tape) according to the invention is characterized by comprising a heat-resistant substrate, and an adhesive layer formed on at least one side of the heat-resistant substrate and made with a coating of liquid comprising energy ray curable olygomer resin, thermosetting adhesive resin, energy ray initiator and thermosetting agent, the adhesive layer being cured and heat resistant by irradiating energy rays to induce crosslink reaction.

Abstract translation: 本发明涉及耐热粘合片（胶带）。 更具体地说，本发明涉及一种高可靠性和可加工性的耐热粘合片，其中可以通过在粘合剂层上照射能量射线来实现交联反应，以实现高温下的耐热性和部件中的高尺寸稳定性， 以在释放层中实现释放而不在附着表面上留下任何粘合剂残留物，并且也在附着的表面（例如高温下的金属表面）上实现不氧化。 为此，根据本发明的耐热粘合片（带）的特征在于包括耐热基材和形成在耐热基材的至少一侧上并由液体涂层制成的粘合剂层 包括能量射线固化性聚合胶体树脂，热固性粘合树脂，能量射线引发剂和热固性剂，粘合剂层通过照射能量射线固化并耐热以引起交联反应。