Abstract:
A method is provided for integrally forming a flip-flop shoe including a sole, a vamp having a toe slot, and a rib interconnected between the sole and the vamp. A sole cavity is defined between middle and lower molds. A vamp cavity is defined between upper and middle molds. An insertion block on the upper mold is received in a slot of the middle mold and corresponds to the toe slot. A rib cavity is defined between an end of the slot and the insertion block and intercommunicates with the sole cavity and the vamp cavity. Molten plastic material is filled into the sole cavity, the vamp cavity, and the rib cavity to form an integral flip-flop shoe including the sole, the vamp, the rib, and the toe slot. The upper and lower molds are then opened, and the integral flip-flop shoe is removed from the middle mold.
Abstract:
A semiconductor device includes a substrate including a pixel region incorporating a photodiode, a grid disposed over the substrate and having walls defining a cavity vertically aligned with the pixel region, and a color filter material disposed in the cavity between the walls of the grid.
Abstract:
A backside illuminated image sensor comprises a photodiode and a first transistor located in a first substrate, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a plurality of logic circuits formed in a second substrate, wherein the second substrate is stacked on the first substrate and the logic circuit are coupled to the first transistor through a plurality of bonding pads.
Abstract:
Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.
Abstract:
A rechargeable battery socket and the manufacturing method of making the same is disclosed. The rechargeable battery socket includes an insulating housing defining a number of terminal channels, a number of terminals received in the insulating housing, and a shell assembled to one side of the insulating housing. Each terminal includes a contacting portion received in corresponding terminal channel and a tail extending out of the insulating housing. Each terminal channel provides a pair of ribs on two opposite inside faces thereof. The contacting portion of the terminal cooperates with the rib to thereby secure the terminal in the insulating housing.
Abstract:
A device includes a semiconductor substrate, and a Device Isolation (DI) region extending from a top surface of the semiconductor substrate into the semiconductor substrate. A gate dielectric is disposed over an active region of the semiconductor substrate, wherein the gate dielectric extends over the DI region. A gate electrode is disposed over the gate dielectric, wherein a notch of the gate electrode overlaps a portion of the DI region.
Abstract:
A system and method for reducing cross-talk between photosensitive diodes is provided. In an embodiment a first color filter is formed over a first photosensitive diode and a second color filter is formed over a second photosensitive diode, and a gap is formed between the first color filter and the second color filter. The gap will serve to reflect light that otherwise would have crossed from the first color filter to the second color filter, thereby reducing cross-talk between the first photosensitive diode and the second photosensitive diode. A reflective grid may also be formed between the first photosensitive diode and the second photosensitive diode in order to assist in the reflection and further reduce the amount of cross-talk.
Abstract:
A backlight module includes a light guide plate having a bottom surface, a light emitting surface, a first light incident surface, and microstructures. Each microstructure recesses into or protrudes from the bottom surface and has a first and a second surfaces. The first and the second surfaces of at least one of the microstructures are located on two sides of a first reference plane parallel to the first light incident surface. A section-line of each first surface on a second reference plane perpendicular to the first light incident surface and perpendicular to the light emitting surface is a straight line. A first angle between each first surface and a third reference plane parallel to the light emitting surface in the light guide plate is between 0 degrees and 20 degrees, and a thickness of each microstructure is between 0 micrometers and 20 micrometers.
Abstract:
A driving method of a display panel includes the following steps: driving the display panel to display a first image frame and providing display data of a second image frame, and each of the first and the second image frames has a first area and a second area for respectively displaying two different display contents, the positions of the two corresponding first areas overlap, and the positions of the two corresponding second areas overlap; determining whether display content differences exist between the two corresponding first areas, and determining whether display content differences exist between the two corresponding second areas, and driving the area where display content differences exist in the two areas of the first image frame to display a first-color display content when display content differences exist between the two corresponding first areas or the two corresponding second areas. Furthermore, a corresponding electrophoresis display apparatus is also provided.
Abstract:
The present invention provides antigen binding proteins that specifically bind to Wilms' tumor protein (WT1), including humanized, chimeric and fully human antibodies against WT1, antibody fragments, chimeric antigen receptors (CARs), fusion proteins, and conjugates thereof. The antigen binding proteins and antibodies bind to HLA-A0201-restricted WT1 peptide. Such antibodies, fragments, fusion proteins and conjugates thereof are useful for the treatment of WT1 associated cancers, including for example, breast cancer, ovarian cancer, prostate cancer, chronic myelocytic leukemia, multiple myeloma, acute lymphoblastic leukemia (ALL), acute myeloid/myelogenous leukemia (AML) and myelodysplastic syndrome (MDS). In more particular embodiments, the anti-WT1/A antibodies may comprise one or more framework region amino acid substitutions designed to improve protein stability, antibody binding and/or expression levels.