公开(公告)号：US20060110853A1

公开(公告)日：2006-05-25

申请号：US11252572

申请日：2005-10-19

Applicant: Shou-Lung Chen ,  Cheng-Ta Ko

Inventor： Shou-Lung Chen ,  Cheng-Ta Ko

IPC: H01L21/50 ,  H01L21/30

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/8203 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

Abstract: A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the molding plate as first. A dielectric layer covers the molding plate to cap the active components. An electric circuit is formed on the dielectric layer, in contact with the active components. Finally, the structure with embedded active components is released from the molding plate.

公开(公告)号：US09931813B2

公开(公告)日：2018-04-03

申请号：US12774731

申请日：2010-05-06

Applicant: Kuan-Neng Chen ,  Wei-Chung Lo ,  Cheng-Ta Ko

Inventor： Kuan-Neng Chen ,  Wei-Chung Lo ,  Cheng-Ta Ko

IPC: B32B15/01 ,  B32B9/04 ,  B32B7/04 ,  B32B7/12 ,  B32B9/00 ,  B32B27/28 ,  B32B3/08

CPC classification number: B32B9/04 ,  B32B3/08 ,  B32B7/04 ,  B32B7/12 ,  B32B9/00 ,  B32B15/01 ,  B32B27/283 ,  B32B2307/714 ,  Y10T156/10 ,  Y10T428/12771 ,  Y10T428/31678

Abstract: A bonding structure and a method of fabricating the same are provided. A first substrate having a first bonding element and a second substrate having a second bonding element are provided, wherein at least one of the first bonding element and the second bonding element is formed with an alloy. A bonding process is performed to bond the first bonding element with the second bonding element, wherein a diffusion liner is generated at the exposed, non-bonded surface of the bonding structure.

公开(公告)号：US08269112B2

公开(公告)日：2012-09-18

申请号：US12189206

申请日：2008-08-11

Applicant: Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

Inventor： Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

IPC: H05K1/00 ,  H05K1/09

CPC classification number: H05K1/0283 ,  H05K1/185 ,  H05K3/222 ,  H05K2201/0355 ,  H05K2201/10287 ,  H05K2203/0271 ,  Y10T29/49162

Abstract: A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.

Abstract translation: 一种电路结构及其制造方法，其使用多条电线将多个焊盘串联连接以形成可拉伸电路。 每个电线具有位于第一端和第二端之间的第一端，第二端和中间段，其中第一端和第二端分别连接到不同的焊盘，并且中间段的位置更高 比第一端和第二端的位置。 由于电线和焊盘的连接方式具有3-D自由度，所以电路结构可以承受水平和垂直变形，并且具有突出的可靠性。

公开(公告)号：US20090179347A1

公开(公告)日：2009-07-16

申请号：US12382526

申请日：2009-03-18

Applicant: Shou-Lung Chen ,  Cheng-Ta Ko

Inventor： Shou-Lung Chen ,  Cheng-Ta Ko

IPC: H01L21/64

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/8203 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

Abstract: A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the molding plate as first. A dielectric layer covers the molding plate to cap the active components. An electric circuit is formed on the dielectric layer, in contact with the active components. Finally, the structure with embedded active components is released from the molding plate.

Abstract translation: 提供嵌入式有源元件的结构及其制造方法。 制造步骤包括提供模制板，并且首先在模制板上设置若干活性组分。 电介质层覆盖模制板以盖住活性组分。 在电介质层上形成与有源元件接触的电路。 最后，嵌入式有源元件的结构从成型板上释放出来。