Abstract:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.
Abstract:
The glove can be heated by the user's breath and comprises an outer layer with a through-hole on the back of the hand, a blowing element attached to the outer layer over the through-hole, and an inner lining. A guide pocket is arranged between the outer layer and the inner lining over an area of the back of the hand which extends from the blowing element all the way to the tips of the fingers, the thumb optionally excepted. The blowing element is attached to the upper wall of said pocket. The lower wall of the pocket is perforated, at each finger, by a through-orifice for air in an area at the tip of said finger. The inner lining is air-permeable in at least the area of the through-orifice.
Abstract:
Interference within a wireless apparatus is mitigated by adjusting one or more transmission characteristics associated with an interconnect of the apparatus. In at least one embodiment, the interconnect is a PCI Express interconnect.