摘要:
A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.
摘要:
A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increase a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, an oblique detection optics system receives the light from the defect at a reduced elevation angle with respect to the sample surface to reduce light from the sample rough surface, an oxide film rough bottom surface, and a circuit pattern, and increases the amount of the light from the defect and detected. The diameter of a lens is smaller than the diameter of a second lens, resulting in a reduction in the ability to focus the scattered light.
摘要:
The present invention has an analyzing unit including an image detection device for producing a plurality of images of a workpiece, a storage for storing detected images produced by the image detection device, and a display having a screen with a first area for displaying a plurality of detected images stored in the storage and a plurality of second areas for classifying the detected images according to features of the detected images, whereby the plurality of detected images are moved on the screen from the first area to selected second areas to classify the plurality of detected images in the second areas.
摘要:
The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.
摘要:
A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is 10a, and an angle between the sample surface and a traveling direction of the light from a defect is α1. An oblique detection optics system receives the light from the defect at a reduced elevation angle α2 with respect to the sample surface to reduce light from the sample rough surface, an oxide film rough bottom surface, and a circuit pattern, and to increase the amount of the light from the defect and detected. The diameter 10a of a lens is smaller than the diameter 10b, resulting in a reduction in the ability to focus the scattered light. When a lens with an outer diameter 10c is used to improve the focus ability, the lens interferes with the sample. To avoid the interference, a portion of the lens interfering with the sample is removed. The lens has an aperture larger than the diameter 10b while the lens receives the light scattered at the elevation angle α2, making it possible to improve the ability to detect defects and lens performance simultaneously.
摘要:
A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is 10a, and an angle between the sample surface and a traveling direction of the light from a defect is α1. An oblique detection optics system receives the light from the defect at a reduced elevation angle α2 with respect to the sample surface to reduce light from the sample rough surface, an oxide film rough bottom surface, and a circuit pattern, and to increase the amount of the light from the defect and detected. The diameter 10a of a lens is smaller than the diameter 10b, resulting in a reduction in the ability to focus the scattered light. When a lens with an outer diameter 10c is used to improve the focus ability, the lens interferes with the sample. To avoid the interference, a portion of the lens interfering with the sample is removed. The lens has an aperture larger than the diameter 10b while the lens receives the light scattered at the elevation angle α2, making it possible to improve the ability to detect defects and lens performance simultaneously.
摘要:
A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.
摘要:
There is disclosed a defect detecting apparatus that focuses a laser beam, irradiates it onto the surface of a sample to be examined, and detects a foreign substance/defect existing on the surface from the scattered light as a result of the irradiation of the beam onto the sample surface. In order to stably detect defects such as foreign substance, the defect detecting apparatus according to the invention is constructed to use a beam shape optical system by which the laser beam emitted from a laser source is shaped to change the illumination intensity from its Gauss distribution to a flat distribution so that the detected signal can be stably produced even if the relative position of a defect/foreign substance to the laser beam irradiation position is changed.
摘要:
Inspection data output from an inspection apparatus is read, the inspection data containing at least one information piece of coordinate value information and size information of a particle or a pattern defect of an inspected object, and drawing data of a product of the inspected object is read. Information is extracted which is representative of a relation between at least one information piece of coordinated value information and size information of the particle or pattern defect of the inspected object in the read inspection data and the read drawing data input at said drawing data input step. The extracted information is compared with determination criterion information registered beforehand and it is determined whether each particle or pattern defect of the inspected object in the inspection data is a detection error or not.
摘要:
A method and system are provided for analyzing defects having the potential to become electrical failures, during the inspection of particles and/or pattern defects of a wafer used in the manufacture of electronic devices such as semiconductor integrated circuits. Defect map data is processed along with failure probability data. Next, defect-dependent failure probability calculations are made to obtain the failure probability of each defect in the defect map data. That data is then used to prepare failure-probability-added defect map data. Further, a selection process of defects to be reviewed is used to reorder and filter defects from the failure-probability-added defect map data, thus selecting one or more defects for review.