Inspecting method, inspecting system, and method for manufacturing electronic devices
    11.
    发明授权
    Inspecting method, inspecting system, and method for manufacturing electronic devices 有权
    检查方法,检查系统和电子设备制造方法

    公开(公告)号:US08428336B2

    公开(公告)日:2013-04-23

    申请号:US11431709

    申请日:2006-05-11

    IPC分类号: G06K9/00

    摘要: A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.

    摘要翻译: 一种用于对缺陷进行分类的方法,包括:通过对样品上的缺陷进行成像而获得的缺陷图像的特征量化计算; 通过使用关于计算的特征量的信息将缺陷图像分类成分类的类别; 在分类的类别的显示屏幕上的区域中显示分类的缺陷图像; 将分类类别的信息添加到所显示的缺陷图像; 将所述分类类别中的信息添加到所述其他类别中的所显示的缺陷图像,并且将所传送的缺陷图像显示在所述显示屏幕上定义为所述其他类别之一的区域中; 并更改关于该类别的信息。

    Defect inspection system
    12.
    发明授权
    Defect inspection system 失效
    缺陷检查系统

    公开(公告)号:US07733474B2

    公开(公告)日:2010-06-08

    申请号:US12081107

    申请日:2008-04-10

    IPC分类号: G01N21/00

    摘要: A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increase a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, an oblique detection optics system receives the light from the defect at a reduced elevation angle with respect to the sample surface to reduce light from the sample rough surface, an oxide film rough bottom surface, and a circuit pattern, and increases the amount of the light from the defect and detected. The diameter of a lens is smaller than the diameter of a second lens, resulting in a reduction in the ability to focus the scattered light.

    摘要翻译: 缺陷检查系统可以抑制来自样品粗糙表面或规则电路图案的光的影响,并且增加来自诸如异物的缺陷的光的增益,以高灵敏度检测样品表面上的缺陷。 当使用具有大NA值的透镜时,倾斜检测光学系统相对于样品表面以降低的仰角接收来自缺陷的光,以减少来自样品粗糙表面的光,氧化膜粗糙的底表面和 电路图案,并且增加来自缺陷的光的量并检测。 透镜的直径小于第二透镜的直径,导致聚焦散射光的能力降低。

    DEFECT INSPECTION SYSTEM
    15.
    发明申请
    DEFECT INSPECTION SYSTEM 失效
    缺陷检查系统

    公开(公告)号:US20100271473A1

    公开(公告)日:2010-10-28

    申请号:US12770337

    申请日:2010-04-29

    IPC分类号: H04N7/18 G01N21/88 G02B3/02

    摘要: A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is 10a, and an angle between the sample surface and a traveling direction of the light from a defect is α1. An oblique detection optics system receives the light from the defect at a reduced elevation angle α2 with respect to the sample surface to reduce light from the sample rough surface, an oxide film rough bottom surface, and a circuit pattern, and to increase the amount of the light from the defect and detected. The diameter 10a of a lens is smaller than the diameter 10b, resulting in a reduction in the ability to focus the scattered light. When a lens with an outer diameter 10c is used to improve the focus ability, the lens interferes with the sample. To avoid the interference, a portion of the lens interfering with the sample is removed. The lens has an aperture larger than the diameter 10b while the lens receives the light scattered at the elevation angle α2, making it possible to improve the ability to detect defects and lens performance simultaneously.

    摘要翻译: 缺陷检查系统可以抑制来自样品粗糙表面或常规电路图案的光的影响,并且增加来自诸如异物的缺陷的光的增益以高灵敏度检测样品表面上的缺陷。 当使用具有大NA值的透镜时,透镜的外径为10a,并且样品表面与来自缺陷的光的行进方向之间的角度为α1。 倾斜检测光学系统以相对于样品表面的降低的仰角α2接收来自缺陷的光,以减少来自样品粗糙表面,氧化膜粗糙底表面和电路图案的光,并且增加 来自缺陷的光并检测。 透镜的直径10a小于直径10b,导致散射光聚焦的能力降低。 当使用外径为10c的透镜来提高聚焦能力时,透镜会干扰样品。 为了避免干扰,去除了与样品干扰的一部分透镜。 透镜具有大于直径10b的孔径,而透镜接收以仰角α2散射的光,从而可以提高同时检测缺陷和透镜性能的能力。

    Defect inspection system
    16.
    发明申请
    Defect inspection system 失效
    缺陷检查系统

    公开(公告)号:US20080291436A1

    公开(公告)日:2008-11-27

    申请号:US12081107

    申请日:2008-04-10

    IPC分类号: G01N21/88

    摘要: A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is 10a, and an angle between the sample surface and a traveling direction of the light from a defect is α1. An oblique detection optics system receives the light from the defect at a reduced elevation angle α2 with respect to the sample surface to reduce light from the sample rough surface, an oxide film rough bottom surface, and a circuit pattern, and to increase the amount of the light from the defect and detected. The diameter 10a of a lens is smaller than the diameter 10b, resulting in a reduction in the ability to focus the scattered light. When a lens with an outer diameter 10c is used to improve the focus ability, the lens interferes with the sample. To avoid the interference, a portion of the lens interfering with the sample is removed. The lens has an aperture larger than the diameter 10b while the lens receives the light scattered at the elevation angle α2, making it possible to improve the ability to detect defects and lens performance simultaneously.

    摘要翻译: 缺陷检查系统可以抑制来自样品粗糙表面或常规电路图案的光的影响,并且增加来自诸如异物的缺陷的光的增益以高灵敏度检测样品表面上的缺陷。 当使用具有大NA值的透镜时,透镜的外径为10a,并且样品表面与来自缺陷的光的行进方向之间的角度为α1。 倾斜检测光学系统以相对于样品表面的降低的仰角α2接收来自缺陷的光,以减少来自样品粗糙表面,氧化膜粗糙底表面和电路图案的光,并且增加 来自缺陷的光并检测。 透镜的直径10a小于直径10b,导致散射光聚焦的能力降低。 当使用外径为10c的透镜来提高聚焦能力时,透镜会干扰样品。 为了避免干扰,去除了与样品干扰的一部分透镜。 透镜具有大于直径10b的孔径,而透镜接收以仰角α2散射的光,从而可以提高同时检测缺陷和透镜性能的能力。

    Method and apparatus for detecting defects
    18.
    发明申请
    Method and apparatus for detecting defects 有权
    检测缺陷的方法和装置

    公开(公告)号:US20060139629A1

    公开(公告)日:2006-06-29

    申请号:US11296290

    申请日:2005-12-08

    IPC分类号: G01N21/88

    摘要: There is disclosed a defect detecting apparatus that focuses a laser beam, irradiates it onto the surface of a sample to be examined, and detects a foreign substance/defect existing on the surface from the scattered light as a result of the irradiation of the beam onto the sample surface. In order to stably detect defects such as foreign substance, the defect detecting apparatus according to the invention is constructed to use a beam shape optical system by which the laser beam emitted from a laser source is shaped to change the illumination intensity from its Gauss distribution to a flat distribution so that the detected signal can be stably produced even if the relative position of a defect/foreign substance to the laser beam irradiation position is changed.

    摘要翻译: 公开了一种将激光束聚焦并将其照射到待检查样品的表面上的缺陷检测装置,并且由于将光束照射到散射光上而检测存在于表面上的异物/缺陷 样品表面。 为了稳定地检测异物等缺陷,根据本发明的缺陷检测装置的结构是使用光束形状光学系统,通过该光束系统将从激光源发射的激光束成形为将照射强度从其高斯分布改变为 平坦分布,使得即使改变了缺陷/异物与激光束照射位置的相对位置,也能够稳定地产生检测信号。

    Inspection data analysis program, defect inspection apparatus, defect inspection system and method for semiconductor device
    19.
    发明授权
    Inspection data analysis program, defect inspection apparatus, defect inspection system and method for semiconductor device 失效
    检验数据分析程序,缺陷检查装置,半导体装置的缺陷检查系统和方法

    公开(公告)号:US06826735B2

    公开(公告)日:2004-11-30

    申请号:US10196146

    申请日:2002-07-17

    IPC分类号: G06F1750

    摘要: Inspection data output from an inspection apparatus is read, the inspection data containing at least one information piece of coordinate value information and size information of a particle or a pattern defect of an inspected object, and drawing data of a product of the inspected object is read. Information is extracted which is representative of a relation between at least one information piece of coordinated value information and size information of the particle or pattern defect of the inspected object in the read inspection data and the read drawing data input at said drawing data input step. The extracted information is compared with determination criterion information registered beforehand and it is determined whether each particle or pattern defect of the inspected object in the inspection data is a detection error or not.

    摘要翻译: 读取从检查装置输出的检查数据,读取包含检测对象的粒子或图案缺陷的坐标值信息和尺寸信息的至少一个信息的检查数据和被检查对象的乘积的绘制数据 。 提取信息,其代表在读取检查数据中的至少一个协调价值信息信息和被检查对象的粒子或图案缺陷的尺寸信息与在所述绘制数据输入步骤输入的读取绘制数据之间的关系。 将提取的信息与预先登记的确定标准信息进行比较,并且确定检查数据中被检查对象的每个粒子或图案缺陷是否是检测错误。

    Inspection system and semiconductor device manufacturing method
    20.
    发明授权
    Inspection system and semiconductor device manufacturing method 失效
    检测系统和半导体器件制造方法

    公开(公告)号:US06775817B2

    公开(公告)日:2004-08-10

    申请号:US10004168

    申请日:2001-10-30

    IPC分类号: G06F1750

    摘要: A method and system are provided for analyzing defects having the potential to become electrical failures, during the inspection of particles and/or pattern defects of a wafer used in the manufacture of electronic devices such as semiconductor integrated circuits. Defect map data is processed along with failure probability data. Next, defect-dependent failure probability calculations are made to obtain the failure probability of each defect in the defect map data. That data is then used to prepare failure-probability-added defect map data. Further, a selection process of defects to be reviewed is used to reorder and filter defects from the failure-probability-added defect map data, thus selecting one or more defects for review.

    摘要翻译: 提供了一种方法和系统,用于在用于制造诸如半导体集成电路的电子器件的晶片的颗粒和/或图案缺陷的检查期间分析具有变为电气故障的可能性的缺陷。 缺陷图数据与故障概率数据一起处理。 接下来,进行与缺陷相关的故障概率计算,以获得缺陷图数据中的每个缺陷的故障概率。 然后将该数据用于准备故障概率添加缺陷图数据。 此外,使用要检查的缺陷的选择处理用于从故障概率添加缺陷图数据重新排序和过滤缺陷,从而选择一个或多个缺陷以供审查。