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    Inspecting method, inspecting system, and method for manufacturing electronic devices
    1.
    发明授权
    Inspecting method, inspecting system, and method for manufacturing electronic devices 有权
    检查方法，检查系统和电子设备制造方法

    公开(公告)号：US08428336B2

    公开(公告)日：2013-04-23

    申请号：US11431709

    申请日：2006-05-11

    申请人： Yoko Ikeda ,  Junko Konishi ,  Hisafumi Iwata ,  Yuji Takagi ,  Kenji Obara ,  Ryo Nakagaki ,  Seiji Isogai ,  Yasuhiko Ozawa

    发明人： Yoko Ikeda ,  Junko Konishi ,  Hisafumi Iwata ,  Yuji Takagi ,  Kenji Obara ,  Ryo Nakagaki ,  Seiji Isogai ,  Yasuhiko Ozawa

    IPC分类号： G06K9/00

    CPC分类号： G06F3/0486 ,  G06F2203/04803 ,  G06T7/0004 ,  G06T2200/24 ,  G06T2207/30148

    摘要： A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.

    摘要翻译： 一种用于对缺陷进行分类的方法，包括：通过对样品上的缺陷进行成像而获得的缺陷图像的特征量化计算; 通过使用关于计算的特征量的信息将缺陷图像分类成分类的类别; 在分类的类别的显示屏幕上的区域中显示分类的缺陷图像; 将分类类别的信息添加到所显示的缺陷图像; 将所述分类类别中的信息添加到所述其他类别中的所显示的缺陷图像，并且将所传送的缺陷图像显示在所述显示屏幕上定义为所述其他类别之一的区域中; 并更改关于该类别的信息。

    Charged particle beam device, defect observation device, and management server
    5.
    发明授权
    Charged particle beam device, defect observation device, and management server 有权
    带电粒子束装置，缺陷观察装置和管理服务器

    公开(公告)号：US08779360B2

    公开(公告)日：2014-07-15

    申请号：US13809923

    申请日：2011-06-22

    申请人： Kozo Miyake ,  Junko Konishi ,  Takehiro Hirai ,  Kenji Obara

    发明人： Kozo Miyake ,  Junko Konishi ,  Takehiro Hirai ,  Kenji Obara

    IPC分类号： H01J37/153

    CPC分类号： H01J37/153 ,  G01N23/00 ,  H01J37/28 ,  H01J2237/24592 ,  H01J2237/2817

    摘要： Provided is a charged particle beam device that prevents the increase in processing trouble caused by deterioration in the reviewing performance (e.g., overlooking of defects) by detecting an operation abnormality affecting the performance of the device or a possibility of such an abnormality in the middle of a processing sequence of a sample and giving a feedback in real time. In each processing step of the charged particle beam device, monitoring items representing the operating status of the device (control status of the electron beam, an offset amount at the time of wafer positioning, a defect coordinate error offset amount, etc.) are monitored during the processing sequence of a sample and stored as history information. In the middle of the processing sequence, a comparative judgment between the value of each monitoring item and the past history information corresponding to the monitoring item is made according to preset judgment criteria. When the width of fluctuation from the past history information deviates from a reference range, an alert is issued.

    摘要翻译： 提供了一种带电粒子束装置，其通过检测影响装置的性能的操作异常或在中间的这种异常的可能性来防止由于检查性能的劣化（例如，忽视缺陷）引起的加工故障的增加 样品的处理顺序并实时提供反馈。 在带电粒子束装置的每个处理步骤中，监视表示装置的运行状态（电子束的控制状态，晶片定位时的偏移量，缺陷坐标误差偏移量等）的监视项目 在样品的处理顺序期间并存储为历史信息。 在处理顺序的中间，根据预先设定的判断基准，进行各监视项目的值与对应于监视项目的过去历史信息的比较判断。 当过去历史信息的波动宽度偏离参考范围时，发出警报。

    CHARGED PARTICLE BEAM DEVICE, DEFECT OBSERVATION DEVICE, AND MANAGEMENT SERVER
    6.
    发明申请
    CHARGED PARTICLE BEAM DEVICE, DEFECT OBSERVATION DEVICE, AND MANAGEMENT SERVER 有权
    充电颗粒光束装置，缺陷观察装置和管理服务器

    公开(公告)号：US20130112893A1

    公开(公告)日：2013-05-09

    申请号：US13809923

    申请日：2011-06-22

    申请人： Kozo Miyake ,  Junko Konishi ,  Takehiro Hirai ,  Kenji Obara

    发明人： Kozo Miyake ,  Junko Konishi ,  Takehiro Hirai ,  Kenji Obara

    IPC分类号： G01N23/00

    CPC分类号： H01J37/153 ,  G01N23/00 ,  H01J37/28 ,  H01J2237/24592 ,  H01J2237/2817

    摘要： Provided is a charged particle beam device that prevents the increase in processing trouble caused by deterioration in the reviewing performance (e.g., overlooking of defects) by detecting an operation abnormality affecting the performance of the device or a possibility of such an abnormality in the middle of a processing sequence of a sample and giving a feedback in real time. In each processing step of the charged particle beam device, monitoring items representing the operating status of the device (control status of the electron beam, an offset amount at the time of wafer positioning, a defect coordinate error offset amount, etc.) are monitored during the processing sequence of a sample and stored as history information. In the middle of the processing sequence, a comparative judgment between the value of each monitoring item and the past history information corresponding to the monitoring item is made according to preset judgment criteria. When the width of fluctuation from the past history information deviates from a reference range, an alert is issued.

    摘要翻译： 提供了一种带电粒子束装置，其通过检测影响装置的性能的操作异常或在中间的这种异常的可能性来防止由于检查性能的劣化（例如，忽视缺陷）引起的加工故障的增加 样品的处理顺序并实时提供反馈。 在带电粒子束装置的每个处理步骤中，监视表示装置的运行状态（电子束的控制状态，晶片定位时的偏移量，缺陷坐标误差偏移量等）的监视项目 在样品的处理顺序期间并存储为历史信息。 在处理顺序的中间，根据预先设定的判断基准，进行各监视项目的值与对应于监视项目的过去历史信息的比较判断。 当过去历史信息的波动宽度偏离参考范围时，发出警报。

    ANALYZING APPARATUS, PROGRAM, DEFECT INSPECTION APPARATUS, DEFECT REVIEW APPARATUS, ANALYSIS SYSTEM, AND ANALYSIS METHOD
    7.
    发明申请
    ANALYZING APPARATUS, PROGRAM, DEFECT INSPECTION APPARATUS, DEFECT REVIEW APPARATUS, ANALYSIS SYSTEM, AND ANALYSIS METHOD 有权
    分析装置，程序，缺陷检查装置，缺陷检查装置，分析系统和分析方法

    公开(公告)号：US20080226153A1

    公开(公告)日：2008-09-18

    申请号：US12039255

    申请日：2008-02-28

    申请人： Makoto ONO ,  Junko Konishi ,  Tomohiro Funakoshi

    发明人： Makoto ONO ,  Junko Konishi ,  Tomohiro Funakoshi

    IPC分类号： G06K9/00

    CPC分类号： G06K9/6215 ,  G06K2209/19 ,  G06T7/0004 ,  G06T2207/30148

    摘要： In order to allow to easily specify inspection recipe with which defects desired to be detected can be detected efficiently, a defect inspection apparatus performs defect inspection of a substrate in accordance with a plurality of inspection recipes and produces defect information associated with position of defect in the substrate and attribute data of the defect for each of the inspection recipes and a defect review apparatus produces review result information specifying a kind of defect selected from defects contained in the defect information. An analyzing apparatus obtains defect information and review result information and totalizes the number of defects having attribute data similar to attribute data possessed in defects corresponding to kind of defects to be analyzed for each inspection recipe.

    摘要翻译： 为了能够容易地指定能够有效地检测出希望的缺陷的检查配方，缺陷检查装置根据多个检查配方进行基板的缺陷检查，并且生成与缺陷的位置有关的缺陷信息 每个检查配方的缺陷的基板和属性数据以及缺陷检查装置产生指定从缺陷信息中包含的缺陷中选择的缺陷的种类的检查结果信息。 分析装置获取缺陷信息并查看结果信息，并且将具有属性数据的缺陷的数量的总和与每个检查配方的要分析的缺陷的种类相对应的缺陷中具有的属性数据相似。

    Test data analyzing system and test data analyzing program
    9.
    发明申请
    Test data analyzing system and test data analyzing program 失效
    测试数据分析系统和测试数据分析程序

    公开(公告)号：US20070021855A1

    公开(公告)日：2007-01-25

    申请号：US11483740

    申请日：2006-07-11

    申请人： Makoto Ono ,  Junko Konishi

    发明人： Makoto Ono ,  Junko Konishi

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G05B23/024 ,  G05B2219/32196 ,  G05B2219/32206 ,  Y02P90/22 ,  Y02P90/86

    摘要： Disclosed is a test data analyzing method and system for use in estimation of a defect cause of a product, such as, an integrated circuit, a liquid crystal display, an optical transceiver, a thin film magnetic head, etc., which is fabricated through plural processes. The estimation of a defect cause is achieved by selecting a wafer number to be analyzed, reading test data, reading fabrication line data, counting frequency of machine codes by wafers, grouping test data by machine codes or frequencies, comparing test data distributions between groups by machine codes, and comparing results between machine codes.

    摘要翻译： 公开了一种用于估计产品的缺陷原因的测试数据分析方法和系统，例如集成电路，液晶显示器，光收发器，薄膜磁头等，其通过 多个过程。 缺陷原因的估计是通过选择要分析的晶片数量，读取测试数据，读取制造线数据，通过晶片对机器代码的计数频率，通过机器代码或频率分组测试数据来实现的，比较组之间的测试数据分布，通过 机器代码，并比较机器代码之间的结果。

    Method for optimizing observed image classification criterion and image classification apparatus
    10.
    发明授权
    Method for optimizing observed image classification criterion and image classification apparatus 有权
    优化观察图像分类标准和图像分类装置的方法

    公开(公告)号：US09020237B2

    公开(公告)日：2015-04-28

    申请号：US13702674

    申请日：2011-05-13

    申请人： Takehiro Hirai ,  Kozo Miyake ,  Junko Konishi

    发明人： Takehiro Hirai ,  Kozo Miyake ,  Junko Konishi

    IPC分类号： G06K9/00 ,  G06T7/00

    CPC分类号： G06T7/0004 ,  G06T2200/24 ,  G06T2207/10061 ,  G06T2207/30148

    摘要： A first object is to use both ADC (automatic defect classification) and MDC (manual defect classification) and reduce the amount of MDC operation. A second object is to prevent a DOI (defect of interest) from being missed.The first object is achieved by displaying judgment information on a screen. The judgment information is necessary when part of the classification is performed by ADC and part of the classification is performed by MDC and used to judge which classification is used, ADC or MDC. In the display operation, ADC classification results and MDC classification results are also displayed in the form of matrix. Further, a missed DOI rate is calculated for each classification threshold used in the defect classification and displayed on the screen.

    摘要翻译： 第一个目的是使用ADC（自动缺陷分类）和MDC（手动缺陷分类），并减少MDC操作的数量。 第二个目的是防止DOI（感兴趣的缺陷）被遗漏。 通过在屏幕上显示判断信息来实现第一个目的。 当部分分类由ADC执行时，判断信息是必需的，部分分类由MDC执行，用于判断使用哪种分类，ADC或MDC。 在显示操作中，ADC分类结果和MDC分类结果也以矩阵的形式显示。 此外，针对在缺陷分类中使用并显示在屏幕上的每个分类阈值计算错失的DOI率。