Abstract:
A two-part, thermally curable epoxy composition comprising an epoxy resin; a curing agent prepared from a substituted pentafluoroantimonic acid and a substituted benzene having an amino substituent and an electron-withdrawing substituent on the benzene ring; a polyol; and a toughening agent. The compositions exhibit desirable green strength and pot life.
Abstract:
Heat stable foams in which the cellular material is composed of the cured reaction product of polyisocyanate and solvent-soluble phenolic resin having benzylic ether linkage.
Abstract:
A method for adhering surfaces together using fast curing epoxy resin compositions is provided. The method includes the steps of mixing together (a) a curable glycidyl ether epoxide group-containing compound, (b) an amino-terminated aliphatic polyether curing agent, (c) a polymeric toughening agent having both a rubbery phase and a thermoplastic phase or being capable of forming, with the epoxide group-containing material, both a rubbery phase and a thermoset phase on curing, and (d) a metal salt catalyst capble of providing an exotherm of at least 20.degree. C.; applying the resulting mixture to a portion of at least one surface; contacting the surface having the mixture applied thereto to a second surface in bonding relationship with the mixture disposed between the surfaces; and curing the mixture.
Abstract:
Two-part polymerizable compositions are described which contain (a) organic material having epoxide functionality, (b) organic material having hydroxyl functionality, and (c) a catalyst comprising highly fluorinated aliphatic sulfonyl protonic acid or a compound capable of liberating such acid. The compositions polymerize essentially completely at room temperature (or at slightly elevated temperatures). The polymerized compositions have desirable dielectric properties and are therefore especially useful for potting electrical components.
Abstract:
A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.
Abstract:
Storage-stable, thermally-curable, one-part epoxy resin compositions comprising a curable epoxide resin; a curative amount of an aliphatic or non-aromatic cyclic polyol having about 2 to 18 carbon atoms, at least two hydroxy groups of said polyol being primary or secondary, and said polyol being free of strong acid groups, and free of electron-withdrawing substituents and large groups which cause steric hindrance in the .alpha.-position in relation to the carbon atoms attached to the methylol groups of the polyol; and a catalytic amount of an imidazole compound.
Abstract:
Disclosed is a thermally-curable, one-part epoxy adhesive composition comprising: (1) a glycidyl ether epoxide having a048477475 n epoxy functionality grater than one and a molecular weight between about 150 and 10,000; (2) a catalyst comprising (i) an acid of the formula H.sup.+ SbF.sub.5 X.sup.- wherein X is halogen, hydroxy, or --OR where --OR is the residue of an aliphatic or aromatic alcohol having a molecular weight less than about 10,000 and (ii) N,N-diethyl-o-toluidine; (3) an aliphatic or non-aromatic cyclic polyol having about 2 to 18 carbon atoms, at least two hydroxy groups of which are primary or secondary, and being free of electron-withdrawing substituents, amine substituents, or large substituents that cause steric hindrance in the .alpha.-position in relation to the carbon attached to the methylol group of the polyol; and (4) a toughening agent that does not react with the epoxide during curing and has an epoxide compatible component and an epoxide incompatible component.
Abstract:
Storage-stable, thermally-curable, one-part epoxy resin compositions comprising a curable epoxide resin; a curative amount of an aliphatic or non-aromatic cyclic polyol having about 2 to 18 carbon atoms, at least two hydroxy groups of said polyol being primary or secondary, and said polyol being free of strong acid groups, and free of electron-withdrawing substituents and large groups which cause steric hindrance in the .alpha.-position in relation to the carbon atoms attached to the methylol groups of the polyol; and a catalytic amount of an imidazole compound.
Abstract:
An epoxy resin composition is provided. This composition contains (a) a curable glycidyl ether epoxide group-containing material, (b) an amino- terminated aliphatic polyether curing agent, (c) a polymeric toughening agent having both a rubbery phase and a thermoplastic phase or being capable of forming, with the epoxide group-containing material, both a rubbery phase and a thermoset phase on curing, and (d) a metal salt catalyst capable of providing an exotherm of at least 20.degree. C.
Abstract:
An adhesive composition comprising an adhesive base and accelerator portion, the adhesive base comprising (a) a polymerizable monomer selected from the group consisting of unsubstituted alpha-cyanoacrylates and substituted alpha-cyanoacrylates; and (b) an effective amount of stabilizer; and the accelerator portion comprising a weakly acidic or weakly basic ionic accelerator compound comprising a cation M and an anion A, the pKa relating to cation M in the equilibrium defined byM(H.sub.2 O)+.revreaction.MOH+H.sup.+being at least about 10, the pKa relating to anion A in the equilibrium defined byHA.revreaction.A-+H.sup.+being less than or equal to about 0, and the nucleophilicity constant of anion A being less than about 2 when cation M is an onium cation comprising more than 8 carbons, the nucleophilicity constant being determined relative to methyl iodide; the adhesive composition being further characterized in that it exhibits a set time of less than 1/3 that of the adhesive base alone and provides a bond which exhibits an overlap shear value of at least about 400 pounds per square inch. These adhesive compositions exhibit suitable cure rates when employed on wooden substrates and result in strong bonds which age well in the presence of heat and moisture. Methods of bonding wooden substrates using weakly acidic or weakly basic ionic accelerator compounds are also described herein.