Abstract:
The present invention provides systems and methods for performing frequency margin testing of a computer system, such as a server. A system of the invention can include a controller, e.g., a BMC, internal to the computer system and a digital frequency synthesizer that can communicate with the controller and can apply clock frequency to marginable components of the computer system. In response to commands from the controller, the synthesizer generates one or more test frequencies that are applied to one or more of the marginable components. The response of the system to each of the test frequencies is then monitored.
Abstract:
An inter-integrated circuit port for providing increased security. An electrical connector for communicative coupling to an inter-integrated circuit bus is provided. A controller coupled to the electrical connector operates to control data communication through the electrical connector based on control information. A mask coupled to the controller provides the control information to the controller.
Abstract:
A converter assembly comprises a backplane interface to a backplane compliant with a first open architecture modular computing system standard, a component interface capable of coupling to a component compliant with a second open architecture modular computing system standard, and a control element. The control element is coupled between the backplane interface and the component interface and is capable of programmably routing connection lines and signals between the component interface and the backplane interface.
Abstract:
A method of transmitting data through an I2C router from a source port to a destination port, the method comprising: receiving data in a first I2C source port buffer of the I2C router; capturing the I2C destination port before the first I2C source port buffer has overflowed; and transmitting the data from the first I2C source port buffer to the I2C destination port while restricting transmission from the second I2C source port buffer to the I2C destination port.
Abstract:
A component for insertion into a hole in a multiple-layer substrate enables impedance matching of the substrate. The component comprises a conductive ground core arranged to extend through multiple-layers of the substrate when the component is inserted, a dielectric layer laterally encasing the conductive ground core, and a signal conductor layer coupled lateral to the dielectric layer.