Semiconductor structure and method for improving its ability to withstand electrostatic discharge (ESD) and overloads
    12.
    发明授权
    Semiconductor structure and method for improving its ability to withstand electrostatic discharge (ESD) and overloads 有权
    用于提高其耐受静电放电(ESD)和过载能力的半导体结构和方法

    公开(公告)号:US06888226B2

    公开(公告)日:2005-05-03

    申请号:US10479267

    申请日:2002-05-24

    摘要: A semiconductor structure includes a base layer of a first conductivity type, a first layer of the first conductivity type arranged on the base layer and having a dopant concentration that is lower than a dopant concentration of the base layer, and a second layer of a second conductivity type being operative with the first layer in order to form a transition between the first conductivity type and the second conductivity type. A course of a dopant profile at the transition between the base layer and the first layer is set such that in an ESD case a space charge region shifted to the transition between the base layer and the first layer reaches into the base layer.

    摘要翻译: 半导体结构包括第一导电类型的基底层,布置在基底层上并且具有低于基底层的掺杂剂浓度的掺杂剂浓度的第一导电类型的第一层和第二导电类型的第二层 导电类型与第一层一起工作,以形成第一导电类型和第二导电类型之间的转变。 在基底层和第一层之间的过渡处的掺杂剂分布的过程被设置为使得在ESD情况下移动到基底层和第一层之间的转变的空间电荷区域到达基底层。