Server blade chassis with airflow bypass damper engaging upon blade removal
    11.
    发明授权
    Server blade chassis with airflow bypass damper engaging upon blade removal 有权
    具有气流旁路阻尼器的服务器刀片机箱,与刀片拆卸相配合

    公开(公告)号:US06771499B2

    公开(公告)日:2004-08-03

    申请号:US10306302

    申请日:2002-11-27

    IPC分类号: G06F120

    摘要: A server blade system includes a plurality of slots for receiving server blades. The system includes an air moving device to move air through each of the server blades installed in the system. When one of the server blades is removed, a bypass damper rotates into the empty slot to obstruct the flow of air through the slot. The bypass damper is pivotally mounted within each slot and includes a torsion spring to move the damper into the obstruction position. Two hinge pin mounts, which are “U” shaped in cross section, provide a snap fit for two hinge pins positioned at one end of the bypass damper. A spring mounting pin is positioned between the two hinge pins and a torsion spring is mounted over the spring mounting pin.

    摘要翻译: 服务器刀片系统包括用于接收服务器刀片的多个槽。 该系统包括空气移动装置,以将空气移动通过安装在系统中的每个服务器刀片。 当其中一个服务器刀片被卸下时,旁路阻尼器旋转到空槽中以阻止空气流过该槽。 旁通阻尼器枢转地安装在每个槽内,并且包括扭转弹簧以将阻尼器移动到阻塞位置。 横截面为“U”形的两个铰链销安装件为位于旁路阻尼器一端的两个铰链销提供卡扣配合。 弹簧安装销位于两个铰链销之间,扭簧安装在弹簧安装销上。

    Invertible back flow damper for an air moving device
    12.
    发明授权
    Invertible back flow damper for an air moving device 有权
    用于空气移动装置的可逆逆流阻尼器

    公开(公告)号:US06688965B1

    公开(公告)日:2004-02-10

    申请号:US10306371

    申请日:2002-11-27

    IPC分类号: H05K500

    CPC分类号: H05K7/20181 H05K7/20718

    摘要: An air moving system such as a fan or blower system includes a back flow damper that functions in two orientations; non-inverted and inverted. First and second “end” baffles are pivotally attached at opposite ends of the damper, and three “middle” baffles are pivotally attached between the two end baffles. When the air moving system fails in the non-inverted orientation, the first end baffle and the three middle baffles are gravity operated to close off the air outlet to prevent the back flow of air, and the second end baffle pivots away from the outlet. When the air moving device fails in the inverted orientation, the second end baffle and the three middle baffles operate to close off the air outlet, and the first end baffle pivots away from the outlet. The three middle baffles are pivotally coupled to a connecting rod, which prevents the inadvertent jamming of baffles.

    摘要翻译: 诸如风扇或鼓风机系统的空气移动系统包括以两个方向起作用的回流阻尼器; 非反转和倒置。 第一和第二“端部”挡板枢转地附接在阻尼器的相对端,并且三个“中间”挡板枢转地附接在两个端部挡板之间。 当空气移动系统以非倒置方向故障时,第一端挡板和三个中间挡板重力操作,以关闭出风口,以防止空气回流,第二端挡板从出口枢转。 当空气移动装置以倒置方向故障时,第二端挡板和三个中间挡板操作以关闭空气出口,并且第一端挡板从出口枢转。 三个中间挡板可枢转地连接到连杆上,防止挡板的意外堵塞。

    Air re-cool for electronic equipment
    13.
    发明授权
    Air re-cool for electronic equipment 有权
    空气再冷却电子设备

    公开(公告)号:US07621134B2

    公开(公告)日:2009-11-24

    申请号:US11530284

    申请日:2006-09-08

    IPC分类号: F25B21/02

    摘要: A method for selectively cooling one or more heat-generating electronic components in an enclosure. Air is passed through an enclosure that houses one or more heat-generating components. Heated air is separated into at least first and second parallel airstreams within the enclosure. The first airstream is passed through a first heat exchanger in thermal contact with a first side of a thermoelectric cooling module. The second airstream is passed through a second heat exchanger in thermal contact with a second side of the thermoelectric cooling module. A voltage is applied to the thermoelectric cooling module to cool the first side and heat the second side of the thermoelectric cooling module. A temperature at a location in the enclosure in sensed and the voltage applied to the thermoelectric cooling module is varied in response to the sensed temperature.

    摘要翻译: 一种用于选择性地冷却外壳中的一个或多个发热电子部件的方法。 空气通过容纳一个或多个发热部件的外壳。 加热空气在外壳内分成至少第一和第二平行气流。 第一气流通过与热电冷却模块的第一侧热接触的第一热交换器。 第二气流通过与热电冷却模块的第二侧热接触的第二热交换器。 电压被施加到热电冷却模块以冷却第一侧并加热热电冷却模块的第二侧。 感测到的外壳中的位置处的温度和施加到热电冷却模块的电压响应于感测到的温度而变化。

    Hard Disk Drive Carrier Latch Apparatus
    14.
    发明申请
    Hard Disk Drive Carrier Latch Apparatus 有权
    硬盘驱动器载体锁存装置

    公开(公告)号:US20090279248A1

    公开(公告)日:2009-11-12

    申请号:US12119292

    申请日:2008-05-12

    IPC分类号: G06F1/16 B23P11/00

    摘要: A hard disk drive carrier having a latch apparatus to facilitate leveraged insertion of a hard disk drive into a receiving drive bay to an interfaced position, securing of the hard disk drive carrier in the drive bay when the hard disk drive secured to the carrier interfaces with a host computer, leveraged dislodgement of the hard disk drive from its interfaced position for removal of the hard disk drive from the drive bay, and proper positioning of the latch apparatus upon insertion of the hard disk drive carrier to ensure proper engagement of the latch apparatus with the drive bay for leveraged insertion and removal.

    摘要翻译: 一种具有锁定装置的硬盘驱动器托架,用于便于将硬盘驱动器有利地插入到接收驱动器托架到接口位置,当硬盘驱动器托架固定到托架上时将硬盘驱动器托架固定在驱动器托架中, 主机计算机,从其接口位置驱动硬盘驱动器从驱动器托架移除硬盘驱动器,以及在插入硬盘驱动器托架时适当地定位闩锁装置,以确保闩锁装置的正确接合 驱动器托架用于杠杆式插入和拆卸。

    AIR RE-COOL FOR ELECTRONIC EQUIPMENT
    15.
    发明申请
    AIR RE-COOL FOR ELECTRONIC EQUIPMENT 有权
    电子设备的空气冷却器

    公开(公告)号:US20080271464A1

    公开(公告)日:2008-11-06

    申请号:US12173351

    申请日:2008-07-15

    IPC分类号: F25B21/02

    摘要: Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.

    摘要翻译: 实施例包括用于选择性地冷却外壳中的发热电子部件的系统和方法。 根据一个实施例,外壳容纳多个发热电子部件。 空气进入前部的外壳,并在后部排空。 在通过一个或多个上游部件之后,空气在外壳内至少分散到第一和第二气流中。 第一气流由具有热电冷却模块的冷却系统再次冷却。 热电冷却模块被构造成使得第一侧被冷却,并且第二侧被响应于所施加的电压而被加热。 电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。

    High speed mezzanine connector
    16.
    发明授权
    High speed mezzanine connector 有权
    高速夹层连接器

    公开(公告)号:US07390194B1

    公开(公告)日:2008-06-24

    申请号:US11856436

    申请日:2007-09-17

    IPC分类号: H01R13/02

    摘要: A reduced insertion force mezzanine connector is used to couple first and second circuit boards. In one embodiment a connector frame has a first end disposed against the first circuit board and defining a first wall, and an opposing second end disposed against the second circuit board and defining a second wall generally parallel with the first wall. A plurality of wafers are disposed. Each wafer has a first edge in sliding contact with the first wall and an opposing second edge in sliding contact with the second wall. A plurality of electrically conducting pathways extend along each wafer from the first edge to the second edge. A wafer guide structure defines a plurality of wafer-support aisles on the first and second walls for receiving the edges of the wafers to constrain the wafers with a fixed spacing and generally parallel alignment. A plurality of terminals are biased to protrude laterally into each wafer support aisle, and are spaced along the wafer support aisle such that each wafer is movable within the respective wafer support aisle between a first position, wherein each electrically conducting pathway is disposed between adjacent terminals, to a second position, wherein each electrically conducting pathway is in electrical contact with a terminal on the first wall and an associated terminal on the second wall.

    摘要翻译: 减少的插入力夹层连接器用于耦合第一和第二电路板。 在一个实施例中,连接器框架具有抵靠第一电路板设置并限定第一壁的第一端,以及抵靠第二电路板设置的相对的第二端,并限定大致平行于第一壁的第二壁。 设置多个晶片。 每个晶片具有与第一壁滑动接触的第一边缘和与第二壁滑动接触的相对的第二边缘。 多个导电通路沿着每个晶片从第一边缘延伸到第二边缘。 晶片引导结构在第一和第二壁上限定多个晶片支撑通道,用于接收晶片的边缘以以固定间隔和大致平行对准来约束晶片。 多个端子被偏置以横向突出到每个晶片支撑通道中,并且沿着晶片支撑通道间隔开,使得每个晶片可在相应的晶片支撑通道之间在第一位置之间移动,其中每个导电通路设置在相邻端子之间 到第二位置,其中每个导电路径与第一壁上的端子和第二壁上的相关联的端子电接触。

    System and method for installing and retaining I/O connector without tools
    17.
    发明授权
    System and method for installing and retaining I/O connector without tools 失效
    没有工具安装和保留I / O连接器的系统和方法

    公开(公告)号:US07287917B2

    公开(公告)日:2007-10-30

    申请号:US11320064

    申请日:2005-12-28

    IPC分类号: G02B6/36 H04B10/00

    摘要: A system and method for installing and retaining an input/output connector without tools is presented. A user removes a module from a computer system in order to add or remove a transceiver. The module includes a housing and a front bezel, whereby a bezel latch attaches the front bezel to the housing. The user depresses the bezel latch to remove the front bezel from the housing. As a result, a retention beam is exposed on the housing that secures transceivers to a circuit board. The user unlatches the retention beam, inserts a transceiver onto a mounting area, and latches the retention beam. The retention beam applies pressure to the transceiver, which results in a coupling of the transceiver to a circuit board included in the housing. In turn, the user attaches the front bezel to the housing via the bezel latch and reinserts the module into the computer system.

    摘要翻译: 提出了一种没有工具来安装和保留输入/输出连接器的系统和方法。 用户从计算机系统中移除模块,以便添加或删除收发器。 模块包括壳体和前挡板,由此挡板闩将前挡板连接到壳体。 用户按下挡板闩锁以从外壳中卸下前挡板。 结果,保持梁暴露在壳体上,从而将收发器固定到电路板上。 使用者松开保持光束,将收发器插入安装区域,并锁定保持光束。 保持光束对收发器施加压力,这导致收发器与壳体中包括的电路板的耦合。 反过来,用户通过挡板闩将前挡板连接到外壳,并将模块重新插入计算机系统。

    System, method, and apparatus for providing a thermal bypass in electronic equipment
    18.
    发明授权
    System, method, and apparatus for providing a thermal bypass in electronic equipment 有权
    用于在电子设备中提供热旁路的系统,方法和装置

    公开(公告)号:US07134288B2

    公开(公告)日:2006-11-14

    申请号:US10842284

    申请日:2004-05-10

    IPC分类号: F25B21/02

    摘要: A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some heat is removed from the airflow by passing through the first heat exchanger before circulating around downstream subsystems. The first heat exchanger contacts the cold side of a TEC module, to reduce the temperature of that airflow. The air then enters the network switch module or other subsystem where it is further heated. Thereafter, the second heat exchanger ‘bypasses’ those components by reinserting the upstream heat back into the downstream airflow. The second heat exchanger contacts the hot side of the TEC module. The mixture of all heated air is then expelled from the system enclosure.

    摘要翻译: 系统机箱使用两个热交换器和热电冷却模块来管理系统内的热量。 气流进入系统并由服务器刀片加热。 气流的一部分分流并移动到系统外壳的各个部分。 在下游子系统周围循环之前,通过第一热交换器从气流中除去一些热量。 第一个热交换器接触TEC模块的冷端,以降低气流的温度。 空气然后进入网络交换机模块或进一步加热的其他子系统。 此后,第二热交换器通过将上游热量重新插入下游气流中来绕过这些部件。 第二个热交换器接触TEC模块的热侧。 然后将所有加热空气的混合物从系统外壳排出。