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公开(公告)号：US06889908B2
公开(公告)日：2005-05-10
申请号：US10610303
申请日：2003-06-30
CPC分类号： G06F11/3006 , F24F11/30 , F24F11/32 , F24F11/62 , G05B23/0235 , G06F1/206 , G06F11/3051 , G06F11/3058 , H05K7/20727 , H05K7/20836
摘要： Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependant upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify and upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.
摘要翻译： 公开了用于热分析的方法，系统和介质。 本发明的实施例接收与系统的元件相关联的温度。 接收的温度取决于元件的气流和加热模式。 检测到接收到的温度和预期温度之间的差异。 然后确定与热问题相关联的潜在气流和加热模式，潜在气流和加热模式与接收的温度基本一致，以将热问题的根本原因识别为差异的可能来源。 更具体地，实施例从系统的外壳内的温度传感器收集温度读数; 识别和向上的温度梯度或温度超过阈值温度; 并选择与热问题的根本原因相关联的故障情景，其类似于所收集的温度读数描述的热问题。
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公开(公告)号：US07621134B2
公开(公告)日：2009-11-24
申请号：US11530284
申请日：2006-09-08
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： A method for selectively cooling one or more heat-generating electronic components in an enclosure. Air is passed through an enclosure that houses one or more heat-generating components. Heated air is separated into at least first and second parallel airstreams within the enclosure. The first airstream is passed through a first heat exchanger in thermal contact with a first side of a thermoelectric cooling module. The second airstream is passed through a second heat exchanger in thermal contact with a second side of the thermoelectric cooling module. A voltage is applied to the thermoelectric cooling module to cool the first side and heat the second side of the thermoelectric cooling module. A temperature at a location in the enclosure in sensed and the voltage applied to the thermoelectric cooling module is varied in response to the sensed temperature.
摘要翻译： 一种用于选择性地冷却外壳中的一个或多个发热电子部件的方法。 空气通过容纳一个或多个发热部件的外壳。 加热空气在外壳内分成至少第一和第二平行气流。 第一气流通过与热电冷却模块的第一侧热接触的第一热交换器。 第二气流通过与热电冷却模块的第二侧热接触的第二热交换器。 电压被施加到热电冷却模块以冷却第一侧并加热热电冷却模块的第二侧。 感测到的外壳中的位置处的温度和施加到热电冷却模块的电压响应于感测到的温度而变化。
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公开(公告)号：US20080271464A1
公开(公告)日：2008-11-06
申请号：US12173351
申请日：2008-07-15
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要翻译： 实施例包括用于选择性地冷却外壳中的发热电子部件的系统和方法。 根据一个实施例，外壳容纳多个发热电子部件。 空气进入前部的外壳，并在后部排空。 在通过一个或多个上游部件之后，空气在外壳内至少分散到第一和第二气流中。 第一气流由具有热电冷却模块的冷却系统再次冷却。 热电冷却模块被构造成使得第一侧被冷却，并且第二侧被响应于所施加的电压而被加热。 电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。
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4.发明授权System, method, and apparatus for providing a thermal bypass in electronic equipment 有权用于在电子设备中提供热旁路的系统，方法和装置公开(公告)号：US07134288B2
公开(公告)日：2006-11-14
申请号：US10842284
申请日：2004-05-10
IPC分类号： F25B21/02
CPC分类号： H05K7/20 , F25B21/02 , F25B2321/0251
摘要： A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some heat is removed from the airflow by passing through the first heat exchanger before circulating around downstream subsystems. The first heat exchanger contacts the cold side of a TEC module, to reduce the temperature of that airflow. The air then enters the network switch module or other subsystem where it is further heated. Thereafter, the second heat exchanger ‘bypasses’ those components by reinserting the upstream heat back into the downstream airflow. The second heat exchanger contacts the hot side of the TEC module. The mixture of all heated air is then expelled from the system enclosure.
摘要翻译： 系统机箱使用两个热交换器和热电冷却模块来管理系统内的热量。 气流进入系统并由服务器刀片加热。 气流的一部分分流并移动到系统外壳的各个部分。 在下游子系统周围循环之前，通过第一热交换器从气流中除去一些热量。 第一个热交换器接触TEC模块的冷端，以降低气流的温度。 空气然后进入网络交换机模块或进一步加热的其他子系统。 此后，第二热交换器通过将上游热量重新插入下游气流中来绕过这些部件。 第二个热交换器接触TEC模块的热侧。 然后将所有加热空气的混合物从系统外壳排出。
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公开(公告)号：US07735326B2
公开(公告)日：2010-06-15
申请号：US12173351
申请日：2008-07-15
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要翻译： 实施例包括用于选择性地冷却外壳中的发热电子部件的系统和方法。 根据一个实施例，外壳容纳多个发热电子部件。 空气进入前部的外壳，并在后部排空。 在通过一个或多个上游部件之后，空气在外壳内至少分散到第一和第二气流中。 第一气流由具有热电冷却模块的冷却系统再次冷却。 热电冷却模块被构造成使得第一侧被冷却，并且第二侧被响应于所施加的电压而被加热。 电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。
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公开(公告)号：US20080060363A1
公开(公告)日：2008-03-13
申请号：US11530284
申请日：2006-09-08
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： Systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要翻译： 用于选择性地冷却外壳中的发热电子部件的系统和方法。 根据一个实施例，外壳容纳多个发热电子部件。 空气进入前部的外壳，并在后部排空。 在通过一个或多个上游部件之后，空气在外壳内至少分散到第一和第二气流中。 第一气流由具有热电冷却模块的冷却系统再次冷却。 热电冷却模块被构造成使得第一侧被冷却，并且第二侧被响应于所施加的电压而被加热。 电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。
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公开(公告)号：US08140195B2
公开(公告)日：2012-03-20
申请号：US12130443
申请日：2008-05-30
CPC分类号： G06F1/206 , H05K7/20836 , Y02D10/16
摘要： A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.
摘要翻译： 风扇控制器使风扇组件以可变气流速度使空气流过计算机系统以冷却计算机系统。 检测到到计算机系统的环境空气温度，并且控制器在具有上限的环境温度范围内改变作为环境温度的函数的气流速率。 响应于来自用户或软件对象的电子输入，可以从风扇速度控制算法使用的定义的环境温度范围的上限选择性地减小默认值。 相应地，控制器将空气流量限制为对应于减小的上限的减小的值。 减少环境温度上限导致的绞合功率的减少可能被重新分配，例如数据中心中的其他机架。
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公开(公告)号：US20090296342A1
公开(公告)日：2009-12-03
申请号：US12130443
申请日：2008-05-30
IPC分类号： G06F1/20
CPC分类号： G06F1/206 , H05K7/20836 , Y02D10/16
摘要： A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.
摘要翻译： 风扇控制器使风扇组件以可变气流速度使空气流过计算机系统以冷却计算机系统。 检测到到计算机系统的环境空气温度，并且控制器在具有上限的环境温度范围内改变作为环境温度的函数的气流速率。 响应于来自用户或软件对象的电子输入，可以从风扇速度控制算法使用的定义的环境温度范围的上限选择性地减小默认值。 相应地，控制器将空气流量限制为对应于减小的上限的减小的值。 减少环境温度上限导致的绞合功率的减少可能被重新分配，例如数据中心中的其他机架。
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9.发明授权公开(公告)号：US07933739B2
公开(公告)日：2011-04-26
申请号：US12047969
申请日：2008-03-13
IPC分类号： G06F15/00
摘要： Systems, methods, and software for analyzing the layout of computer equipment racks in a datacenter. One embodiment involves obtaining the position relative to the computer room of each of a plurality of temperature sensors distributed among a plurality of computer components mounted between opposing intake and exhaust ends of each computer equipment rack. The layout of the computer equipment racks is automatically determined from the positions of the temperature sensors, and a representation of the layout of the computer equipment racks is electronically stored or displayed. The actual layout is compared to target layout parameters to score the layout.
摘要翻译： 用于分析数据中心中计算机设备机架布局的系统，方法和软件。 一个实施例涉及获得分布在安装在每个计算机设备机架的相对的进气和排气端之间的多个计算机部件之间的多个温度传感器中的每一个的计算机室的位置。 从温度传感器的位置自动确定计算机设备机架的布局，并且电子地存储或显示计算机设备机架的布局的表示。 将实际布局与目标布局参数进行比较以对布局进行评分。
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公开(公告)号：US20080263668A1
公开(公告)日：2008-10-23
申请号：US12168954
申请日：2008-07-08
IPC分类号： G06F21/00
CPC分类号： H04L63/145 , G06F21/554
摘要： A system in which a networked device automatically evaluates hacker attack notification information and, based thereon, selects and executes responses to the attack. The notification may include information such as the address of the infected system, identification of the specific worm, and a list of vulnerable applications and operating systems. The evaluation is based on factors including criticality and vulnerability of applications running on the system and connectivity of the device. A variety of automatic responses can be selected, including notification of network administration, shutdown of the device or services running on the device, updating and activation of anti-virus software, and selective handling of data sent from the address of the suspect network device. The selection of responses can occur automatically based on rules input during setup or by intervention of network administration.
摘要翻译： 网络设备自动评估黑客攻击通知信息的系统，并且基于此，选择并执行对攻击的响应。 该通知可以包括诸如受感染系统的地址，特定蠕虫的识别以及易受攻击的应用和操作系统的列表之类的信息。 该评估基于包括系统上运行的应用程序的关键性和漏洞以及设备连接性的因素。 可以选择各种自动响应，包括网络管理的通知，设备关闭或设备上运行的服务，反病毒软件的更新和激活以及从可疑网络设备的地址发送的数据的选择性处理。 响应的选择可以根据设置过程中输入的规则或网络管理干预自动进行。
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