摘要:
A hard disk drive carrier having a latch apparatus to facilitate leveraged insertion of a hard disk drive into a receiving drive bay to an interfaced position, securing of the hard disk drive carrier in the drive bay when the hard disk drive secured to the carrier interfaces with a host computer, leveraged dislodgement of the hard disk drive from its interfaced position for removal of the hard disk drive from the drive bay, and proper positioning of the latch apparatus upon insertion of the hard disk drive carrier to ensure proper engagement of the latch apparatus with the drive bay for leveraged insertion and removal.
摘要:
Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要:
A reduced insertion force mezzanine connector is used to couple first and second circuit boards. In one embodiment a connector frame has a first end disposed against the first circuit board and defining a first wall, and an opposing second end disposed against the second circuit board and defining a second wall generally parallel with the first wall. A plurality of wafers are disposed. Each wafer has a first edge in sliding contact with the first wall and an opposing second edge in sliding contact with the second wall. A plurality of electrically conducting pathways extend along each wafer from the first edge to the second edge. A wafer guide structure defines a plurality of wafer-support aisles on the first and second walls for receiving the edges of the wafers to constrain the wafers with a fixed spacing and generally parallel alignment. A plurality of terminals are biased to protrude laterally into each wafer support aisle, and are spaced along the wafer support aisle such that each wafer is movable within the respective wafer support aisle between a first position, wherein each electrically conducting pathway is disposed between adjacent terminals, to a second position, wherein each electrically conducting pathway is in electrical contact with a terminal on the first wall and an associated terminal on the second wall.
摘要:
A computer system includes a housing that is divided into three compartments; two fan compartments, each containing a fan, and a third compartment containing heat generating electronic components. The air discharged from the fans flows through outlets in the fan compartments and into the third compartment to cool the electronic components. A single baffle is rotatably coupled between the two fan compartments using a vertically oriented hinge. When one of the fans fails, the air pressure from the working fan rotates the baffle until it covers the outlet of the fan compartment containing the failed fan. This enhances the flow of air from the working fan into the third compartment, and restricts the reverse flow of air through the dead fan compartment. When both fans are functioning, air pressure from both fans moves the baffle to a "midway" or "neutral" position, such that the air from both fans flows into the third compartment.
摘要:
An apparatus comprising a disk drive assembly and a disk drive cage for selectively receiving the disk drive assembly. The disk drive assembly includes first and second side rails secured to opposing sides of a disk drive, wherein the first side rail includes a distal end having a distally-opening slot configured to receive a rigid structure, such as a bent portion of the cage, fixedly extending from the disk drive cage. The slot in the first side rail enables the disk drive assembly to distally advance to a fully installed position within the disk drive cage. Incompatible disk drive assemblies do not include such a slot and are prevented from reaching the fully installed position. Preferably the distal end of first side rail extends beyond the distal end of the disk drive.
摘要:
A system and method for installing and retaining an input/output connector without tools is presented. A user removes a module from a computer system in order to add or remove a transceiver. The module includes a housing and a front bezel, whereby a bezel latch attaches the front bezel to the housing. The user depresses the bezel latch to remove the front bezel from the housing. As a result, a retention beam is exposed on the housing that secures transceivers to a circuit board. The user unlatches the retention beam, inserts a transceiver onto a mounting area, and latches the retention beam. The retention beam applies pressure to the transceiver, which results in a coupling of the transceiver to a circuit board included in the housing. In turn, the user attaches the front bezel to the housing via the bezel latch and reinserts the module into the computer system.
摘要:
The invention provides an apparatus, system, and method for enabling the installation of an installable device configured with a required component in a receiving device. A component deactivated interlock obstructs the installation of the installable device when not configured with the required component. The invention makes use of an extendable and retractable plunger disposed upon the installable device, a stop barrier disposed upon the receiving device, and an actuator disposed upon the required component. The plunger normally extends beyond the installable device, and upon contacting the stop barrier of the receiving device obstructs the installation. Upon a physical connection of the required component with the installable device, the actuator retracts the plunger, thereby enabling the installation of the installable device.
摘要:
Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependant upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify and upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.
摘要:
The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.