REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY
    11.
    发明申请
    REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY 有权
    反射掩蔽空白用于EUV LITHOGRAPHY

    公开(公告)号:US20100035165A1

    公开(公告)日:2010-02-11

    申请号:US12578648

    申请日:2009-10-14

    IPC分类号: G03F1/00

    摘要: Provision of a reflective mask blank for EUV lithography having an absorber layer which has a low reflectance in the wavelength regions of EUV light and pattern inspection light and whose film composition and film thickness are easily controllable to desired ones.A reflective mask blank for EUV lithography, which comprises a substrate, and a reflective layer to reflect EUV light and an absorber layer to absorb EUV light, formed in this order on the substrate, wherein the absorber layer contains tantalum (Ta), boron (B) and silicon (Si), and in the absorber layer, the content of B is at least 1 at. % and less than 5 at. % and the content of Si is from 1 to 25 at. %, and wherein the absorber layer contains no nitrogen (N) or at most 10 at. % of N.

    摘要翻译: 提供用于EUV光刻的反射掩模板,其具有在EUV光和图案检查光的波长区域中具有低反射率的吸收层,并且其膜组成和膜厚度可以容易地控制到期望的。 一种用于EUV光刻的反射掩模板,其包括衬底,以及反射层,用于反射EUV光和吸收层,以吸收EUV光,该衬底依次形成在衬底上,其中吸收层包含钽(Ta),硼( B)和硅(Si),并且在吸收层中,B的含量至少为1个。 %和小于5在。 %,Si的含量为1〜25at。 %,并且其中所述吸收层不含氮(N)或至多10原子。 %的N.

    REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY AND SUBSTRATE WITH FUNCTIONAL FILM FOR THE SAME
    12.
    发明申请
    REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY AND SUBSTRATE WITH FUNCTIONAL FILM FOR THE SAME 有权
    用于EUV光刻的反射掩膜和具有相同功能膜的基板

    公开(公告)号:US20080318140A1

    公开(公告)日:2008-12-25

    申请号:US12198912

    申请日:2008-08-27

    IPC分类号: G03F1/00

    摘要: To provide an EUV mask blank of which the decrease in the reflectance during EUV exposure is suppressed, and a substrate with a functional film to be used for production of such an EUV mask blank.A substrate with a reflective layer for EUV lithography, comprising a substrate, and a reflective layer for reflecting EUV light and a protective layer for protecting the reflective layer formed in this order on the substrate, wherein the protective layer contains ruthenium (Ru) and at least one element selected from the group consisting of boron (B) and zirconium (Zr); and in the protective layer, the Ru content is from 70 at % to 95 at % and the total content of B and Zr is from 5 at % to 30 at %.

    摘要翻译: 提供抑制EUV曝光期间反射率降低的EUV掩模空白,以及用于制造这种EUV掩模空白的具有功能膜的基板。 具有用于EUV光刻的反射层的衬底,包括衬底和用于反射EUV光的反射层和用于保护在衬底上依次形成的反射层的保护层,其中保护层包含钌(Ru)并且在 选自硼(B)和锆(Zr)的至少一种元素; 并且在保护层中,Ru含量为70原子%至95原子%,B和Zr的总含量为5原子%至30原子%。

    REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY
    14.
    发明申请
    REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY 有权
    反射掩蔽空白用于EUV LITHOGRAPHY

    公开(公告)号:US20090011341A1

    公开(公告)日:2009-01-08

    申请号:US12205967

    申请日:2008-09-08

    IPC分类号: G03F1/00

    摘要: To provide a reflective mask blank for EUV lithography having an absorber layer, which presents a low reflectance to a light in the wavelength ranges of EUV light and pattern inspection light, and which is easily controlled to have desired film composition and film thickness.A reflective mask blank for EUV lithography, comprising a substrate, and a reflective layer for reflecting EUV light and an absorber layer for absorbing EUV light formed in this order on the substrate, wherein the absorber layer contains tantalum (Ta), boron (B), silicon (Si) and nitrogen (N), and in the absorber layer, the B content is at least 1 at % and less than 5 at %, the Si content is from 1 to 25 at %, and the compositional ratio of Ta to N (Ta:N) is from 8:1 to 1:1.

    摘要翻译: 为了提供具有吸收层的EUV光刻用的反射掩模板,其对EUV光和图案检查光的波长范围内的光呈现低反射率,并且易于控制以具有所需的膜组成和膜厚度。 一种用于EUV光刻的反射掩模板,包括基板和用于反射EUV光的反射层和用于吸收在基板上依次形成的EUV光的吸收层,其中吸收层包含钽(Ta),硼(B) ,硅(Si)和氮(N),并且在吸收层中,B含量为至少1原子%且小于5原子%,Si含量为1至25原子%,Ta的组成比 至N(Ta:N)为8:1至1:1。

    REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY AND SUBSTRATE WITH A CONDUCTIVE FILM FOR THE MASK BLANK
    15.
    发明申请
    REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY AND SUBSTRATE WITH A CONDUCTIVE FILM FOR THE MASK BLANK 有权
    用于EUV光刻的反射掩模层和带有导电膜的掩模

    公开(公告)号:US20070160874A1

    公开(公告)日:2007-07-12

    申请号:US11566883

    申请日:2006-12-05

    IPC分类号: B32B9/04

    摘要: To provide a substrate with a conductive film for an EUV mask blank having an increased surface hardness, and a substrate with a reflective multilayer film and an EUV mask blank using such a substrate with a conductive film. A substrate with a conductive film to be used for production of a reflective mask blank for EUV lithography, characterized in that the chief material of the conductive film is at least one member selected from the group consisting of Cr, Ti, Zr, Nb, Ni and V, and the conductive film contains B (boron) at an average concentration of from 1 to 70 at %.

    摘要翻译: 为了提供具有增加表面硬度的EUV掩模坯料用导电膜的基板,以及使用这种具有导电膜的基板的具有反射多层膜的基板和EUV掩模坯料。 一种具有用于生产用于EUV光刻的反射掩模板的导电膜的基板,其特征在于,导电膜的主要材料是选自Cr,Ti,Zr,Nb,Ni中的至少一种 和V,导电膜含有平均浓度为1-70原子%的B(硼)。

    MULTILAYER MIRROR FOR EUV LITHOGRAPHY AND PROCESS FOR ITS PRODUCTION
    16.
    发明申请
    MULTILAYER MIRROR FOR EUV LITHOGRAPHY AND PROCESS FOR ITS PRODUCTION 有权
    用于EUV光刻的多层反射镜及其生产工艺

    公开(公告)号:US20120196208A1

    公开(公告)日:2012-08-02

    申请号:US13443108

    申请日:2012-04-10

    IPC分类号: G03F7/20 G03F1/52

    摘要: Provided are a multilayer mirror for EUVL in which deterioration in reflectivity due to oxidation of a Ru protective layer is prevented, and a process for its production. A multilayer mirror for EUV lithography comprising a substrate, and a reflective layer for reflecting EUV light and a protective layer for protecting the reflective layer, formed in this order on the substrate, wherein the reflective layer is a Mo/Si multilayer reflective film, the protective layer is a Ru layer or a Ru compound layer, and an intermediate layer containing from 0.5 to 25 at % of nitrogen and from 75 to 99.5 at % of Si is formed between the reflective layer and the protective layer.

    摘要翻译: 提供一种用于EUVL的多层反射镜,其中防止了由Ru保护层的氧化引起的反射率的劣化,以及其制备方法。 一种用于EUV光刻的多层反射镜,其包括基板,以及用于反射EUV光的反射层和用于保护反射层的保护层,其依次形成在基板上,其中反射层为Mo / Si多层反射膜, 保护层是Ru层或Ru化合物层,并且在反射层和保护层之间形成含有0.5〜25原子%的氮和75〜99.5原子%的Si的中间层。

    Reflective mask blank for EUV lithography
    17.
    发明授权
    Reflective mask blank for EUV lithography 有权
    EUV光刻用反光罩

    公开(公告)号:US07906259B2

    公开(公告)日:2011-03-15

    申请号:US12205967

    申请日:2008-09-08

    IPC分类号: G03F1/00

    摘要: To provide a reflective mask blank for EUV lithography having an absorber layer, which presents a low reflectance to a light in the wavelength ranges of EUV light and pattern inspection light, and which is easily controlled to have desired film composition and film thickness. A reflective mask blank for EUV lithography, comprising a substrate, and a reflective layer for reflecting EUV light and an absorber layer for absorbing EUV light formed in this order on the substrate, wherein the absorber layer contains tantalum (Ta), boron (B), silicon (Si) and nitrogen (N), and in the absorber layer, the B content is at least 1 at % and less than 5 at %, the Si content is from 1 to 25 at %, and the compositional ratio of Ta to N (Ta:N) is from 8:1 to 1:1.

    摘要翻译: 为了提供具有吸收层的EUV光刻用的反射掩模板,其对EUV光和图案检查光的波长范围内的光呈现低反射率,并且易于控制以具有所需的膜组成和膜厚度。 一种用于EUV光刻的反射掩模板,包括基板和用于反射EUV光的反射层和用于吸收在基板上依次形成的EUV光的吸收层,其中吸收层包含钽(Ta),硼(B) ,硅(Si)和氮(N),并且在吸收层中,B含量为至少1原子%且小于5原子%,Si含量为1至25原子%,Ta的组成比 至N(Ta:N)为8:1至1:1。