公开(公告)号：US20070111481A1

公开(公告)日：2007-05-17

申请号：US11598651

申请日：2006-11-14

申请人： Muneo Tamura ,  Hiromi Ooniwa

发明人： Muneo Tamura ,  Hiromi Ooniwa

IPC分类号： H01L21/00 ,  H01L23/544

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011

摘要： A laser beam is applied to an interior of a wafer through a top surface to form modified areas in a plurality of layers of modified area groups. Intervals of the modified areas in one of the layers of modified area groups differ from intervals of the modified areas in another one of the layers of the modified area groups, which is closer to the top surface of the wafer in comparison to the one of the layers of the modified area groups.

摘要翻译： 通过顶表面将激光束施加到晶片的内部，以形成多个经修改的区域组的改质区域。 修改区域组中的一个层中的修改区域的间隔与修改区域组的另一个层中的修改区域的间隔不同，其更接近晶片的顶部表面，与 修改区域组的层。

公开(公告)号：US20060040472A1

公开(公告)日：2006-02-23

申请号：US11199132

申请日：2005-08-09

申请人： Muneo Tamura ,  Yasuo Souki

发明人： Muneo Tamura ,  Yasuo Souki

IPC分类号： H01L21/78

CPC分类号： H01L21/67092 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68336

摘要： A method of separating a semiconductor substrate having an implementation member attached thereon includes a dividing process for at least the implementation member on the semiconductor substrate along a separation line, a placing process for film member on a same side as the implementation member, a forming process area by irradiating a laser beam from at least one of a first side of the semiconductor substrate having the implementation member and a second side that is an opposite side of the first side of the semiconductor substrate along the separation line with a focusing point of the laser beam aligned with a substance in the semiconductor substrate and severing/removing at least one semiconductor chip at the separation line from the semiconductor substrate.

公开(公告)号：US4374038A

公开(公告)日：1983-02-15

申请号：US232022

申请日：1981-01-11

申请人： Muneo Tamura

发明人： Muneo Tamura

IPC分类号： A63H19/14 ,  C09K3/30

CPC分类号： A63H19/14

摘要： A fuming or smoke-emitting device used on a model steam locomotive of railway model driven by an electric motor. It is therefore required to reduce the fuming device as much as possible and to simulate the smoke exhausted from the actual locomotive in the smoking state. This fuming device comprises a container which has therein Nichrome wire and is provided at its upper portion with perforation for exhausting the fume or smoke. The container is filled with water and oil having non-affinity with each other. When the heater is heated, the water is boiled to thereby stir the oil. Thus, the oil is burnt, and the smoke of fume thus produced is exhausted by the steam. The fuming state by this combustion phenomenon simulated the smoke exhausted from the actual locomotive, because this fume thus exhausted from the locomotive is similar in principle to the utilization of the steam exhausted usually from the normal cylinder.

摘要翻译： PCT No.PCT / JP80 / 00095 Sec。 371日期：1981年1月11日 102（e）日期1981年1月11日PCT提交1980年5月7日PCT公布。 第WO80 / 02514号公报 日期：1980年11月27日。一种用于由电动机驱动的铁路车型模型蒸汽机车上使用的发烟或发烟装置。 因此，需要尽可能地减少发烟装置，并且模拟在吸烟状态下从实际机车排出的烟雾。 这个发烟装置包括一个容器，其上装有镍铬合金线，并在其上部设有用于排出烟或烟的穿孔。 容器充满彼此不亲和的水和油。 当加热器加热时，将水煮沸，从而搅拌油。 因此，油被燃烧，并且由此产生的烟雾被蒸汽排出。 这种燃烧现象的发烟状态模拟了从实际机车排出的烟雾，因为这样从机车中排出的烟气原则上与通常从正常气缸排出的蒸汽的利用相似。

公开(公告)号：US07901967B2

公开(公告)日：2011-03-08

申请号：US11600136

申请日：2006-11-16

申请人： Atsushi Komura ,  Muneo Tamura ,  Kazuhiko Sugiura ,  Hirotsugu Funato ,  Yumi Maruyama ,  Tetsuo Fujii ,  Kenji Kohno

发明人： Atsushi Komura ,  Muneo Tamura ,  Kazuhiko Sugiura ,  Hirotsugu Funato ,  Yumi Maruyama ,  Tetsuo Fujii ,  Kenji Kohno

IPC分类号： H01L21/00

CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78

摘要： A method for dicing a semiconductor substrate includes: forming a reforming layer in the substrate by irradiating a laser beam on the substrate; forming a groove on the substrate along with a cutting line; and applying a force to the substrate in order to cutting the substrate at the reforming layer as a starting point of cutting. The groove has a predetermined depth so that the groove is disposed near the reforming layer, and the force provides a stress at the groove.

摘要翻译： 一种用于切割半导体衬底的方法包括：通过在衬底上照射激光束在衬底中形成重整层; 与切割线一起在基板上形成凹槽; 并向基板施加力以切割重整层处的基板作为切割的起点。 槽具有预定的深度，使得槽设置在重整层附近，并且该力在槽处提供应力。

公开(公告)号：US07838331B2

公开(公告)日：2010-11-23

申请号：US11598654

申请日：2006-11-14

申请人： Atsushi Komura ,  Tetsuo Fujii ,  Muneo Tamura ,  Makoto Asai

发明人： Atsushi Komura ,  Tetsuo Fujii ,  Muneo Tamura ,  Makoto Asai

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  B23K26/009 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3192 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/00

摘要： A device separated from a wafer includes: a chip having a sidewall, which is provided by a dicing surface of the wafer in a case where the device is separated from the wafer; and a protection member disposed on the sidewall of the chip for protecting the chip from being contaminated by a dust from the dicing surface. In the device, the dicing surface of the wafer is covered with the protection member so that the chip is prevented from contaminated with the dust.

摘要翻译： 与晶片分离的器件包括：具有侧壁的芯片，其在器件与晶片分离的情况下由晶片的切割表面提供; 以及设置在芯片的侧壁上的保护构件，用于保护芯片免受来自切割表面的灰尘的污染。 在该装置中，晶片的切割面被保护部件覆盖，从而防止芯片被灰尘污染。

公开(公告)号：US07598118B2

公开(公告)日：2009-10-06

申请号：US11585114

申请日：2006-10-24

申请人： Kazuhiko Sugiura ,  Kenichi Yokoyama ,  Muneo Tamura

发明人： Kazuhiko Sugiura ,  Kenichi Yokoyama ,  Muneo Tamura

IPC分类号： H01L21/00

CPC分类号： B81C1/00269 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802

摘要： A method of manufacturing a semiconductor sensor includes a forming step, a preparing step, a fixing step and a separating step. In the forming step, a plurality of caps made of resin is formed on a supporting substrate through a separable agent. Each of the caps has a cavity therein. In the preparing step, a semiconductor wafer is prepared, on which a plurality of sensor elements are formed. In the fixing step, the caps are fixed to the semiconductor wafer. Each cavity of the caps corresponds to each of the sensor elements. In the separating step, the separable agent and the supporting substrate are separated from the caps so as to leave the caps on the semiconductor wafer.

摘要翻译： 制造半导体传感器的方法包括形成步骤，制备步骤，定影步骤和分离步骤。 在成形步骤中，通过可分离剂在支撑基材上形成多个由树脂制成的盖。 每个盖在其中具有空腔。 在准备步骤中，制备半导体晶片，在其上形成多个传感器元件。 在固定步骤中，盖固定到半导体晶片。 盖的每个腔对应于每个传感器元件。 在分离步骤中，可分离剂和支撑基材与盖分离，以便将半导体晶片上的盖留下。

公开(公告)号：US20070207594A1

公开(公告)日：2007-09-06

申请号：US11710910

申请日：2007-02-27

申请人： Muneo Tamura

发明人： Muneo Tamura

IPC分类号： H01L21/301

CPC分类号： H01L21/67132 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  H01L21/67092 ,  H01L21/78 ,  Y10T225/12

摘要： A method for dicing a wafer including first and second layers is provided. A front surface of the first layer contacts a backside surface of the second layer. The method includes: forming a sealing film on the second layer; cutting the first layer from a backside surface along with a cutting line to form a notch; removing the sealing film; irradiating a laser beam on the front surface of the second layer along with the cutting line to form a reforming region in the second layer by a multi photon absorption effect; and dividing the wafer along with the cutting line from the reforming region as a starting point of dividing.

摘要翻译： 提供了一种用于切割包括第一和第二层的晶片的方法。 第一层的前表面接触第二层的背面。 该方法包括：在第二层上形成密封膜; 与切割线一起从背面切割第一层以形成切口; 去除密封膜; 沿着切割线将激光束照射在第二层的前表面上，以通过多光子吸收效应在第二层中形成重整区域; 并且将切割线与重整区域一起划分为切割起点。

公开(公告)号：US20070117260A1

公开(公告)日：2007-05-24

申请号：US11585114

申请日：2006-10-24

申请人： Kazuhiko Sugiura ,  Kenichi Yokoyama ,  Muneo Tamura

发明人： Kazuhiko Sugiura ,  Kenichi Yokoyama ,  Muneo Tamura

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： B81C1/00269 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802

摘要： A method of manufacturing a semiconductor sensor includes a forming step, a preparing step, a fixing step and a separating step. In the forming step, a plurality of caps made of resin is formed on a supporting substrate through a separable agent. Each of the caps has a cavity therein. In the preparing step, a semiconductor wafer is prepared, on which a plurality of sensor elements are formed. In the fixing step, the caps are fixed to the semiconductor wafer. Each cavity of the caps corresponds to each of the sensor elements. In the separating step, the separable agent and the supporting substrate are separated from the caps so as to leave the caps on the semiconductor wafer.

摘要翻译： 制造半导体传感器的方法包括形成步骤，制备步骤，定影步骤和分离步骤。 在成形步骤中，通过可分离剂在支撑基材上形成多个由树脂制成的盖。 每个盖在其中具有空腔。 在准备步骤中，制备半导体晶片，在其上形成多个传感器元件。 在固定步骤中，盖固定到半导体晶片。 盖的每个腔对应于每个传感器元件。 在分离步骤中，可分离剂和支撑基材与盖分离，以便将半导体晶片上的盖留下。

公开(公告)号：US20070111484A1

公开(公告)日：2007-05-17

申请号：US11600097

申请日：2006-11-16

申请人： Atsushi Komura ,  Muneo Tamura ,  Kazuhiko Sugiura

发明人： Atsushi Komura ,  Muneo Tamura ,  Kazuhiko Sugiura

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336

摘要： A dicing sheet frame, which is used when a semiconductor wafer adhered to a dicing sheet is cut into chips, includes a plurality of frame parts and a connecting device. The plurality of frame parts supports the dicing sheet. The connecting device connects the plurality of frame parts such that the plurality of frame parts has an annular shape.

摘要翻译： 当将粘附到切割片上的半导体晶片切割成芯片时使用的切割片框架包括多个框架部件和连接装置。 多个框架部件支撑切割片。 连接装置连接多个框架部件，使得多个框架部件具有环形形状。

公开(公告)号：US20070111476A1

公开(公告)日：2007-05-17

申请号：US11591496

申请日：2006-11-02

申请人： Kazuhiko Sugiura ,  Kenichi Yokoyama ,  Muneo Tamura ,  Tetsuo Fujii ,  Makoto Asai

发明人： Kazuhiko Sugiura ,  Kenichi Yokoyama ,  Muneo Tamura ,  Tetsuo Fujii ,  Makoto Asai

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/16 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2924/3025

摘要： A separating device for separating a semiconductor substrate includes: a cutting element for cutting the semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate; an adsorbing element for adsorbing a dust on a surface of the semiconductor substrate by using electrostatic force; and a static electricity generating element for generating static electricity and for controlling the static electricity in order to remove the dust from the adsorbing element.

摘要翻译： 用于分离半导体衬底的分离装置包括：用于将半导体衬底与半导体衬底上的切割线一起切割成多个芯片的切割元件; 用于通过使用静电力吸附在所述半导体衬底的表面上的灰尘的吸附元件; 以及用于产生静电并用于控制静电以便从吸附元件去除灰尘的静电发生元件。