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    Camera module
    13.
    发明授权
    Camera module 有权

    公开(公告)号：US11714294B2

    公开(公告)日：2023-08-01

    申请号：US17210942

    申请日：2021-03-24

    Applicant: Namuga, Co., Ltd.

    Inventor： Jin Suk Han ,  Tae Hoon Jung ,  Seung Taek Shin

    IPC: G02B27/64 ,  G02B7/09 ,  G03B5/02 ,  H04N23/55 ,  H04N23/68

    CPC classification number: G02B27/646 ,  G02B7/09 ,  G03B5/02 ,  H04N23/55 ,  H04N23/687

    Abstract: Provided is a camera module which includes a cover, a base connected with the cover, and a lens carrier provided between the cover and the base, the camera module including: an OIS body provided inside the cover; a first ball bearing interposed between the cover and the OIS body; an AF driver provided between the OIS body and the lens carrier; and an OIS driver for moving the OIS body in perpendicular to an optical axis of the lens carrier. Since the first ball bearing is supported while being in direct contact with an inner ceiling of the cover and an upper surface of the OIS body, the overall module thickness may be formed to be thinner than a structure in which the ball bearing is provided below the OIS body.

    CAMERA MODULE
    14.
    发明申请
    CAMERA MODULE 有权

    公开(公告)号：US20220082848A1

    公开(公告)日：2022-03-17

    申请号：US17210942

    申请日：2021-03-24

    Applicant: Namuga, Co., Ltd.

    Inventor： Jin Suk HAN ,  Tae Hoon JUNG ,  Seung Taek SHIN

    IPC: G02B27/64 ,  G02B7/09 ,  H04N5/225 ,  H04N5/232 ,  G03B5/02

    Abstract: Provided is a camera module which includes a cover, a base connected with the cover, and a lens carrier provided between the cover and the base, the camera module including: an OIS body provided inside the cover; a first ball bearing interposed between the cover and the OIS body; an AF driver provided between the OIS body and the lens carrier; and an OIS driver for moving the OIS body in perpendicular to an optical axis of the lens carrier. Since the first ball bearing is supported while being in direct contact with an inner ceiling of the cover and an upper surface of the OIS body, the overall module thickness may be formed to be thinner than a structure in which the ball bearing is provided below the OIS body.

    HERMETICALLY SEALED DISTANCE MEASURING APPARATUS
    16.
    发明申请
    HERMETICALLY SEALED DISTANCE MEASURING APPARATUS 审中-公开

    公开(公告)号：US20200284878A1

    公开(公告)日：2020-09-10

    申请号：US16695277

    申请日：2019-11-26

    Applicant: Namuga, Co., Ltd.

    Inventor： Jun Youb LEE

    IPC: G01S7/481 ,  G02B7/02 ,  G02B5/20 ,  G01S7/497 ,  G01S17/10

    Abstract: A distance measuring apparatus has a substrate supporting, on a first surface thereof, a light source that emits light and a first optical element that decreases the intensity of the emitted light, and a processor on a second surface opposite the first surface. A light receiving element and a second optical element, which is at a higher position than the light receiving element, both receive the emitted light after reflecting from an object. A frame is connected to the substrate and spaces the first optical element and the second optical element a predetermined distance apart from the light source and the light receiving element, and a partition is disposed between the light source and the light receiving element, thereby defining a first cavity housing the light source and a second cavity housing the light receiving element. The processor is electrically connected to the light source and controls the light source.

    Hermetically sealed distance measuring apparatus
    19.
    发明授权
    Hermetically sealed distance measuring apparatus 有权

    公开(公告)号：US11467260B2

    公开(公告)日：2022-10-11

    申请号：US16695277

    申请日：2019-11-26

    Applicant: Namuga, Co., Ltd.

    Inventor： Jun Youb Lee

    IPC: G01S7/481 ,  G02B7/02 ,  G01S17/10 ,  G01S7/497 ,  G02B5/20

    Abstract: A distance measuring apparatus has a substrate supporting, on a first surface thereof, a light source that emits light and a first optical element that decreases the intensity of the emitted light, and a processor on a second surface opposite the first surface. A light receiving element and a second optical element, which is at a higher position than the light receiving element, both receive the emitted light after reflecting from an object. A frame is connected to the substrate and spaces the first optical element and the second optical element a predetermined distance apart from the light source and the light receiving element, and a partition is disposed between the light source and the light receiving element, thereby defining a first cavity housing the light source and a second cavity housing the light receiving element. The processor is electrically connected to the light source and controls the light source.

    HERMETIC SEALED BEAM PROJECTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
    20.
    发明申请
    HERMETIC SEALED BEAM PROJECTOR MODULE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20210318196A1

    公开(公告)日：2021-10-14

    申请号：US17356092

    申请日：2021-06-23

    Applicant: Namuga, Co., Ltd.

    Inventor： Jun Youb LEE ,  Young Gyu KANG ,  Jeong Hwa SEO

    IPC: G01L19/14 ,  H01S5/183 ,  H01S5/06 ,  H01S5/068 ,  H01S5/0222 ,  H01S5/02257

    Abstract: An embodiment provides a beam projector module including: a light source configured to output light; a substrate configured to support the light source; an optical device configured to reduce the light in terms of intensity output to a predetermined space; a frame configured to separate the optical device from the light source by a predetermined distance; an optical substrate configured to attach the optical device thereto and to define a sealed space with the substrate and the frame, the sealed space having internal pressure lower than pressure outside the sealed space; a sensor configured to measure a state of the sealed space; and a processor configured to change an operation mode of the light source depending on a measured value of the sensor.

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