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公开(公告)号:US20240105883A1
公开(公告)日:2024-03-28
申请号:US18235670
申请日:2023-08-18
Inventor: Wolfgang REINERT , Vanessa STENCHLY , Hans-Joachim QUENZER , Dirk KAEHLER
IPC: H01L33/48 , C03B23/035 , C03B25/02 , C03C27/00 , H01L31/0203 , H01L31/18 , H01S5/0222 , H01S5/02234 , H01S5/02257
CPC classification number: H01L33/483 , C03B23/0355 , C03B23/0357 , C03B25/025 , C03C27/00 , H01L31/0203 , H01L31/18 , H01S5/0222 , H01S5/02234 , H01S5/02257 , C03C17/00
Abstract: A method includes the steps of: providing a mold substrate and a cover substrate that are bonded to each other, wherein a surface region of the mold substrate and/or of the cover substrate is structured so as to form an enclosed cavity between the cover substrate and the mold substrate; tempering the cover substrate and the mold substrate so as to decrease the viscosity of the glass material of the cover substrate, and providing an overpressure in the enclosed cavity compared to the surrounding atmosphere so as to cause, on the basis of the decreased viscosity of the glass material of the cover substrate and the overpressure in the enclosed cavity compared to the surrounding atmosphere, bulging of the glass material of the cover substrate starting from the enclosed cavity up to a stop area, spaced apart from the cover substrate, of a stop element so as to acquire a molded cover substrate with a cap element; and removing the stop element and the mold substrate from the molded cover substrate.
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公开(公告)号:US11769986B2
公开(公告)日:2023-09-26
申请号:US17867941
申请日:2022-07-19
Inventor: Bryan Lochman , Wang-Long Zhou , Francisco Villarreal-Saucedo , Bien Chann
IPC: H01S5/02235 , H01S5/40 , H01S5/0222 , H01S5/024 , H01S5/30
CPC classification number: H01S5/02235 , H01S5/0222 , H01S5/02423 , H01S5/4012 , H01S5/4025 , H01S5/3013
Abstract: In various embodiments, the concentration and deposition of siloxane materials within components of laser systems, such as laser resonators, is reduced or minimized utilizing mitigation systems that may also supply gas having low siloxane levels into multiple different components in series or in parallel.
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公开(公告)号:US20220352689A1
公开(公告)日:2022-11-03
申请号:US17867941
申请日:2022-07-19
Inventor: Bryan LOCHMAN , Wang-Long ZHOU , Francisco VILLARREAL-SAUCEDO , Bien CHANN
IPC: H01S5/02235 , H01S5/40 , H01S5/0222 , H01S5/024
Abstract: In various embodiments, the concentration and deposition of siloxane materials within components of laser systems, such as laser resonators, is reduced or minimized utilizing mitigation systems that may also supply gas having low siloxane levels into multiple different components in series or in parallel.
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公开(公告)号:US11410508B2
公开(公告)日:2022-08-09
申请号:US15832037
申请日:2017-12-05
Applicant: LMD Applied Science, LLC
Inventor: Brian L. Olmsted , Jeffrey W. Mock , John A. Kowalczyk, Jr.
IPC: G02B27/30 , G02B5/136 , G02B5/08 , F21V1/00 , F21V7/00 , G08B5/36 , H01S5/00 , H01S5/042 , H01S5/34 , G08B5/00 , H01S5/02255 , H01S5/0222
Abstract: An example beacon system includes a housing, a laser module at least partly retained within the housing, and a controller operable to control the laser module.
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公开(公告)号:US20230025704A1
公开(公告)日:2023-01-26
申请号:US17936584
申请日:2022-09-29
Applicant: Hisense Laser Display Co., Ltd
Inventor: Youliang TIAN , Zinan ZHOU , Xin ZHANG , Yunchen LU
IPC: H01S5/024 , H01S5/00 , H01S5/0222 , H01S5/0237 , H01S5/042
Abstract: A laser device is provided. The laser device includes a bottom plate, a frame body, a heat sink and a light-emitting chip. The light-emitting chip is located on a surface of the heat sink away from the bottom plate. The light-emitting chip includes a plurality of first protrusions and/or a plurality of first depressions, the plurality of first protrusions and/or the plurality of first depressions are located on a first surface of the light-emitting chip; the heat sink includes a plurality of second depressions and/or a plurality of second protrusions, the plurality of second depressions and/or the plurality of second protrusions are located on a second surface of the heat sink; the plurality of first protrusions are located in the plurality of second depressions, and the plurality of second protrusions are located in the plurality of first depressions.
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公开(公告)号:US20230006413A1
公开(公告)日:2023-01-05
申请号:US17944601
申请日:2022-09-14
Applicant: PANASONIC HOLDINGS CORPORATION
Inventor: Koshi NAKAMURA
IPC: H01S5/0239 , H01S5/02315 , H01S5/0222 , B23K26/14
Abstract: An optical apparatus includes: an optical component opposed to and spaced apart from a light-emitting surface through which laser light is emitted; a case that houses a semiconductor laser element and the optical component and includes an introduction port for introducing gas and an exhaust port for exhausting the gas; and a flow passage section (i.e., a tubular body) including a spray port for spraying the semiconductor laser element with the gas introduced from the introduction port.
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公开(公告)号:US11189987B2
公开(公告)日:2021-11-30
申请号:US16103905
申请日:2018-08-14
Applicant: Nichia Corporation
Inventor: Soichiro Miura
IPC: H01S5/00 , H01S5/02255 , H01S5/024 , H01S5/028 , H01S5/40 , F21S41/176 , F21S43/16 , F21S41/16 , H01S5/0222 , H01S5/323 , H01S5/02216 , H01S5/02257
Abstract: A light emitting device includes: one or more semiconductor laser elements; one or more light-reflecting parts, each having a light-reflecting surface configured to reflect laser light emitted from a corresponding one of the one or more semiconductor laser elements; and a fluorescent part having a light-receiving surface configured to be irradiated with the laser light reflected at the light-reflecting surface of each of the one or more light-reflecting parts. An irradiated region is formed on the light-reflecting surface when the light-reflecting surface is irradiated with the laser light, the irradiated region including a first end and a second end opposite the first end.
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公开(公告)号:US20210318196A1
公开(公告)日:2021-10-14
申请号:US17356092
申请日:2021-06-23
Applicant: Namuga, Co., Ltd.
Inventor: Jun Youb LEE , Young Gyu KANG , Jeong Hwa SEO
IPC: G01L19/14 , H01S5/183 , H01S5/06 , H01S5/068 , H01S5/0222 , H01S5/02257
Abstract: An embodiment provides a beam projector module including: a light source configured to output light; a substrate configured to support the light source; an optical device configured to reduce the light in terms of intensity output to a predetermined space; a frame configured to separate the optical device from the light source by a predetermined distance; an optical substrate configured to attach the optical device thereto and to define a sealed space with the substrate and the frame, the sealed space having internal pressure lower than pressure outside the sealed space; a sensor configured to measure a state of the sealed space; and a processor configured to change an operation mode of the light source depending on a measured value of the sensor.
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公开(公告)号:US10938182B2
公开(公告)日:2021-03-02
申请号:US14829927
申请日:2015-08-19
Applicant: Soraa Laser Diode, Inc.
Inventor: James W. Raring , Paul Rudy , Eric Goutain
IPC: H01S5/00 , H01S5/343 , H01S5/024 , H01S5/32 , H01S5/022 , H01S5/22 , H01S5/02224 , H01S5/02 , F21V29/70 , F21Y115/30 , H01S5/0222
Abstract: The present invention provides a device and method for an integrated white colored electromagnetic radiation source using a combination of laser diode excitation sources based on gallium and nitrogen containing materials and light emitting source based on phosphor materials. In this invention a violet, blue, or other wavelength laser diode source based on gallium and nitrogen materials is closely integrated with phosphor materials, such as yellow phosphors, to form a compact, high-brightness, and highly-efficient, white light source.
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公开(公告)号:US11652331B2
公开(公告)日:2023-05-16
申请号:US16962391
申请日:2019-01-16
Applicant: OSRAM OLED GmbH
Inventor: Matthias Knörr
IPC: H01S5/022 , H01S5/02257 , H01S5/02216 , H01S5/0222
CPC classification number: H01S5/02257 , H01S5/0222 , H01S5/02216
Abstract: A method for producing a housing cover for a laser component, a housing for a laser component, and a laser component are provided. The method includes providing an at least partially radiation-permeable window including an aluminum oxide, provide a copper carrier for the window, and forming a copper oxide in an oxide region on the copper carrier. The method further includes arranging the window at the oxide region, forming a eutectic bond between the window and the copper oxide in the oxide region, and thereby fixing the window to the copper carrier.
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