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    Feed-through filter capacitor with non-overlapping electrodes
    11.
    发明申请
    Feed-through filter capacitor with non-overlapping electrodes 有权
    具有非重叠电极的直通滤波电容器

    公开(公告)号：US20030007310A1

    公开(公告)日：2003-01-09

    申请号：US10136789

    申请日：2002-05-03

    Applicant: Presidio Components, Inc.

    Inventor： Hung Trinh ,  Daniel F. Devoe

    IPC: H01G004/35

    CPC classification number: H01G4/35 ,  H01G4/30

    Abstract: A feed-through capacitor has layers of dielectric material and a first hole that passes through the layers of dielectric material for receiving an electrical conductor connected to the filter capacitor. First, second and third electrodes are disposed between layers of the dielectric material and extend in a first direction substantially perpendicular to a centerline of the first hole. The third electrodes are disposed intermediate the first and second electrodes Any one of the first, second and third electrodes is non-overlapping with any of another of the first, second and third electrodes in a direction substantially parallel to the centerline of the first hole. A filtering capacitor is formed substantially wholly by fringe-effect capacitance between the first and third electrodes, and a coupling capacitor is formed substantially wholly by fringe-effect capacitance between the second and third electrodes The filtering and coupling are electrically connected in series.

    Abstract translation: 馈通电容器具有介电材料层和穿过电介质材料层的第一孔，用于接收连接到滤波电容器的电导体。 首先，第二和第三电极设置在介电材料的层之间，并且在基本上垂直于第一孔的中心线的第一方向上延伸。 第三电极设置在第一和第二电极之间的任何一个中，第一，第二和第三电极中的任何一个在基本上平行于第一孔的中心线的方向上与第一，第二和第三电极中的另一个电极中的任一个不重叠。 滤波电容器基本上完全由第一和第三电极之间的条纹效应电容形成，并且耦合电容器基本上完全由第二和第三电极之间的条纹效应电容形成。滤波和耦合电串联连接。

    Capacitor assemblies, energy storage modules and assemblies, and methods of making same
    14.
    发明授权
    Capacitor assemblies, energy storage modules and assemblies, and methods of making same 有权

    公开(公告)号：US11462361B1

    公开(公告)日：2022-10-04

    申请号：US15645117

    申请日：2017-07-10

    Applicant: Presidio Components, Inc.

    Inventor： Alan Devoe

    IPC: H01G4/38 ,  H01G4/228 ,  H01G13/00 ,  H01G4/04

    Abstract: A capacitor assembly includes a capacitor having ends. A terminal covers less than an area of one end. A wire bond has opposing ends with one end being coupled to the terminal and is configured to break connection with a circuit when an electrical current through the wire bond reaches a fusing current. An energy storage module includes at least two capacitor assemblies. The wire bond of one capacitor is electrically connected to the second terminal of an adjacent capacitor. An energy storage assembly includes two energy storage modules stacked one on top of the other. A pulse forming network includes conductors and at least two energy storage modules. A method of making a module includes charging each of the capacitors, removing each capacitor that fails, connecting one end of a wire bond to one terminal and connecting the other end to an adjacent capacitor or to a conductor.

    High voltage fringe-effect capacitor
    15.
    发明授权
    High voltage fringe-effect capacitor 有权

    公开(公告)号：US10262803B1

    公开(公告)日：2019-04-16

    申请号：US15728120

    申请日：2017-10-09

    Applicant: Presidio Components, Inc.

    Inventor： Hung Van Trinh ,  Alan Devoe

    IPC: H01G4/35 ,  H01G4/30 ,  H01G4/005 ,  H01G4/012

    Abstract: A multilayer chip capacitor includes electrodes comprised of numerous, closely spaced conductive layers interposed within a dielectric laminate. Adjacent conductive layers are essentially non-overlapping, so that fringe capacitance between opposing electrodes provides substantially all of the capacitance. The conductive layers may be shaped to form a non-planer boundary between electrodes. An additional high frequency integrated capacitor is formed from external electrode plates. The non-planar electrode boundary principle is also applied to discoidal capacitors in the form of a non-concentric electrode boundary.

    Single layer capacitor
    16.
    发明申请
    Single layer capacitor 有权
    单层电容器

    公开(公告)号：US20040090733A1

    公开(公告)日：2004-05-13

    申请号：US10694125

    申请日：2003-10-27

    Applicant: Presidio Components, Inc.

    Inventor： Alan Devoe ,  Lambert Devoe ,  Hung Trinh

    IPC: H01G004/12 ,  H01G004/228 ,  H01L021/02

    CPC classification number: H01G4/005 ,  H01G4/06 ,  H01G4/228 ,  H01G4/33

    Abstract: A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance that may be easily and inexpensively manufactured. To this end, sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may comprise an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the pc board. Alternatively, the composite material may comprise an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, and the coated composite is mounted to the pc board and the coating provides an electrical connection to an internal electrode. By the present invention, vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

    Abstract translation: 具有高结构强度和电容的单片或基本单片单层电容器，其可以容易且廉价地制造。 为此，将生坯状陶瓷电介质材料和陶瓷/金属复合材料片层压在一起，切割成单个芯片，并烧结以将陶瓷烧结在一起。 复合材料可以包括足以使复合材料导电的量的金属，由此复合材料可用于一个或两个电极，并将电容器安装到印刷电路板上。 或者，复合材料可以包括不足以使复合材料导电但足以用作电镀工艺的种子点的金属量，其中复合材料优选地涂覆有导电金属，并且涂覆的复合材料安装到印刷电路板和 涂层提供与内部电极的电连接。 通过本发明，提供了垂直取向的表面安装电容器和混合电容器。

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