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公开(公告)号：US20220068551A1
公开(公告)日：2022-03-03
申请号：US17246257
申请日：2021-04-30
Applicant: Ralec Electronic Corporation
Inventor： Tim WANG
Abstract: A method for manufacturing a multilayer inductance component includes forming through holes to define coil forming regions on an insulating sheet, forming conductive blocks in the through holes and first coil pattern layers at the coil forming regions, forming a guiding block on the first coil pattern layer, removing predetermined parts of the insulating sheet, forming a first magnetic layer partially exposing the guiding block, forming second coil pattern layers connected with the first coil pattern layers, forming inner pads connected to the second coil pattern layers, forming a second magnetic layer partially exposing the inner pads, forming outer pads on the inner pads, cutting along a periphery of each coil forming region, and encapsulating each cut individual component.
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Patent Agency Ranking
公开(公告)号：US20210134505A1
公开(公告)日：2021-05-06
申请号：US16853487
申请日：2020-04-20
Applicant: Ralec Electronic Corporation
Inventor： Tim Wang , Peter Chen
IPC: H01F17/00
Abstract: A thin-film inductor includes an electrically conductive structure, an inductance-enhancing structure and two terminal electrodes. The electrically conductive structure has a coil pattern, and includes an insulating base plate having via extending therethrough, upper and lower coils formed on two opposite surfaces of the insulating base plate, and a conducting member disposed in and fills the via to electrically connect the upper and lower coils. The inductance-enhancing structure covers the electrically conductive structure and fills a space defined by the electrically conductive structure to expose an electrode contact region of the lower coil. The terminal electrodes are disposed on the electrode contact region.
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公开(公告)号：US20210125779A1
公开(公告)日：2021-04-29
申请号：US16794664
申请日：2020-02-19
Applicant: Ralec Electronic Corporation
Inventor： Tim WANG , Chia-Cheng CHENG
IPC: H01F41/04 , H01F41/076
Abstract: A method for making a thin-film inductor includes the steps of: a) forming an array of coil units from an electrically conductive substrate, b) introducing a magnetic material into mold cavities of a mold unit, c) disposing each of the coil units on the magnetic material in a respective one of the mold cavities, d) introducing additional magnetic material into the mold cavities to completely cover the coil units, e) molding the magnetic material and the coil units in the mold unit to form semi-products, and f) forming, on each of the semi-products, two terminal electrodes and electrically connecting the terminal electrodes to the coil unit so as to obtain the thin-film inductors.
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公开(公告)号：US20190198204A1
公开(公告)日：2019-06-27
申请号：US16223681
申请日：2018-12-18
Applicant: Ralec Electronic Corporation
Inventor： Wan-Ping WANG , Chen-Ling TSAI
Abstract: A method for making resistors includes: forming a protective layer on a metal plate; patterning the metal plate to form a plurality of spaced-apart resistor wires; forming a plurality of bottom parts on the metal plate, each of the bottom parts covering a portion of a respective one of the resistor wires such that the respective resistor wire defines two opposite electrode forming regions; laser-marking the protective layer to form a plurality of identification codes; laser-cutting the protective layer and the metal plate to form a plurality of spaced-apart pre-formed resistors; and forming two terminal electrodes respectively on the two opposite electrode forming regions of each of the resistor wires.
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公开(公告)号：US09991032B2
公开(公告)日：2018-06-05
申请号：US14946155
申请日：2015-11-19
Applicant: RALEC ELECTRONIC CORPORATION
Inventor： Wan-Ping Wang
CPC classification number: H01C17/006 , B05C11/00 , B05D1/32 , B05D5/00 , H01C7/006 , H01C7/06 , H01C17/08 , H01C17/28
Abstract: A method for manufacturing a thin film chip resistor device includes the steps of: disposing a magnetic fixing member on a first surface of a substrate, and disposing a magnetic shadow mask on a second surface of the substrate opposite to the first surface, such that the magnetic shadow mask detachably and fixedly contacts the second surface of the substrate by virtue of an attractive magnetic force between the magnetic fixing member and the magnetic shadow mask; and depositing at least one resistor unit on the second surface of the substrate with the use of the magnetic shadow mask, the resistor unit including two separated first electrode elements and a resistor element that electrically interconnects the first electrode elements.
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公开(公告)号：US08854175B2
公开(公告)日：2014-10-07
申请号：US13790064
申请日：2013-03-08
Applicant: Ralec Electronic Corporation
Inventor： Wan-Ping Wang
CPC classification number: H01C17/006 , H01C1/142 , H01C13/02 , H01C17/281 , Y10T29/49082
Abstract: A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.
Abstract translation: 片式电阻器件包括绝缘衬底，两个缩进图案和电阻器单元。 绝缘基板具有相对的第一和第二表面。 第一表面具有分别与两个相对边缘相邻的两个相对边缘和两个电极形成区域。 凹入图案分别形成在第一表面的电极形成区域中并且从第一表面缩进。 电阻器单元包括分别形成在第一表面的电极形成区域上并被填充到凹入图案中的两个接触电极，以及形成在两个接触电极之间的第一表面上并与接触电极电接触的电阻器。
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