公开(公告)号：US5212406A

公开(公告)日：1993-05-18

申请号：US817229

申请日：1992-01-06

Applicant: Samuel Reele ,  Thomas R. Pian

Inventor： Samuel Reele ,  Thomas R. Pian

IPC: H01L23/538 ,  H01L23/58 ,  H01L23/64 ,  H01L25/065

CPC classification number: H01L22/32 ,  H01L23/5384 ,  H01L23/642 ,  H01L25/0655 ,  H01L2924/0002

Abstract: An assembly of multiple quantities of solid state memory modules, built upon a high density interconnect substrate, is described. Each memory module is of itself constructed from a multiple number of separate bare solid state memory die appropriate to the function. A multiplicity of the memory modules are constructed on a single substrate, and thereupon each module is separated from the single substrate. The separate memory die are mounted to the surface of the high density substrate, which provides the interconnection necessary to complete the memory function. The high density substrate also provides the capability for close attached capacitors for signal filtering, test vias for optimal module test and thermal vias as appropriate. The provision for multiple memory modules enables economical manufacturing plus capability for systems level interconnect.

Abstract translation: 描述了建立在高密度互连基板上的多个量的固态存储器模块的组装。 每个存储器模块本身由多个独立的裸体固态存储器模块构成，适合于该功能。 多个存储器模块构造在单个衬底上，并且随后每个模块与单个衬底分离。 单独的存储器管芯安装到高密度衬底的表面，这提供了完成存储功能所必需的互连。 高密度基板还提供了用于信号滤波的紧密连接电容器，适用于最佳模块测试和热通孔的测试通孔的能力。 多个内存模块的配置使得经济的制造加上系统级互连的能力。

公开(公告)号：US06791605B1

公开(公告)日：2004-09-14

申请号：US09307315

申请日：1999-05-07

Applicant: Samuel Reele ,  Ronald Sagen

Inventor： Samuel Reele ,  Ronald Sagen

IPC: H04N5225

CPC classification number: H04N1/00286 ,  H04N1/195 ,  H04N1/19594 ,  H04N2201/0081 ,  H04N2201/0082 ,  H04N2201/0089 ,  H04N2201/0438

Abstract: An image producing device (10) including a digital camera an area image sensor (20) disposed at an image plane for receiving the image of a subject (21), and producing a digitized image thereof. A CPU (32a) is adapted to direct the output to a variety of storage mediums. A printer (30) is connected to the CPU (32a) for producing a hard copy (39) of the digital image as shown on an image display (38b). The integral digital camera adjustably; directable from 0° to 360° in a horizontal plane and selectively directed at a sheet display (54) or at a subject (21) for a portrait.

Abstract translation: 一种图像产生装置（10），包括数字照相机，设置在用于接收被摄体（21）的图像的图像平面处的区域图像传感器（20），并且产生其数字化图像。 CPU（32a）适于将输出引导到各种存储介质。 打印机（30）连接到CPU（32a），用于产生数字图像的硬拷贝（39），如图像显示器（38b）所示。 整体数码相机可调; 在水平面中可以从0°到360°的方向，并且选择性地指向片材显示器（54）或被摄体（21）用于肖像。

公开(公告)号：US06567190B1

公开(公告)日：2003-05-20

申请号：US09435099

申请日：1999-11-05

Applicant: Samuel Reele

Inventor： Samuel Reele

IPC: H04N104

CPC classification number: H04N1/00129 ,  H04N1/00127 ,  H04N1/00278 ,  H04N1/00347 ,  H04N1/00411 ,  H04N1/00453 ,  H04N1/00493 ,  H04N1/2158 ,  H04N2201/0034

Abstract: A multi-functional scanner and method of assembling same. In this regard, the invention provides a combination scanning, editing and display apparatus contained in a single housing. The scanner is configured as a flatbed scanner with a display screen mounted in a cover belonging to the scanner. The display screen is touch sensitive for editing images and electronically inputting text. The scanner has electronic input connections such as CD disk, CDR disk, DVD disk, floppy, electronic memory cards, and smart cards to display images directly from these devices or store images directly in memory. The scanner is capable of interrogating an output device (e.g., printer) that may be connected to the scanner for determining type of output device and format of output.

Abstract translation: 多功能扫描仪及其组装方法。 在这方面，本发明提供了包含在单个外壳中的组合扫描，编辑和显示装置。 扫描仪被配置为平板扫描器，其中显示屏安装在属于扫描仪的盖子中。 显示屏幕对于编辑图像和电子输入文本是触摸敏感的。 扫描仪具有诸如CD盘，CDR盘，DVD盘，软盘，电子存储卡和智能卡之类的电子输入连接，以直接从这些设备显示图像或将图像直接存储在存储器中。 扫描器能够询问可连接到扫描仪的输出设备（例如打印机），以确定输出设备的类型和输出格式。

公开(公告)号：US5893037A

公开(公告)日：1999-04-06

申请号：US739237

申请日：1996-10-29

Applicant: Samuel Reele ,  Alan L. Korus

Inventor： Samuel Reele ,  Alan L. Korus

IPC: H04N1/00 ,  H04N1/21 ,  H04Q7/32 ,  H04N7/18

CPC classification number: H04N1/2116 ,  H04N1/00281 ,  H04N1/2112 ,  H04N1/2158

Abstract: A combined electronic/silver-halide image capture system is capable of transmitting electronic image data using conventional cellular telephone transmission technology. The system includes a camera unit and a cellular telephone that can be electrically coupled to the camera unit. The camera unit has both a photographic film plane and an electronic image sensor. A mechanism is provided for directing scene light from a scene to be imaged to at least one of the photographic film plane and the electronic image sensor, wherein the electronic image sensor generates analog image signals in response to incident scene light. A processing unit receives the analog image signals generated by the electronic image sensor and generates digital image signals represented of the scene to be imaged. A memory unit is provided to selectively store the digital image signals generated by the processing unit. The camera unit also preferably includes a display so that the digital image signals generated by the processing means can be viewed by the operator of the system. The digital image signals are supplied to a cellular telephone which transmits the digital image signals to a remote location when the camera unit is electrically coupled to the cellular telephone.

Abstract translation: 组合的电子/卤化银图像捕获系统能够使用传统的蜂窝电话传输技术来发送电子图像数据。 该系统包括可以电耦合到相机单元的相机单元和蜂窝电话。 相机单元具有摄影胶片平面和电子图像传感器。 提供了一种用于将来自要成像的场景的场景光引导到摄影胶片平面和电子图像传感器中的至少一个的机构，其中电子图像传感器响应于入射场景光生成模拟图像信号。 处理单元接收由电子图像传感器产生的模拟图像信号，并生成表示为要成像的场景的数字图像信号。 提供存储单元以选择性地存储由处理单元生成的数字图像信号。 相机单元还优选地包括显示器，使得由处理装置产生的数字图像信号可以被系统的操作者观看。 当摄像机单元电耦合到蜂窝电话时，数字图像信号被提供给蜂窝电话，蜂窝电话将数字图像信号发送到远程位置。

公开(公告)号：US5408122A

公开(公告)日：1995-04-18

申请号：US160566

申请日：1993-12-01

Applicant: Samuel Reele

Inventor： Samuel Reele

IPC: H01L27/144 ,  H01L27/14 ,  H01L31/00

CPC classification number: H01L27/1443

Abstract: A vertical semiconductor radiation detector structure is described in which a suction diode, formed by deposition of p+ on a substrate or epitaxial layer and subsequent up-diffusion during epitaxial layer deposition, surrounds the active area of the radiation detector. The suction diode removes the slow diffusion currents thereby reducing the settling time of the radiation detector to an acceptable level.

Abstract translation: 描述了一种垂直半导体辐射检测器结构，其中通过在衬底或外延层上沉积p +形成的吸附二极管和在外延层沉积期间随后的向上扩散形成的吸收二极管围绕辐射检测器的有效区域。 吸入二极管去除慢扩散电流，从而将辐射探测器的稳定时间降低到可接受的水平。

公开(公告)号：US5246880A

公开(公告)日：1993-09-21

申请号：US874462

申请日：1992-04-27

Applicant: Samuel Reele ,  Thomas R. Pian

Inventor： Samuel Reele ,  Thomas R. Pian

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/3025

Abstract: A method and apparatus for forming a conductive bump on a metal or other conductive surface or layer. A substrate is provided which includes the metal surface, a passivation layer next to the metal surface and an etch stop layer next to the passivation layer. The etch stop and passivation layers have a via therethrough which exposes a portion of the metal surface. At least one sacrificial layer is formed next to the etch stop layer. Each sacrificial layer has a via therethrough which has a larger diameter than, and which is essentially aligned with, the via in the layer located (i) next to the sacrificial layer and (ii) closer to the metal surface. The vias are filled with a conductive paste which is allowed to cure or harden. The sacrificial layer(s) is(are) removed to expose the bump.

Abstract translation: 一种用于在金属或其它导电表面或层上形成导电凸块的方法和装置。 提供了一种衬底，其包括金属表面，邻近金属表面的钝化层和与钝化层相邻的蚀刻停止层。 蚀刻停止层和钝化层具有通过其穿过的通孔，其暴露金属表面的一部分。 在蚀刻停止层的旁边形成至少一个牺牲层。 每个牺牲层具有穿过其中的通孔，该通孔具有比位于（i）邻近牺牲层的层中的通孔更大的直径，并且与其基本上对准，并且（ii）更靠近金属表面。 过孔填充有允许固化或硬化的导电膏。 牺牲层被去除以暴露凸块。

公开(公告)号：US10960238B1

公开(公告)日：2021-03-30

申请号：US17083413

申请日：2020-10-29

Applicant: Samuel Reele ,  Louis Christopher Goeckel

Inventor： Samuel Reele ,  Louis Christopher Goeckel

IPC: A62B18/02 ,  A41D13/11 ,  A62B18/08 ,  A62B23/02

Abstract: A face mask for a user having a face, a nose and a mouth, the face mask including a covering including a periphery, a top end, a bottom end, the covering configured to cover at least a portion of the nose of the user and at least a portion of the mouth of the user, wherein the covering is configured substantially according to the shape and size of the nose of the user and the mouth of the user; a first opening disposed at a first location of the covering; a second opening disposed at a second location of the covering; a first filter configured for covering the first opening; a second filter configured for covering the second opening; and a seal disposed on the periphery.

公开(公告)号：US5565674A

公开(公告)日：1996-10-15

申请号：US305124

申请日：1994-09-13

Applicant: Samuel Reele

Inventor： Samuel Reele

IPC: G11B7/09 ,  G11B7/13 ,  G11B7/22 ,  H01L31/0203 ,  G11B7/00

CPC classification number: G11B7/131 ,  G11B7/0943 ,  G11B7/22 ,  H01L31/0203 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011

Abstract: Disclosed is an integrated optical detection packaging assembly for mounting and aligning a focus and tracking photo detector array and front facet detectors to an optical read/write head. A flat elongated leadframe having a plurality of conductive fingers extending substantially orthogonal to the longitudinal axis of the leadframe and having conductive wing areas extending along the longitudinal axis to opposite ends of the leadframe provides a support for the mounting of the packaged components to the read/write head of a CD reader/writer. The conductive wing areas have alignment indicia for facilitating the aligning of a focus and tracking photo detector array, carried by the support, to the optical reader/writer. A ceramic substrate is attached to the leadframe and a focus and tracking photo detector array is attached to the ceramic substrate and to the conductive fingers of leadframe. Front facet detectors are attached to the ceramic substrate and to the conductive fingers of said leadframe to complete one embodiment of the package.

Abstract translation: 公开了一种集成的光学检测封装组件，用于将聚焦和跟踪光电检测器阵列和前端面检测器安装和对准到光学读/写头。 具有多个导电指状物的平坦细长引线框架，其基本上垂直于引线框架的纵向轴线延伸并且具有沿着纵向轴线延伸到引导框架的相对端部的导电翼区域，用于将封装的部件安装到读/ 写CD读写器的头。 导电翼区域具有对准标记，以便于将由支持物携带的聚焦和跟踪光电检测器阵列对准到光学读取器/写入器。 陶瓷衬底附接到引线框架，并且焦点和跟踪光电检测器阵列附着到陶瓷衬底和引线框架的导电指状物。 前面小面检测器附接到陶瓷衬底和所述引线框架的导电指状物以完成封装的一个实施例。

公开(公告)号：US5400219A

公开(公告)日：1995-03-21

申请号：US218876

申请日：1994-03-28

Applicant: Samuel Reele ,  Thomas R. Pian

Inventor： Samuel Reele ,  Thomas R. Pian

IPC: H01L21/60 ,  H01L23/498 ,  H05K7/02

CPC classification number: H01L24/80 ,  H01L23/4985 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173

Abstract: An article of manufacture which has a substrate including electrical leads and bond pads electrically connected to the leads. Two or more integrated circuit semiconductor chips are supported on the substrate. Each of the chips includes a plurality of edges and a plurality of input/output (I/O) bond pads. A portion of the bond pads on each chip are located adjacent at least one edge of the respective chip. At least two separate sections of Tape Automated Bonding (TAB) tape electrically connect the I/O bond pads on each chip to the bond pads on the substrate. In a refinement of the invention, the sections of TAB tape each include a plurality of inner lead bond leads extending from a longitudinal (along the tape length) edge of the tape. Each inner lead bond is connectable to one of the I/O bond pads on the chips. The inner lead bond leads are located a uniform distance apart from each other, this distance equalling the smallest distance apart between adjacent bond pads on any chip which the TAB tape is compatible with.

Abstract translation: 一种制品，其具有包括电引线和电连接到引线的接合焊盘的基板。 两个或多个集成电路半导体芯片被支撑在基板上。 每个芯片包括多个边缘和多个输入/输出（I / O）接合焊盘。 每个芯片上的接合焊盘的一部分位于相应芯片的至少一个边缘附近。 磁带自动键合（TAB）带的至少两个独立部分将每个芯片上的I / O接合焊盘电连接到衬底上的接合焊盘。 在本发明的改进中，TAB带的各部分包括从带的纵向（沿着带长度）边缘延伸的多个内引线接合引线。 每个内部引线键可连接到芯片上的I / O接合焊盘之一。 内部引线接合引线位于距离彼此均匀的距离处，该距离等于TAB带可兼容的任何芯片上的相邻接合焊盘之间的最小距离。

公开(公告)号：US5235140A

公开(公告)日：1993-08-10

申请号：US886585

申请日：1992-05-21

Applicant: Samuel Reele ,  Thomas R. Pian

Inventor： Samuel Reele ,  Thomas R. Pian

IPC: H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/40

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/81026 ,  H01L2924/3011 ,  H05K1/095 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/1476

Abstract: A large electrode bump is generated on a substrate such as a circuit board. A small electrode bump is then formed on the large bump. Preferably a barrier layer is deposited over the large bump prior to formation of the small bump. In this case the small bump is formed on the barrier layer over the large bump. In one embodiment, the small bump is formed by applying a sacrificial layer on the large bump. A window is created in the sacrificial layer. A spring may optionally be inserted in the window. The window is then filled with a conductive material. Finally, the sacrificial layer is removed to reveal the small bump. In another embodiment, a small bump is formed on a semiconductor die and a larger bump is formed on a substrate. The semiconductor die is mounted on the substrate such that the bump on the die contacts the larger bump.

Abstract translation: 在诸如电路板的基板上产生大的电极凸块。 然后在大凸块上形成小电极凸块。 优选地，在形成小凸块之前，在大凸起上沉积阻挡层。 在这种情况下，小凸块形成在大凸块上的阻挡层上。 在一个实施例中，通过在大凸块上施加牺牲层来形成小凸块。 在牺牲层中创建一个窗口。 弹簧可以可选地插入窗口中。 然后用导电材料填充窗口。 最后，去除牺牲层以露出小凹凸。 在另一个实施例中，在半导体管芯上形成小的凸块，并且在基板上形成较大的凸块。 半导体管芯安装在基板上，使得管芯上的突起接触较大的凸块。