Abstract:
A bit-line pull-up circuit for an SRAM device which utilizes an improved diffusion structure for enhanced immunity of the SRAM device against electrostatic discharge. The improved diffusion structure includes an undivided diffusion region that serves as a common drain for a plurality of MOS transistors. The undivided diffusion region has at least a pair of recessed diffusion edges formed on opposite sides thereof. The forming of the recessed diffusion edges prevents the so-called electrical field crowding effect and also enhances ESD immunity for the MOS transistor. Further, since the drain diffusion region is an undivided area, an increased number of metal contact windows are provided therein, and at least one of the metal contact windows is arranged substantially between the two recessed diffusion edges. In the event of an electrostatic discharge, this allows the discharge current flowing into the drain to be divided into a greater number of small-magnitude currents flowing to the source.
Abstract:
The present invention provides a combinded FOX and poly gate structure, for effectively reducing the trigger voltage of a conventional field device, for improving the robustness of a NMOS transistor of a small drive I/O circuit, and for improving the ESD performance of a stack-gate voltage tolerant I/O.
Abstract:
A chip has a power bus, a first metal layer and a plurality of internal electronic circuits. The first metal layer has a plurality of power lines which are substantially parallel and electrically connected to the power bus in parallel for delivering electrical power to the internal electronic circuits. A plurality of metal lines of a second metal layer of the chip are configured by an automatic place and route (APR) process according to the internal electronic circuits, and at least one sparse area is formed on the second metal layer. Later, at least one supply-power area is configured in the sparse area, and is electrically connected to the power bus.
Abstract:
An early triggered MOSFET ESD protection circuit based on reduction of the trigger voltage is described. A transient negative voltage is generated and applied to a gate of a MOSFET during a positive ESD event. The instant invention improves ESD performance, and is particularly useful for thin gate oxide of 40 Å and less.
Abstract:
A chip has a power bus, a first metal layer and a plurality of internal electronic circuits. The first metal layer has a plurality of power lines which are substantially parallel and electrically connected to the power bus in parallel for delivering electrical power to the internal electronic circuits. A plurality of metal lines of a second metal layer of the chip are configured by an automatic place and route (APR) process according to the internal electronic circuits, and at least one sparse area is formed on the second metal layer. Later, at least one supply-power area is configured in the sparse area, and is electrically connected to the power bus.
Abstract:
A method of operating a non-volatile memory device includes providing the non-volatile memory device with a body of first conductivity, a source region of second conductivity, a drain region of second conductivity on the body, and a control gate over the body adjacent to the source and drain regions. A first voltage of first polarity is applied to the control gate. A second voltage of first polarity is applied to the drain region, the second voltage being less than about 5.6 volts. A third voltage of second polarity is applied to the source region.
Abstract:
A method of processing memory, suitable for loading an executable object code compiled from a source code into the memory that includes defective memory cells. At first, set up a plurality of pre-compiled object codes that correspond to a source code, each pre-compiled object code having at least a skipped-code-address range. Then, test the memory and locate the defective addresses therein. According to the result of the test, the code-loading system selects an executable object that has the matching skipped-code-address range from the pre-compiled object codes, and loads the executable code into the memory. Since the skipped-code-address range covers the defective addresses in the memory, the defective memory cells in the memory won't affect the operation of loading a program.
Abstract:
A method of processing a partially defective memory for loading a machine code program into a memory device that includes at least one defective memory cell. At first the machine code program is scanned. In addition, a movable code block between two break points, which is ready to be loaded to the defective memory cell of the memory device, is determined. Then the block code is moved to a memory space between a first address and a second address in which there is no defective memory cell. Finally, the moved code block should be linked in the execution sequence with the unmoved portion of the machine code program and the addressing references correlated between the moved code block and the unmoved portion of the machine code program should be modified is and corrected. The resulting machine code program can be properly loaded and executable.
Abstract:
A driver circuit for use in driving displays has an input receiving a digital input data having n bits for selecting one of a plurality of voltage levels for driving the circuit. The circuit also has an output, a plurality of digital signal lines coupled to the digital input data, and a plurality of active regions coupled to a first side of the output. Each of the plurality of active regions is coupled to a separate voltage level. The circuit further includes a plurality of pass transistors at a first subset of locations where the plurality of digital signal lines overlap the plurality of active regions, and a plurality of depletion-implanted transistors at a second subset of locations where the plurality of digital signal lines overlap the plurality of active regions. The number of the plurality of digital signal lines on one side of the output can be odd number, such as 2n−1, or can be 2n−2. A plurality of blocking transistors can positioned between the input and selected digital signal lines, with at least one of the digital signal lines being coupled to a gate of each of the blocking transistors for controlling each of the blocking transistors. A level-shifter can also be positioned between selected active regions for one or more digital signal line.
Abstract:
An integrated semiconductor device includes a substrate having a buried shallow trench isolation structure and an epitaxial layer disposed over the substrate and the buried shallow trench isolation structure. The epitaxial layer includes a shallow trench isolation structure that extends over the buried shallow trench isolation structure in the substrate to substantially reduce leakage current in the substrate to prevent device latch-up.