公开(公告)号：US5693557A

公开(公告)日：1997-12-02

申请号：US590086

申请日：1996-01-24

申请人： Shuji Hirao ,  Hisashi Ogawa ,  Yuka Terai ,  Mitsuru Sekiguchi ,  Masanori Fukumoto ,  Isao Miyanaga

发明人： Shuji Hirao ,  Hisashi Ogawa ,  Yuka Terai ,  Mitsuru Sekiguchi ,  Masanori Fukumoto ,  Isao Miyanaga

IPC分类号： H01L21/02 ,  H01L21/3213 ,  H01L21/768 ,  H01L21/70

CPC分类号： H01L28/84 ,  H01L21/3213 ,  H01L21/32131 ,  H01L21/76838 ,  Y10S148/014 ,  Y10S438/964

摘要： A method of the invention for fabricating a semiconductor device includes the steps of: forming an oxide film having a non-uniform thickness on silicon; reducing at least a portion of the oxide film using gas containing a metal element, and growing a metal film containing the metal element on the silicon by reacting an exposed surface of the silicon with the gas; and removing the metal film.

公开(公告)号：US5385867A

公开(公告)日：1995-01-31

申请号：US216968

申请日：1994-03-24

申请人： Tetsuya Ueda ,  Kousaku Yano ,  Tomoyasu Murakami ,  Michinari Yamanaka ,  Shuji Hirao ,  Noboru Nomura

发明人： Tetsuya Ueda ,  Kousaku Yano ,  Tomoyasu Murakami ,  Michinari Yamanaka ,  Shuji Hirao ,  Noboru Nomura

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L23/522 ,  H01L21/283 ,  H01L21/31

CPC分类号： H01L21/76847 ,  H01L21/76844 ,  H01L21/76877 ,  H01L21/76885 ,  H01L23/5226 ,  H01L2924/0002 ,  Y10S438/948

摘要： After accumulating a BPSG film layer on a silicon substrate, a first Al--Si--Cu film layer, a W film layer and a second Al--Si--Cu film layer are successively accumulated on this BPSG film layer. A resist pattern with wide-width and narrow-width pattern portions is formed on the second Al--Si--Cu film layer. The wide-width pattern portion is provided at a position corresponding to a contact for connecting a first-layer metallic wiring and a second-layer metallic wiring, while the narrow-width pattern portion is provided at a position corresponding to a wiring portion for the first-layer metallic wiring. After applying first etching on the second Al--Si--Cu film layer with a mask of the resist patter, second etching is applied on the W film layer. Thereafter, by applying third etching, the resist pattern remaining on the first-layer metallic wiring is removed and the first Al--Si--Cu film layer is transfigured into a tall metallic film portion and a short metallic film portion. After accumulating an inter-layer insulating film layer on the first Al--Si--Cu film layer, etchback is applied on this inter-layer insulating film layer until the top of the tall metallic film portion is bared. Then, the second-layer metallic wiring is formed on the inter-layer insulating film layer so that the second-layer metallic wiring is connected with the tall metallic film portion.

摘要翻译： 在硅衬底上积累BPSG膜层之后，第一Al-Si-Cu膜层，W膜层和第二Al-Si-Cu膜层依次堆积在该BPSG膜层上。 在第二Al-Si-Cu膜层上形成具有宽幅和窄宽图案部分的抗蚀剂图案。 宽幅图形部分设置在与用于连接第一层金属布线和第二层金属布线的接触件相对应的位置处，而窄宽图案部分设置在与布线部分相对应的位置处 第一层金属布线。 在具有抗蚀剂图案的掩模的第二Al-Si-Cu膜层上施加第一蚀刻之后，在W膜层上施加第二蚀刻。 此后，通过施加第三蚀刻，去除残留在第一层金属布线上的抗蚀剂图案，并将第一Al-Si-Cu膜层变形为高金属膜部分和短金属膜部分。 在第一Al-Si-Cu膜层上积累层间绝缘膜层之后，在该层间绝缘膜层上施加回蚀，直到高金属膜部分的顶部露出。 然后，在层间绝缘膜层上形成第二层金属布线，使得第二层金属布线与高金属膜部分连接。