Abstract:
Example embodiments provide a nonvolatile memory device using resistive elements. The nonvolatile memory device may include a semiconductor substrate, a plurality of variable resistance patterns on the semiconductor substrate, and a plurality of heat sink patterns that are level with the variable resistance patterns and coupled to a ground voltage.
Abstract:
Example embodiments provide a nonvolatile memory device using resistive elements. The nonvolatile memory device may include a semiconductor substrate, a plurality of variable resistance patterns on the semiconductor substrate, and a plurality of heat sink patterns that are level with the variable resistance patterns and coupled to a ground voltage.
Abstract:
A thin film transistor substrate and a method of manufacturing the same are disclosed. The method of manufacturing a thin film transistor substrate includes forming a first conductive pattern group including a gate line, a gate electrode, and a lower gate pad electrode on a substrate, forming a gate insulating layer on the substrate on which the first conductive pattern group is formed, forming an oxide semiconductor pattern overlapping the gate electrode on the gate insulating layer, and forming first and second conductive layers on the substrate on which the oxide semiconductor pattern is formed and patterning the first and second conductive layers to form a second conductive pattern group including a data line, a source electrode, a drain electrode, and a data pad.
Abstract:
A safety injection tank, used for quickly injecting emergency core cooling water (ECCW) to a reactor vessel in the case of a cold leg large break accident (CLLBA) in a pressurized water reactor (PWR), is disclosed. The safety injection tank has a gravity-driven fluidic device configured to efficiently change the ECCW injection mode from a high flow injection mode to a low flow injection mode. The gravity-driven fluidic device includes a spring placed in the upper end of the vertical pipe, and a vertically movable water tub placed on the spring so as to be movable in a vertical direction. When ECCW contained in the pressure vessel is discharged and the water level is reduced lower than the height of the tub, the tub is moved downwards such that the lower surface thereof comes into contact with the vertical pipe and closes the high flow inlet port.
Abstract:
The present invention relates to a longitudinally divided emergency core cooling (ECC) duct in order to efficiently inject safety water to core of a pressurized light-water nuclear reactor. The ECC duct includes side supports for preventing the flow-induced vibration in the annular downcomer, and has structural stability while thermally expanding and contracting. A longitudinally divided ECC duct for emergency core cooling water injection of a nuclear reactor is provided on the periphery of a core barrel of a nuclear reactor, includes an emergency core cooling water inlet facing a direct vessel injection nozzle, and extends in a longitudinal direction of the core barrel. The longitudinally divided ECC duct is divided into a plurality of longitudinally-divided ducts in the longitudinal direction of the longitudinally divided ECC duct.
Abstract:
A direct vessel injection (DVI) nozzle for minimum emergency core coolant (ECC) bypass is disclosed. The DVI nozzle is used in a pressurized light water reactor (PLWR) having a reactor vessel with a reactor coolant system in which a coolant flows into the reactor vessel through a cold leg and passes through a reactor core prior to being discharged to the outside of the reactor vessel through a hot leg. The DVI nozzle, provided to directly inject ECC into the reactor vessel to cool the reactor core during a break in the reactor coolant system, such as a cold leg break (CLB) that may occur in the PLWR, is placed on the reactor vessel at a position horizontally offset from the central axis of the hot leg at an angle of 10° to 30° and is involved within a region defined above the central axis of the hot leg by a distance of 1.5 times the sum of diameters of the hot leg and the DVI nozzle. Thus, the DVI nozzle efficiently injects ECC, and remarkably reduces the direct ECC bypass fraction to a broken cold leg and minimizes the amount of direct ECC bypass.
Abstract:
Provided is a wiper control device. The device includes a first output IC, a direct driving switch, a second output IC, and an MCU. The first output IC supplies a power source for a wiper operation control in IG2 OFF state. The direct driving switch directly drives wipers. The second output IC intermits the power source to a wiper motor. The MCU controls the second output IC to drive the wipers depending on the direct driving switch.
Abstract:
An emergency core cooling system directly injects emergency core cooling water, which is supplied from a high-pressure safety injection pump or a safety injection tank for a pressurized light water reactor, into a reactor vessel downcomer. A pipe connector is completely removed from between each direct vessel injection nozzle and each injection extension duct installed on an outer surface of the core barrel, which are opposite to each other. An emergency core cooling water intake port, through which the water is injected from each direct vessel injection nozzle, is formed on the surface of each injection extension duct facing an axis of each direct vessel injection nozzle. Thereby, a structure in which a jet of the emergency core cooling water flows into the injection extension ducts is adopted in a hydraulic connection fashion.
Abstract:
A method of fabricating nonvolatile memory devices may involve forming separate floating gates on a semiconductor substrate, forming control gates on the semiconductor substrate, conformally forming a buffer film on a surface of the semiconductor substrate, injecting ions into the semiconductor substrate between the pairs of the floating gates to form a common source region partially overlapping each floating gate of the respective pair of the floating gates, depositing an insulating film on the buffer film, etching the buffer film and the insulating film at side walls of the floating gates and the control gates to form spacers at the side walls of the floating gates and the control gates, and forming a drain region in the semiconductor substrate at a side of the control gate other than a side of the control gate where the common source region is formed.
Abstract:
A conductive ink composition includes about 15% to about 50% by weight of copper nanoparticles, about 40% to about 80% by weight of a non-aqueous solvent mixture, about 0.01% to about 5% by weight of a dispersion agent and about 1% to about 20% by weight of a wetting agent. A conductive pattern may be formed with use of the conductive ink composition and an inkjet printer.