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    Airburst simulation system and method of simulation for airburst
    11.
    发明授权
    Airburst simulation system and method of simulation for airburst 有权
    空爆模拟系统和空气爆破模拟方法

    公开(公告)号：US08986010B2

    公开(公告)日：2015-03-24

    申请号：US13705794

    申请日：2012-12-05

    Applicant: Joon-Ho Lee ,  Je-Wook Chae ,  Eui-Jung Choe ,  Sung-Bae Lee ,  Hyun-Jun Kim

    Inventor： Joon-Ho Lee ,  Je-Wook Chae ,  Eui-Jung Choe ,  Sung-Bae Lee ,  Hyun-Jun Kim

    IPC: F41G3/26 ,  F41J5/02 ,  F41A33/02 ,  F41A19/42

    CPC classification number: F41G3/2655 ,  F41A19/42 ,  F41A33/02 ,  F41G3/2688 ,  F41J5/02

    Abstract: The present disclosure relates to an airburst simulation system and method. The airburst simulation system includes a laser emitting unit to emit laser beam to an airburst aiming position, preset above a target hidden behind an obstacle, such that a warhead is airbursted to shoot the target, a laser detecting unit mounted onto the target to detect an arrival of the laser beam above the target, and a determining unit to measure a distance between the airburst aiming position and an arrival position of the laser detected by the laser detecting unit, and determine whether or not the target has been shot based on the distance. This allows for a simulated engagement using an airburst apparatus, with no harm to human bodies by virtue of the use of laser.

    Abstract translation: 本发明涉及一种空爆模拟系统和方法。 空爆模拟系统包括：激光发射单元，其将激光束发射到预定位于障碍物后方的目标上方的空气轰击瞄准位置，使得弹头爆炸以射击目标;激光检测单元，安装在目标上以检测目标 以及确定单元，用于测量由所述激光检测单元检测到的所述爆发瞄准位置与所述激光的到达位置之间的距离，并且基于所述距离来确定所述目标是否已被射击 。 这允许使用爆破装置的模拟接合，而不会因使用激光而对人体造成伤害。

    Method of forming a trench for use in manufacturing a semiconductor device
    15.
    发明授权
    Method of forming a trench for use in manufacturing a semiconductor device 有权
    形成用于制造半导体器件的沟槽的方法

    公开(公告)号：US07183226B2

    公开(公告)日：2007-02-27

    申请号：US10673873

    申请日：2003-09-30

    Applicant: Sung-Bae Lee ,  Sang-Rok Hah ,  Hong-Seong Son

    Inventor： Sung-Bae Lee ,  Sang-Rok Hah ,  Hong-Seong Son

    IPC: H01L21/302 ,  H01L21/461

    CPC classification number: H01L27/10885 ,  H01L21/76229 ,  H01L21/76232 ,  H01L29/66181

    Abstract: A method for use in manufacturing a semiconductor device includes forming a photoresist pattern on a substrate, performing first etching process in which an initial trench is formed using the photoresist pattern as a mask, and performing second distinct etching process to enlarge the initial trench. Thus, the initial trench can be formed using the photoresist pattern having a stable structure. Thereafter, the trench is enlarged using an etching solution having a composition based on the material in which the initial trench is formed, e.g., a silicon substrate or an insulation film. Therefore, a metal wiring, an isolation film or a contact can be formed in the enlarged trench to desired dimensions.

    Abstract translation: 一种用于制造半导体器件的方法包括在衬底上形成光致抗蚀剂图案，执行第一蚀刻工艺，其中使用光致抗蚀剂图案作为掩模形成初始沟槽，并且执行第二不同的蚀刻工艺以扩大初始沟槽。 因此，可以使用具有稳定结构的光致抗蚀剂图案来形成初始沟槽。 此后，使用具有基于其中形成初始沟槽的材料的组成的蚀刻溶液（例如硅衬底或绝缘膜）来扩大沟槽。 因此，可以在扩大的沟槽中形成金属布线，隔离膜或接触件到期望的尺寸。

    Chemical mechanical polishing apparatus
    16.
    发明授权
    Chemical mechanical polishing apparatus 失效
    化学机械抛光装置

    公开(公告)号：US06976902B2

    公开(公告)日：2005-12-20

    申请号：US10850688

    申请日：2004-05-21

    Applicant: Ja-Eung Koo ,  Jong-Won Lee ,  Sung-Bae Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son

    Inventor： Ja-Eung Koo ,  Jong-Won Lee ,  Sung-Bae Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son

    IPC: B24B37/02 ,  B24B37/04 ,  B24B49/10 ,  B24B49/14 ,  B24B1/00

    CPC classification number: B24B37/013 ,  B24B49/10 ,  B24B49/14

    Abstract: There is provided a chemical mechanical polishing apparatus, which may include a polishing table rotated by a polishing table motor and having a pad thereon, a carrier head located above the polishing table to be rotatable by the driving of a carrier head motor and having a wafer located under the bottom thereof, a slurry supplier for supplying a slurry to the upper portion of the polishing table, a first polishing end point detector for detecting a polishing end point through the temperature change of the temperature sensor, at least one temperature sensor for detecting the temperature of a polishing region (the wafer, the pad, and the slurry), and a second polishing end point detector for detecting a polishing end point from the changes of load current, voltage, and resistance of the carrier head motor. Further, instead of the second polishing end point detector, an optical signal polishing end point detector may be employed, for detecting the polishing end point by the light illuminated on the wafer and reflected from the wafer.

    Abstract translation: 提供了一种化学机械抛光装置，其可以包括由抛光台马达旋转并且具有垫的抛光台，位于抛光台上方的载体头可以通过载体头马达的驱动旋转并具有晶片 位于其底部的浆料供应器，用于向抛光台的上部供应浆料;第一抛光终点检测器，用于通过温度传感器的温度变化检测抛光终点;至少一个检测温度传感器 抛光区域（晶片，焊盘和浆料）的温度，以及用于从承载头电动机的负载电流，电压和电阻的变化检测抛光终点的第二抛光终点检测器。 此外，代替第二研磨终点检测器，可以采用光信号抛光终点检测器，用于通过照射在晶片上的光并从晶片反射来检测抛光终点。

    Firearm having dual barrels
    17.
    发明授权
    Firearm having dual barrels 有权
    枪炮有双重桶

    公开(公告)号：US08887615B2

    公开(公告)日：2014-11-18

    申请号：US13229495

    申请日：2011-09-09

    Applicant: In Woo Kim ,  Suk Kyun Hong ,  Sung Bae Lee ,  Eui Jung Choe ,  Je Wook Chae

    Inventor： In Woo Kim ,  Suk Kyun Hong ,  Sung Bae Lee ,  Eui Jung Choe ,  Je Wook Chae

    IPC: F42C17/00 ,  F41A19/21 ,  F41A21/06

    CPC classification number: F41A21/06 ,  F41A19/21

    Abstract: Disclosed is a firearm having dual barrels comprising a firearm body which is equipped with a small caliber barrel and a large caliber barrel; a selector installed on one side of the firearm body to select the type of bullet and the mode of firing; a fire control system installed on the firearm body to enable aiming the target through detecting the target both at day and night time; a firearm switch unit installed on the firearm body to transmit the information on the firing of the bullet; a fuse setter installed on the firearm body to transmit the control signal of the fire control system to the fuse of the explosive bullet which is introduced into the large caliber barrel; and a sensor device unit installed on the firearm body to transmit the position of the selector and sensed firing signal to the fire control system.

    Abstract translation: 公开了一种具有双筒的枪械，其包括装备有小口径筒和大口径筒的枪支主体; 安装在枪支身体一侧的选择器选择子弹的类型和射击方式; 安装在火器身上的消防系统，以便能够通过昼夜探测目标瞄准目标; 安装在枪支身上的枪支开关单元，用于传送关于子弹射击的信息; 保险丝安装器，安装在枪支身上，将消防系统的控制信号传送到引入大口径枪管的爆炸子弹的保险丝; 以及安装在枪支体上的传感器装置单元，用于将选择器的位置和感测到的点火信号传送到消防控制系统。

    Mounting structure of a semiconductor device module for a computer system
    19.
    发明授权
    Mounting structure of a semiconductor device module for a computer system 有权
    用于计算机系统的半导体器件模块的安装结构

    公开(公告)号：US06226179B1

    公开(公告)日：2001-05-01

    申请号：US09419298

    申请日：1999-10-15

    Applicant: Sung-Bae Lee

    Inventor： Sung-Bae Lee

    IPC: H05K720

    CPC classification number: H05K7/142 ,  H05K7/1431

    Abstract: A mounting structure for mounting a semiconductor device module in a computer system, comprises a housing for mounting a motherboard having peripheral ports for connecting with various peripheral devices, an opening formed in the housing for allowing the semiconductor device module to be mounted on or detached from the motherboard, a plurality of fasteners positioned between the motherboard and semiconductor device module for fixing the semiconductor device module on the motherboard, each of the fasteners having two end parts being respectively connected with the motherboard and semiconductor device module, and a rear bracket attached to one side of the housing for supporting the peripheral ports and additionally serving as an electromagnetic interference preventer, wherein the rear bracket fuirther includes an extension plate placed beneath the motherboard to face the part ofthe motherboard mounted with the semiconductor device module, and a plurality of bosses formed on the extension plate so as to respectively hold the end parts of the fasteners connected with the motherboard.

    Abstract translation: 一种用于将半导体器件模块安装在计算机系统中的安装结构，包括用于安装具有用于与各种外围设备连接的外围端口的母板的壳体，形成在壳体中的开口，用于允许半导体器件模块安装在或从 主板，位于母板和半导体器件模块之间的多个紧固件，用于将半导体器件模块固定在母板上，每个紧固件具有分别与母板和半导体器件模块连接的两个端部，以及附接到 壳体的一侧用于支撑周边端口并另外用作电磁干扰防止器，其中后支架还包括设置在主板下方的延伸板，以面对安装有半导体器件模块的母板的部分，以及多个凸起 形成在扩展 以分别固定与母板连接的紧固件的端部。

    SCULPTURE IN THREE-DIMENSIONAL TRANSPARENT SPACE, AND METHOD FOR PRODUCING SAME
    20.
    发明申请
    SCULPTURE IN THREE-DIMENSIONAL TRANSPARENT SPACE, AND METHOD FOR PRODUCING SAME 有权

    公开(公告)号：US20220097448A1

    公开(公告)日：2022-03-31

    申请号：US17298201

    申请日：2019-11-28

    Applicant: Sung Bae LEE ,  Jung Sook JUNG

    Inventor： Sung Bae LEE ,  Jung Sook JUNG

    IPC: B44F1/06 ,  B44C3/02

    Abstract: The present disclosure relates to a technology of producing a sculpture in a 3D stereoscopic space filled with a transparent material. The sculpture may be produced through a process of preparing a desired number of 2D plans acquired by dividing a 3D plan of the sculpture and a plurality of transparent plates corresponding to the number of the 2D plans, forming the shapes of corresponding regions by stacking representation materials on the corresponding transparent plates, joining the representation materials to the corresponding transparent plates, or making scratches on the corresponding transparent plates, and stacking the transparent plates having the shapes formed thereon, and can precisely represent shapes through various representation techniques or be repeatedly reproduced.

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