公开(公告)号：US07585453B2

公开(公告)日：2009-09-08

申请号：US10522213

申请日：2003-07-17

Applicant: Dominique Schwab ,  Timothy Cooper

Inventor： Dominique Schwab ,  Timothy Cooper

IPC: B29C49/12

CPC classification number: B29C51/26 ,  B29C35/16 ,  B29C43/00 ,  B29C51/02 ,  B29C51/04 ,  B29C51/34 ,  B29C51/428 ,  B29C51/44 ,  B29C2035/1658 ,  B29C2049/4892 ,  B29L2031/7158

Abstract: The device for thermoforming an object presenting an undercut portion. The device may include a thermoforming mold having a base portion and at least two undercut-forming portions in the vicinity of an end; a countermold; and a moving thermoforming piston. The device further may include holding means suitable for holding the rim of the object relative to the countermold, and, in order to unmold the object, said portions of the mold and the holding means are suitable for being controlled in a sequence in which the undercut-forming portions are moved apart, the holding means are active and hold the object against the countermold, and at least the base portion of the mold is spaced apart from the countermold while the holding means are active.

Abstract translation: 用于热成型呈现底切部分的物体的装置。 该装置可以包括热成型模具，其具有在一端的附近的基部和至少两个底切形成部分; 反模型 和移动的热成型活塞。 该装置还可以包括适于相对于相对模具保持物体的边缘的保持装置，并且为了使对象脱模，模具和保持装置的所述部分适合于以下述顺序控制： 移动分离部分，保持装置是有效的，并将物体抵靠着对置模具，并且当保持装置有效时，至少模具的基部与对置模具间隔开。

公开(公告)号：US20050179455A1

公开(公告)日：2005-08-18

申请号：US10781369

申请日：2004-02-18

Applicant: Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

Inventor： Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2886 ,  G01R31/2887

Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

Abstract translation: 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

公开(公告)号：USD406826S

公开(公告)日：1999-03-16

申请号：US075188

申请日：1997-08-22

Applicant: Timothy Cooper ,  Mark Scicluna

Designer： Timothy Cooper ,  Mark Scicluna