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    Probe card configuration for low mechanical flexural strength electrical routing substrates
    1.
    发明申请
    Probe card configuration for low mechanical flexural strength electrical routing substrates 失效
    用于低机械抗弯强度电路基板的探针卡配置

    公开(公告)号：US20050156611A1

    公开(公告)日：2005-07-21

    申请号：US10771099

    申请日：2004-02-02

    Applicant: Makarand Shinde ,  Richard Larder ,  Timothy Cooper ,  Ravindra Shenoy ,  Benjamin Eldridge

    Inventor： Makarand Shinde ,  Richard Larder ,  Timothy Cooper ,  Ravindra Shenoy ,  Benjamin Eldridge

    IPC: G01R31/02 ,  G01R31/28

    CPC classification number: G01R31/2889 ,  G01R1/07378

    Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

    Abstract translation: 提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。 通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探头; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探头负载; 和/或（5）设置在所述探针与下弯曲强度空间变换器基板之间的高刚性界面砖。

    Installation for producing objects by thermoforming pellets of thermoplastic material
    2.
    发明授权
    Installation for producing objects by thermoforming pellets of thermoplastic material 失效
    通过热塑性材料的热成型制造物体的安装

    公开(公告)号：US07311513B2

    公开(公告)日：2007-12-25

    申请号：US10520644

    申请日：2003-07-09

    Applicant: Dominique Schwab ,  Timothy Cooper

    Inventor： Dominique Schwab ,  Timothy Cooper

    IPC: B28B21/36

    CPC classification number: B29C51/18 ,  B29C43/00 ,  B29C49/12 ,  B29C51/04 ,  B29C51/261 ,  B29C51/421 ,  B29C2791/006 ,  B29C2791/007 ,  B29L2031/7158

    Abstract: The installation for manufacturing objects such as receptacles by thermoforming pellets of thermoplastic material includes conveyor means for conveying the pellets through the various stations in the installation, said stations including a heating station and a thermoforming station. The conveyor means comprise conveyor elements (46) defining cells (48) which are open upwards and downwards, and each of which is suitable for containing one pellet (12) while the entire top and bottom faces of the pellet remain unobstructed, means for depositing the pellets in the cells, drive means for driving the conveyor elements through the heating station, and transfer means (20) for transferring the heated pellets to the thermoforming station. The heating station includes bottom heater means (52) that co-operate with a support for the pellets while said conveyor elements are being driven through the heating station.

    Abstract translation: 通过热塑性材料的热成型颗粒来制造诸如容器的物体的装置包括用于将颗粒输送通过安装中的各个站的输送装置，所述站包括加热站和热成型站。 传送装置包括传送元件（46），所述传送器元件（46）限定了向上和向下打开的孔（48），并且每个都适合于容纳一个颗粒（12），同时颗粒的整个顶面和底面保持不受阻碍， 电池中的颗粒，用于通过加热站驱动输送机元件的驱动装置和用于将加热的颗粒转移到热成型站的转印装置（20）。 加热站包括底部加热器装置（52），其在所述输送机元件被驱动通过加热站时与用于颗粒的支撑件配合。

    PROBING A DEVICE
    3.
    发明申请
    PROBING A DEVICE 失效
    探索一个设备

    公开(公告)号：US20070262767A1

    公开(公告)日：2007-11-15

    申请号：US11748988

    申请日：2007-05-15

    Applicant: Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

    Inventor： Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

    IPC: G01R31/28 ,  G01R1/06

    CPC classification number: G01R31/2886 ,  G01R31/2887

    Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

    Abstract translation: 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    Composite Motion Probing
    4.
    发明申请
    Composite Motion Probing 失效
    复合运动探测

    公开(公告)号：US20070170941A1

    公开(公告)日：2007-07-26

    申请号：US11697603

    申请日：2007-04-06

    Applicant: Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

    Inventor： Timothy Cooper ,  Benjamin Eldridge ,  Igor Khandros ,  Rod Martens ,  Gaetan Mathieu

    IPC: G01R31/02

    CPC classification number: G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

    Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

    Abstract translation: 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    Installation for producing objects by thermoforming pellets of thermoplastic material
    6.
    发明申请
    Installation for producing objects by thermoforming pellets of thermoplastic material 失效
    通过热塑性材料的热成型制造物体的安装

    公开(公告)号：US20060127525A1

    公开(公告)日：2006-06-15

    申请号：US10520644

    申请日：2003-07-09

    Applicant: Dominique Schwab ,  Timothy Cooper

    Inventor： Dominique Schwab ,  Timothy Cooper

    IPC: B29C51/42

    CPC classification number: B29C51/18 ,  B29C43/00 ,  B29C49/12 ,  B29C51/04 ,  B29C51/261 ,  B29C51/421 ,  B29C2791/006 ,  B29C2791/007 ,  B29L2031/7158

    Abstract: The installation for manufacturing objects such as receptacles by thermoforming pellets of thermoplastic material includes conveyor means for conveying the pellets through the various stations in the installation, said stations including a heating station and a thermoforming station. The conveyor means comprise conveyor elements (46) defining cells (48) which are open upwards and downwards, and each of which is suitable for containing one pellet (12) while the entire top and bottom faces of the pellet remain unobstructed, means for depositing the pellets in the cells, drive means for driving the conveyor elements through the heating station, and transfer means (20) for transferring the heated pellets to the thermoforming station. The heating station includes bottom heater means (52) that co-operate with a support for the pellets while said conveyor elements are being driven through the heating station.

    Abstract translation: 通过热塑性材料的热成型颗粒来制造诸如容器的物体的装置包括用于将颗粒输送通过安装中的各个站的输送装置，所述站包括加热站和热成型站。 传送装置包括传送元件（46），所述传送器元件（46）限定了向上和向下打开的孔（48），并且每个都适合于容纳一个颗粒（12），同时颗粒的整个顶面和底面保持不受阻碍， 电池中的颗粒，用于通过加热站驱动输送机元件的驱动装置和用于将加热的颗粒转移到热成型站的转印装置（20）。 加热站包括底部加热器装置（52），其在所述输送机元件被驱动通过加热站时与用于颗粒的支撑件配合。

    Apparatus And Method For Limiting Over Travel In A Probe Card Assembly
    7.
    发明申请
    Apparatus And Method For Limiting Over Travel In A Probe Card Assembly 有权
    在探测卡组件中限制行驶的装置和方法

    公开(公告)号：US20060261827A1

    公开(公告)日：2006-11-23

    申请号：US11461734

    申请日：2006-08-01

    Applicant: Timothy Cooper ,  Benjamin Eldridge ,  Carl Reynolds ,  Ravindra Shenoy

    Inventor： Timothy Cooper ,  Benjamin Eldridge ,  Carl Reynolds ,  Ravindra Shenoy

    IPC: G01R31/02

    CPC classification number: G01R31/2887 ,  G01R3/00 ,  G01R31/2886

    Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

    Abstract translation: 公开了用于测试半导体器件的方法和装置。 相对于探针卡组件的探针，超行程停止限制要测试的设备的行程。 采用反馈控制技术来控制装置和探针卡组件的相对运动。 探针卡组件包括用于吸收相对于探针卡组件的待测试装置的过度行进的柔性基座。

    Device and method for thermoforming an object having a back draft portion
    8.
    发明申请
    Device and method for thermoforming an object having a back draft portion 失效
    用于热成型具有后牵伸部分的物体的装置和方法

    公开(公告)号：US20060113715A1

    公开(公告)日：2006-06-01

    申请号：US10522213

    申请日：2003-07-17

    Applicant: Dominique Schwab ,  Timothy Cooper

    Inventor： Dominique Schwab ,  Timothy Cooper

    IPC: B29C49/12

    CPC classification number: B29C51/26 ,  B29C35/16 ,  B29C43/00 ,  B29C51/02 ,  B29C51/04 ,  B29C51/34 ,  B29C51/428 ,  B29C51/44 ,  B29C2035/1658 ,  B29C2049/4892 ,  B29L2031/7158

    Abstract: The device for thermoforming an object (10) presenting an undercut portion (10B) comprises: a thermoforming mold (12) having a base portion (13) and at least two undercut-forming portions (12A, 12B) in the vicinity of an end (12′); a countermold (18); and a moving thermoforming piston (20). The device further comprises holding means (23A, 23B) suitable for holding the rim (10A) of the object (10) relative to the countermold (18), and, in order to unmold the object, said portions (12A, 12B, 13) of the mold (12) and the holding means (23A, 23B) are suitable for being controlled in a sequence in which the undercut-forming portions (12A, 12B) are moved apart, the holding means (23A, 23B) are active and hold the object (10) against the countermold (18), and at least the base portion (13) of the mold (12) is spaced apart from the countermold while the holding means are active. Translation of the title and the abstract as they were when originally filed by the Applicant. No account has been taken of any changes that may have been made subsequently by the PCT Authorities acting ex officio, e.g. under PCT Rules 37.2, 38.2, and/or 48.3.

    Abstract translation: 用于热成型呈现底切部分（10B）的物体（10）的装置包括：具有基部（13）和附近的至少两个底切形成部分（12A，12B）的热成型模具（12） （12'）; 反模型（18）; 和移动的热成型活塞（20）。 该装置还包括适于相对于相对模具（18）保持物体（10）的边缘（10A）的保持装置（23A，23B），并且为了将物体拆开，所述部分 模具（12）和保持装置（23A，23B）中的一个（12B，13）适合于以下述顺序进行控制：底切形成部分（12A，12B） 保持装置（23A，23B）是有效的，并且将物体（10）保持抵靠对置模具（18），并且至少模具（12）的基部（13）与对置模具间隔开，而保持装置 活跃。 本申请人最初提交的标题和摘要的翻译。 没有考虑到PCT当局可能随后根据职权而作出的任何变更。 根据PCT细则37.2,38.2和/或48.3。

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