摘要:
A method for forming an inductor in a semiconductor substrate having a trench therein including the steps of forming a first metal portion in the trench, providing a flowable dielectric material in the trench, depositing a layer of dielectric material over the layer of first metal portion and flowable dielectric material, forming a plug in the layer of dielectric material wherein the plug is in electrical contact with the first metal portion, and forming a second metal portion over the layer of dielectric material wherein the second metal portion is in electrical contact with the plug.
摘要:
A method for manufacturing a semiconductor memory cell with a floating gate having a predetermined length includes the steps of: growing a thin oxide layer over a substrate; depositing a polysilicon layer over the thin oxide layer; depositing a silicon nitride layer over the polysilicon layer; masking and etching the nitride layer down to the polysilicon layer so as to form an oxide receiving groove in the nitride layer, the groove being parallel to a longitudinal axis of the floating gate to be formed and being longer than the predetermined width of the floating gate to be formed, and the width of the receiving groove in latitudal axis is equal to the predetermined length of the floating gate, the receiving groove overlapping a floating gate region to be defined on the polysilicon layer; growing a polysilicon oxide layer in the receiving groove; removing the nitride layer; providing a mask which is transverse to the polysilicon oxide layer and which has a width equal to the predetermined length of the floating gate to be formed, the mask covering a portion of the polysilicon oxide layer which is directly above the floating gate region; etching remaining portion of the polysilicon oxide layer not covered by the mask; removing the mask; and etching the polysilicon layer with the portion of the polysilicon oxide layer serving as a mask so as to form the floating gate.
摘要:
The present invention generally relates to a method for fabricating a post-process one-time programmable (OTP) read only memory cell (ROM cell). The OTP ROM cell has two oxide layers positioned on a semiconductor substrate and a plurality of semiconductor-implanted regions are implanted in the semiconductor substrate. Oxide layers are respectively to those semiconductor-implanted regions of the semiconductor substrate and having a window-type isolating channel region for each. Finally, a polysilicon layer is positioned on the thicker oxide layer as a gate electrode region of the OTP ROM cell. Hence, the polysilicon layer can be applied a voltage to penetrate the thinker oxide layer of the window-type isolating channel region to form a P-N junction between the semiconductor-implanted regions and the polysilicon layer and then the ROM cell is programmed.
摘要:
An integrated circuit device includes a semiconductor substrate, an NMOS, a PMOS contiguous with the NMOS, and a composite pnp bipolar junction transistor contiguous with the NMOS. The composite pnp bipolar junction transistor includes a lateral npn bipolar junction transistor having a first current gain, and a lateral pnp bipolar junction transistor having a second current gain, wherein the current gain of the composite pnp bipolar junction transistor equals the first current gain multiplied by the second current gain.
摘要:
A method for making planar silicon-based inductor structure with improved Q is disclosed. This method includes the steps of: (a) providing a lightly-doped P-type substrate as a starting wafer; (b) forming a preliminary oxide layer on the lightly-doped P-type substrate; (c) forming a first oxide layer from the preliminary oxide layer enclosing a predetermined epitaxial area; (d) depositing an epitaxial layer in the epitaxial area using intrinsic doping; (e) forming a second oxide layer which covers both the epitaxial layer and the first oxide layer, and is merged with the first oxide layer to thus form a contiguous inter-connected inductor oxide layer; (f) forming a metal line according to a planar inductor pattern so as to form a silicon-based inductor structure. The epitaxial layer has a resistivity of at least 2 K ohm-cm. The planar silicon-based inductor improves the Q value by reducing or stopping current losses into the substrate.