公开(公告)号：US07971446B2

公开(公告)日：2011-07-05

申请号：US11757347

申请日：2007-06-01

申请人： Jimmy Clidaras ,  William Hamburgen ,  Andrew Carlson ,  Steven T. Y. Chow ,  Winnie Leung ,  Montgomery Sykora ,  Donald L. Beaty

发明人： Jimmy Clidaras ,  William Hamburgen ,  Andrew Carlson ,  Steven T. Y. Chow ,  Winnie Leung ,  Montgomery Sykora ,  Donald L. Beaty

IPC分类号： F25D23/12

CPC分类号： H05K7/20136 ,  A62C3/16 ,  G06F1/20 ,  H05K7/1497 ,  H05K7/20727 ,  H05K7/20736

摘要： A system can include an enclosure having an exterior surface and an interior region that is characterized by a width and a length that is longer than the width; a plurality of trays mounted in racks that line a majority of each side of the length of the interior region and that define an aisle therebetween which is suitable for passage by one or more human occupants; cooling coils configured to capture heat generated by the plurality of trays and exhaust the heat outside the interior region; a plurality of connections on the exterior surface for supplying electrical power to the plurality of trays, supplying cooling fluid to the cooling coils, and for receiving cooling fluid discharged from the cooling coils; and doors at either end of the aisle configured and positioned to facilitate emergency egress from the enclosure by a human occupant.

摘要翻译： 系统可以包括具有外表面和内部区域的外壳，其特征在于宽度和长度大于宽度; 安装在机架上的多个托盘，其沿着内部区域的长度的每一侧的大部分排列，并且在其间限定适于通过一个或多个人的居住者的通道; 冷却盘管构造成捕获由多个托盘产生的热并将热量排出到内部区域外部; 在所述外表面上具有用于向所述多个托盘供电的多个连接，将冷却流体供应到所述冷却盘管，以及用于接收从所述冷却盘管排出的冷却流体; 并且通道的任一端的门被配置和定位成便于人类乘客从外壳的紧急出口。

公开(公告)号：US20100251629A1

公开(公告)日：2010-10-07

申请号：US12815892

申请日：2010-06-15

申请人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

发明人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

IPC分类号： E04H14/00 ,  G06F13/38 ,  E04H1/00 ,  E04B1/70 ,  F28D15/00

CPC分类号： H05K7/202 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1497 ,  H05K7/20754 ,  H05K7/2079

摘要： A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

摘要翻译： 计算机系统可以包括具有多个对接区域并且被配置为向每个对接区域提供电力，数据网络接口，冷却流体供应和冷却流体返回的连接毂; 以及多个运输容器，每个运输容器都包围向计算机系统增加计算能力的模块化计算环境。 每个运输容器可以包括：a）耦合到数据网络接口的多个处理单元，每个处理单元包括微处理器; b）热交换器，其被配置为通过使来自所述供应器的冷却流体通过所述热交换器循环并将其排出到所述回流中来除去由所述多个处理单元产生的热量; 以及c）对接构件，其构造成在一个对接区域处可释放地联接到所述连接毂，以接收电力，连接到所述数据网络接口，以及接收和排出冷却流体。

公开(公告)号：US07738251B2

公开(公告)日：2010-06-15

申请号：US11757101

申请日：2007-06-01

申请人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

发明人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

IPC分类号： H05K7/20 ,  F25D23/12 ,  F28F7/00 ,  B60F1/00 ,  G06F15/16 ,  G06F13/00

CPC分类号： H05K7/202 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1497 ,  H05K7/20754 ,  H05K7/2079

摘要： A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

摘要翻译： 计算机系统可以包括具有多个对接区域并且被配置为向每个对接区域提供电力，数据网络接口，冷却流体供应和冷却流体返回的连接毂; 以及多个运输容器，每个运输容器都包围向计算机系统增加计算能力的模块化计算环境。 每个运输容器可以包括：a）耦合到数据网络接口的多个处理单元，每个处理单元包括微处理器; b）热交换器，其被配置为通过使来自所述供应器的冷却流体通过所述热交换器循环并将其排出到所述回流中来除去由所述多个处理单元产生的热量; 以及c）对接构件，其构造成在一个对接区域处可释放地联接到所述连接毂，以接收电力，连接到所述数据网络接口，以及接收和排出冷却流体。

公开(公告)号：US08456840B1

公开(公告)日：2013-06-04

申请号：US13093098

申请日：2011-04-25

申请人： Jimmy Clidaras ,  William Hamburgen ,  Winnie Leung ,  David W. Stiver ,  Andrew B. Carlson ,  Steven T. Y. Chow ,  Jonathan D. Beck

发明人： Jimmy Clidaras ,  William Hamburgen ,  Winnie Leung ,  David W. Stiver ,  Andrew B. Carlson ,  Steven T. Y. Chow ,  Jonathan D. Beck

IPC分类号： H05K7/20

CPC分类号： H05K7/20745

摘要： A rack-mount computer system includes one or more rows of computer racks, wherein each row of computer racks includes a pair of rows of computer racks positioned back-to-back relative to each other, a plurality of computer motherboards mounted in each of the racks in each row of computer racks and having front edges open to a workspace for receiving circulating air over the motherboards, the motherboards positioned to create a warm air plenum near a back edge of each motherboard, and a fan positioned adjacent each of the plurality of computer motherboards to circulate air across the computer motherboards and into the warm air plenum.

摘要翻译： 机架式计算机系统包括一行或多行计算机机架，其中每排计算机机架包括彼此相对定位的一对计算机机架，多个计算机主板安装在每个计算机机架 每排计算机机架中的机架，并且前边缘打开到用于接收主板上的循环空气的工作空间，主板被定位成在每个主板的后边缘附近形成温暖的空气增压室，以及与多个 计算机主板将空气流经计算机主板并进入暖空气通风室。

公开(公告)号：US08218322B2

公开(公告)日：2012-07-10

申请号：US12815892

申请日：2010-06-15

申请人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

发明人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

IPC分类号： H05K7/20 ,  F25D23/12 ,  F28F7/00 ,  B60F1/00 ,  G06F15/16 ,  G06F13/00

CPC分类号： H05K7/202 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1497 ,  H05K7/20754 ,  H05K7/2079

摘要： A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

摘要翻译： 计算机系统可以包括具有多个对接区域并且被配置为向每个对接区域提供电力，数据网络接口，冷却流体供应和冷却流体返回的连接毂; 以及多个运输容器，每个运输容器都包围向计算机系统增加计算能力的模块化计算环境。 每个运输容器可以包括：a）耦合到数据网络接口的多个处理单元，每个处理单元包括微处理器; b）热交换器，其被配置为通过使来自所述供应器的冷却流体通过所述热交换器循环并将其排出到所述回流中来除去由所述多个处理单元产生的热量; 以及c）对接构件，其构造成在一个对接区域处可释放地联接到所述连接毂，以接收电力，连接到所述数据网络接口，以及接收和排出冷却流体。

公开(公告)号：US07564685B2

公开(公告)日：2009-07-21

申请号：US11618611

申请日：2006-12-29

申请人： Jimmy Clidaras ,  Winnie Leung

发明人： Jimmy Clidaras ,  Winnie Leung

IPC分类号： H02K7/20 ,  F28F7/00

CPC分类号： H05K7/20727 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20772

摘要： A computer apparatus includes a first motherboard having a top surface and a bottom surface and a second motherboard having a top surface and a bottom surface. The motherboards each have mounted thereto components that generate high thermal loads and components that generate low thermal loads. A heat sink is in conductive thermal contact with the top surfaces of the first and second motherboards. Computer components generating high thermal loads are mounted to the top surfaces of the first and second motherboards, and computer components generating low thermal loads are mounted to the bottom surface of one or more of the first and second motherboards.

摘要翻译： 计算机装置包括具有顶表面和底表面的第一母板和具有顶表面和底表面的第二母板。 主板各自安装有产生高热负荷的部件和产生低热负荷的部件。 散热器与第一和第二主板的顶表面导电热接触。 产生高热负荷的计算机部件被安装到第一和第二母板的顶表面，并且产生低热负荷的计算机部件安装到第一和第二主板中的一个或多个的底表面。

公开(公告)号：US20130083476A1

公开(公告)日：2013-04-04

申请号：US13544839

申请日：2012-07-09

申请人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

发明人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

IPC分类号： H05K7/20

CPC分类号： H05K7/202 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1497 ,  H05K7/20754 ,  H05K7/2079

摘要： A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

摘要翻译： 计算机系统可以包括具有多个对接区域并且被配置为向每个对接区域提供电力，数据网络接口，冷却流体供应和冷却流体返回的连接毂; 以及多个运输容器，每个运输容器都包围向计算机系统增加计算能力的模块化计算环境。 每个运输容器可以包括：a）耦合到数据网络接口的多个处理单元，每个处理单元包括微处理器; b）热交换器，其被配置为通过使来自所述供应器的冷却流体通过所述热交换器循环并将其排出到所述回流中来除去由所述多个处理单元产生的热量; 以及c）对接构件，其构造成在一个对接区域处可释放地联接到所述连接毂，以接收电力，连接到所述数据网络接口，以及接收和排出冷却流体。

公开(公告)号：US20100091449A1

公开(公告)日：2010-04-15

申请号：US11720728

申请日：2006-06-27

申请人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

发明人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

IPC分类号： G06F1/20

CPC分类号： H05K7/202 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1497 ,  H05K7/20754 ,  H05K7/2079

摘要： A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releasably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

摘要翻译： 计算机系统可以包括具有多个对接区域并且被配置为向每个对接区域提供电力，数据网络接口，冷却流体供应和冷却流体返回的连接毂; 以及多个运输容器，每个运输容器都包围向计算机系统增加计算能力的模块化计算环境。 每个运输容器可以包括：a）耦合到数据网络接口的多个处理单元，每个处理单元包括微处理器; b）热交换器，其被配置为通过使来自所述供应器的冷却流体通过所述热交换器循环并将其排出到所述回流中来除去由所述多个处理单元产生的热量; 以及c）对接构件，其构造成在一个对接区域处可释放地联接到所述连接毂，以接收电力，连接到所述数据网络接口以及接收和排出冷却流体。