Abstract:
A locking apparatus for a case and the case having the same are disclosed. In one embodiment, the locking apparatus includes an operating knob formed at an external surface of the case and a latch connected to the operating knob and configured to slide with respect to the case. The latch may include i) a body portion connected to the operating knob, ii) an opposite wall portion having opposite walls which extend from a first side of the body portion, iii) a hitch member formed on a second side of the body portion, wherein the first and second sides are opposing each other, and iv) a reinforcing member disposed between the opposite walls.
Abstract:
A semiconductor memory system includes an external memory, an internal memory, and a one-time programmable (OTP) memory. The external memory includes a kernel, a public key, first boot information used to authenticate the public key and generate a test secret key, and a second boot loader verifying integrity of the kernel. The internal memory includes a first boot loader that verifies integrity of the second boot loader and generates the test secret key. The OTP memory includes second boot information generated using the public key and a secret key. Since the secure boot method and the semiconductor memory system using the method do not need an additional OTP memory to store a secret key unlike conventional technology, the capacity and recording time of the OTP memory can be reduced to about half compared to the conventional technology.
Abstract:
An apparatus and a method for generating an Automatic Repeat reQuest (ARQ) feedback message in a wireless communication system are provided. A method for generating an ARQ feedback message at a receiving end in a wireless communication system includes, generating first ARQ feedback information of a first scheme, the first ARQ feedback information comprising information of a first erroneous ARQ block of one or more ARQ blocks for which the ARQ feedback is not performed, generating second ARQ feedback information of a second scheme indicative of error of at least one ARQ block not represented in the first ARQ feedback information, generating an ARQ feedback message comprising the first ARQ feedback information and the second ARQ feedback information, and transmitting the ARQ feedback message to a transmitting end.
Abstract:
Wireless network connection control method of performing control for establishing and releasing wireless network connection with another device when impacts are applied to devices, application program control method of performing control for setting and executing application program when impacts are applied to devices, and device including wireless network connection control function and application program control function which use a device impact are disclosed. According to the present invention, provided is a wireless network connection control method of a device using a device impact, including generating a corresponding impact event when physical impact applied from the outside is sensed, transceiving a search message between devices based on a time at which the impact event occurred, searching for another device in which the impact event has occurred at the same time, and performing a predetermined protocol with a corresponding device according to a search result and establishing an inter-device wireless network connection.
Abstract:
The present invention relates to heterocyclic derivatives, and more particularly, to novel heterocyclic derivatives useful for the preparation of medicaments for treating diseases related to uric acid.
Abstract:
A telemetry data acquisition management system includes a system processor and an interface engine, controlled by the system processor, for interfacing with sensor bearing systems, to receive telemetry data from the sensor bearing systems, and distribute the data to a plurality data processing systems or applications operational for processing telemetry data according to each sensor bearing systems' protocol. The system processor enables the plurality of multiple data processing systems or applications to specify telemetry requests including “fuzzy” timeliness protocol, generates a charging structure such that the sensor bearing systems are charge by usage commensurate with system load.
Abstract:
An electron emission display includes first and second substrates that face each other, a plurality of electron emission elements that are arrayed on the first substrate, phosphor and black layers that are formed on a surface of the second substrate, and an anode electrode that is formed of metal and located on surfaces of the phosphor and black layers. The anode electrode is formed to satisfy the following condition: 0.3 μm≦A≦3 μm where, A indicates a distance between the anode electrode and the phosphor layer.
Abstract translation:电子发射显示器包括彼此面对的第一和第二基板,排列在第一基板上的多个电子发射元件,形成在第二基板的表面上的荧光体和黑色层,以及形成的阳极电极 的金属并位于荧光体和黑色层的表面上。 阳极电极形成为满足以下条件:0.3μm<= A <=3μm其中,A表示阳极电极和荧光体层之间的距离。
Abstract:
A light emission device is provided having a first substrate and a second substrate facing the first substrate. An electron emission unit is provided on the first substrate. A light emission unit is provided on the second substrate. The light emission unit includes red, green, and blue phosphor layers and includes an anode electrode formed over the red, green, and blue phosphor layers. The light emission unit satisfies at least one of the following conditions: 0.7
Abstract translation:提供一种发光器件,其具有面向第一衬底的第一衬底和第二衬底。 电子发射单元设置在第一基板上。 在第二基板上设置发光单元。 发光单元包括红色,绿色和蓝色荧光体层,并且包括在红色,绿色和蓝色荧光体层上形成的阳极电极。 发光单元满足以下条件中的至少一个:0.7 <(T / B / Phi / R)/(t B B / b> u> u> u> b> b> > B <2,其中T,R,T和B B是厚度的红色,绿色和/或 蓝色磷光体层,并且其中Phi,Phi i,,i i i>>>>>> and and and and and and and and and and and and and and and and and and 蓝色荧光体层。
Abstract:
A semiconductor package includes a substrate, a rewiring layer, a plurality of semiconductor chip stack structures, and a second semiconductor chip. The rewiring layer is disposed on an upper surface of the substrate. The rewiring layer includes a concave portion. The semiconductor chip stack structures include a plurality of first semiconductor chips. The first semiconductor chips are disposed on the rewiring layer. The first semiconductor chips are spaced apart from each other in a horizontal direction. The second semiconductor chip is disposed within the concave portion. The second semiconductor chip is configured to electrically connect each of the plurality of semiconductor chip stack structures to each other.