Abstract:
A two transistor EEPROM cell is described that is programmed and erased by electron tunneling across a tunneling channel in a P-well. The EEPROM cell has two transistors formed in a semiconductor substrate. The two transistors are a tunneling transistor (NMOS) and a read transistor (NMOS). Electron tunneling occurs to program and erase the EEPROM cell through a tunnel oxide layer by electron tunneling across an entire portion of a tunneling channel upon incurrence of a sufficient voltage potential between a floating gate and the tunnel channel
Abstract:
A shallow trench isolation structure and a method for forming the same for use with non-volatile memory devices is provided so as to maintain sufficient data retention thereof. An epitaxial layer is formed on a top surface of a semiconductor substrate. A barrier oxide layer is formed on a top surface of the epitaxial layer. A nitride layer is deposited on a top surface of the barrier oxide layer. Trenches are formed through the epitaxial layer and the barrier oxide layer to a depth greater than 4000 .ANG. below the surface of the epitaxial layer so as to create isolation regions in order to electrically isolate active regions in the epitaxial layer. A liner oxide is formed on sidewalls and bottom of the trenches to a thickness between 750 .ANG. to 1500 .ANG.. As a result, leakage current in the sidewalls are prevented due to less thinning of the liner oxide layer by subsequent fabrication process steps.
Abstract:
A method for improving the endurance and reliability of a floating gate transistor often used in memory applications by controlling the electric field induced across the tunnel oxide region of the floating gate when discharging electrons from the floating gate. The method comprises the steps of: allowing the active region to ground; and applying a program voltage to the floating gate over a period of time and at a magnitude, by increasing the voltage from zero volts to the magnitude over a first period of at least 1 millisecond (ms.), maintaining the voltage at the magnitude for a second period of around 10 ms.-100 ms. sufficient to place charge on the floating gate, and decreasing the voltage from the magnitude during a third period to zero volts in not greater than 50 microseconds.
Abstract:
The present invention relates to an extreme low formaldehyde emission UF resin with a novel structure, and a process for its preparation. This UF resin is produced from formaldehyde, urea, a long chain multi-aldehyde prepolymer, and some modifiers. Its process follows three steps: weak caustic, weak acid and weak caustic. By using this prepolymer, the modified UF resin has stable alkyl ether structure, and the residual aldehyde groups on the UF polymer chain could accelerate cross-linking instead of dissociative formaldehyde. The UF resin made from this invention has extreme low dissociative formaldehyde and simple technology. The boards produced from this resin have good physical performance and water resistance. Moreover, the formaldehyde emission of the boards is extreme low, achieving Japan F⋆⋆⋆⋆ grade, the average emission value ≦0.3 mg/L.
Abstract:
Methods and systems for allocating regional inventory to reduce out-of-stock costs are described. A method may include identifying a total number of units of an item to be stored in a plurality of regions and determining an order forecast for the item in each of the plurality of regions. The method may also include receiving a unit out-of-stock cost of the item in each of the plurality of regions and calculating an expected cost for each of the plurality of regions based, at least in part, on the total number of units of the item, each region's respective order forecast, and each region's respective unit out-of-stock cost. The method may further include allocating a portion of the total number of units of the item to each of the plurality of regions to reduce a sum of the expected costs.
Abstract:
Systems and methods systems and methods for allocating inventory in a fulfillment network are disclosed. In some embodiments, a method may include identifying orders fulfilled by a fulfillment center, where each of the identified orders specifies one or more of a plurality of items. The method may also include determining, for each identified order, a probability that the identified order will occur in the future and calculating, for each identified order, a cost savings. Items may then be selected based, at least in part, upon the determined probability and cost savings of each identified order. Additionally or alternatively, a method may include, for a selected item, receiving a customer demand forecast, determining a bind factor, and calculating a target inventory for the selected item to be stored in the fulfillment center based, at least in part, upon the customer demand forecast and the bind factor.
Abstract:
Disclosed are various embodiments for the planning of resources used in computing. Usage statistics regarding one or more machine instances executing in a plurality of networked computing devices are obtained. The usage statistics are grouped based at least in part on one or more customer usage classifications, thereby producing one or more usage groups. A corresponding demand forecast is generated for each of the usage groups. A projected demand for one or more physical components of the networked computing devices is calculated according to the demand forecasts.
Abstract:
A method for eliminating source/drain shorting generated during the highly-doped source/drain implant steps in a standard STI process is provided. This is achieved by reducing the RTA temperature to be less than 1000° C. so as to minimize enhanced doping diffusion. Further, the energy level for the highly-doped source/drain implant steps is increased so to compensate for poly depletion in the gate electrodes.
Abstract:
A triple-well EEPROM cell is described that is programmed and erased by electron tunneling across an entire portion of separate transistor channels. The EEPROM cell has three transistors formed in a semiconductor substrate. The three transistors are a tunneling transistor (NMOS), a sense transistor (NMOS) and a read transistor (NMOS). The tunneling transistor is formed in a second well (e.g a P conductivity type well) that is separated from the substrate by a first well, having e.g. an N conductivity type. a first well formed in the substrate. Electron tunneling occurs to program the EEPROM cell through a sense tunnel oxide layer upon incurrence of a sufficient voltage potential between a floating gate and the sense channel. Electron tunneling also occurs to erase the EEPROM cell through a tunnel oxide layer upon incurrence of a sufficient voltage potential between the floating gate and the tunneling channel.
Abstract:
A process for fabricating a non-volatile memory device includes the step of forming a nitrogen region in a semiconductor substrate prior to carrying out a thermal oxidation process to form a tunnel oxide layer. In a preferred process, nitrogen atoms are ion implanted into a silicon substrate to form a nitrogen region at the substrate surface. Then, a thermal oxidation process is carried out to grow a thin tunnel oxide layer overlying the surface of the nitrogen region. During the oxidation process, nitrogen is incorporated into the growing tunnel oxide layer. A floating-gate electrode is formed overlying the tunnel oxide layer and receives electrical charge transferred from a charge control region of the substrate through the tunnel oxide layer. The tunnel oxide layer is capable of undergoing repeated programming and erasing operations while exhibiting reduced effects from stress induced current leakage. In another aspect of the invention, an MOS transistor having enhanced carrier mobility is obtained by forming a gate oxide layer over a nitrogen region of a silicon substrate. The thermal oxidation process of the invention also provides both tunnel oxide layers and gate oxide layers having a reduced thickness for a given set of thermal oxidation conditions.