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公开(公告)号：US10411379B2
公开(公告)日：2019-09-10
申请号：US15464051
申请日：2017-03-20
Applicant: Apple Inc.
Inventor： Daniel C. Wagman , Benjamin J. Kallman , Hani Esmaeili , Stefan A. Kowalski , Daniel T. McDonald , Eric S. Jol , Raymund W. M. Kwok , Michael W. Barnstead
IPC: H01R13/02 , H01R13/03 , H01R13/40 , B32B15/00 , C22C5/00 , C22C5/02 , C22C5/04 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/06 , H01R24/60
Abstract: Contacts that may be highly corrosion resistant, may be readily manufactured, and may conserve precious materials. One example may provide contacts having a layer of a precious-metal alloy to improve corrosion resistance. The precious-metal-alloy layer may be plated with a hard, durable, wear and corrosion resistant plating stack for further corrosion resistance and wear improvement. The resources consumed by a contact may be reduced by forming a bulk or substrate region of the contact using a more readily available material, such as copper or a material that is primarily copper based.
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公开(公告)号：US20190103700A1
公开(公告)日：2019-04-04
申请号：US15964746
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Hani Esmaeili , Daniel T. McDonald , Aaron A. Oro , Eric S. Jol
IPC: H01R13/56 , H01R13/506 , H01R13/436 , H01R12/59 , H01R13/03
CPC classification number: H01R13/56 , H01R12/592 , H01R13/03 , H01R13/2407 , H01R13/4367 , H01R13/506 , H01R13/6582
Abstract: An electronic receptacle connector includes a hybrid contact assembly that includes a contact plate that has multiple fingers, a contact positioned at a distal end of each finger and a conductor that runs along each finger and electrically couples each contact to an interconnect region positioned outside of the housing. The fingers are made from a first material and the contacts are made from a second material such that each of the first and the second materials can be independently optimized.
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公开(公告)号：US10244308B2
公开(公告)日：2019-03-26
申请号：US15198852
申请日：2016-06-30
Applicant: Apple Inc.
Inventor： Christopher Wilk , Ruchir M. Dave , Scott P. Porter , Daniel T. McDonald
Abstract: An audio speaker having an adsorptive insert in a speaker back volume, is disclosed. More particularly, an embodiment includes an adsorptive insert having a rigid open-pore body formed by bonded adsorptive particles. The rigid open-pore body includes interconnected macropores that transport air from the speaker back volume to adsorptive micropores in the bonded adsorptive particles during sound generation. Other embodiments are also described and claimed.
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公开(公告)号：US10184190B2
公开(公告)日：2019-01-22
申请号：US14622443
申请日：2015-02-13
Applicant: Apple Inc.
Inventor： Lucy E. Browning , Stephen B. Lynch , Christopher D. Prest , Peter N. Russell-Clarke , Masashige Tatebe , Michael S. Nashner , Daniel T. McDonald , Brian S. Tryon , Jody R. Akana
IPC: C25D11/18 , B23K26/354 , B23K26/352 , C25D11/04 , C25D11/12 , C25D11/02
Abstract: The embodiments described herein relate to forming anodized films that have a white appearance. In some embodiments, an anodized film having pores with light diffusing pore walls created by varying the current density during an anodizing process is described. In some embodiments, an anodized film having light diffusing micro-cracks created by a laser cracking procedure is described. In some embodiments, a sputtered layer of light diffusing aluminum is provided below an anodized film. In some embodiments, light diffusing particles are infused within openings of an anodized layer.
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公开(公告)号：US20150176146A1
公开(公告)日：2015-06-25
申请号：US14622443
申请日：2015-02-13
Applicant: APPLE INC.
Inventor： Lucy E. Browning , Stephen B. Lynch , Christopher D. Prest , Peter N. Russell-Clarke , Masashige Tatebe , Michael S. Nashner , Daniel T. McDonald , Brian S. Tryon , Jody R. Akana
IPC: C25D11/18
CPC classification number: C25D11/18 , B23K26/354 , B23K26/355 , C25D11/024 , C25D11/04 , C25D11/045 , C25D11/12 , Y10T428/13 , Y10T428/24331 , Y10T428/24471
Abstract: The embodiments described herein relate to forming anodized films that have a white appearance. In some embodiments, an anodized film having pores with light diffusing pore walls created by varying the current density during an anodizing process is described. In some embodiments, an anodized film having light diffusing micro-cracks created by a laser cracking procedure is described. In some embodiments, a sputtered layer of light diffusing aluminum is provided below an anodized film. In some embodiments, light diffusing particles are infused within openings of an anodized layer.
Abstract translation: 本文所述的实施例涉及形成具有白色外观的阳极氧化膜。 在一些实施例中，描述了通过在阳极氧化处理期间改变电流密度而产生具有光扩散孔壁的孔的阳极化膜。 在一些实施例中，描述了通过激光破裂程序产生的具有光扩散微裂纹的阳极氧化膜。 在一些实施例中，在阳极氧化膜的下方提供光扩散铝的溅射层。 在一些实施例中，光漫射颗粒注入阳极氧化层的开口内。
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Patent Agency Ranking
公开(公告)号：US12193183B2
公开(公告)日：2025-01-07
申请号：US17934275
申请日：2022-09-22
Applicant: Apple Inc.
Inventor： Michael R. Parker , Daniel T. McDonald , Devon K. Copeland , Tyler S. Atura Bushnell , Christopher M. Werner , Michael A. Fisher , Natalie Y. Homsi , Alexandros J. Petrakis , Trent J. Canales
Abstract: An electronic device includes a housing sidewall defining an opening and a display component, such as a display cover, disposed in the opening to form a gap between the housing sidewall and the display component. In at least one example, the cavity is defined by the sidewall and the display cover with the cavity in fluid communication with an external environment through the gap. In at least one example, an epoxy component at least partially defines the cavity and can be in direct contact with the housing sidewall.
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公开(公告)号：US20240266107A1
公开(公告)日：2024-08-08
申请号：US18407220
申请日：2024-01-08
Applicant: Apple Inc.
Inventor： Christopher M. Pinciuc , Daniel T. McDonald , Tao Pan
CPC classification number: H01F38/14 , H01F27/361 , H01F27/366 , H02J7/0042 , H02J50/10 , H02J7/02
Abstract: Electronic devices according to embodiments of the present technology may include a battery. The devices may include a nanocrystalline foil. The devices may include a wireless charging coil seated on the nanocrystalline foil. The devices may also include an integrated circuit configured to operate the wireless charging coil in a wireless charging transmission mode.
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公开(公告)号：US20230232560A1
公开(公告)日：2023-07-20
申请号：US17934275
申请日：2022-09-22
Applicant: Apple Inc.
Inventor： Michael R. Parker , Daniel T. McDonald , Devon K. Copeland , Tyler S. Atura Bushnell , Christopher M. Werner , Michael A. Fisher , Natalie Y. Homsi , Alexandros J. Petrakis , Trent J. Canales
Abstract: An electronic device includes a housing sidewall defining an opening and a display component, such as a display cover, disposed in the opening to form a gap between the housing sidewall and the display component. In at least one example, the cavity is defined by the sidewall and the display cover with the cavity in fluid communication with an external environment through the gap. In at least one example, an epoxy component at least partially defines the cavity and can be in direct contact with the housing sidewall.
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公开(公告)号：US20210195317A1
公开(公告)日：2021-06-24
申请号：US17170694
申请日：2021-02-08
Applicant: Apple Inc.
Inventor： Christopher Wilk , Ruchir M. Dave , Scott P. Porter , Daniel T. McDonald
IPC: H04R1/28
Abstract: An audio speaker having an adsorptive insert in a speaker back volume, is disclosed. More particularly, an embodiment includes an adsorptive insert having a rigid open-pore body formed by bonded adsorptive particles. The rigid open-pore body includes interconnected macropores that transport air from the speaker back volume to adsorptive micropores in the bonded adsorptive particles during sound generation. Other embodiments are also described and claimed.
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公开(公告)号：US10917713B2
公开(公告)日：2021-02-09
申请号：US16268267
申请日：2019-02-05
Applicant: Apple Inc.
Inventor： Christopher Wilk , Ruchir M. Dave , Scott P. Porter , Daniel T. McDonald
Abstract: An audio speaker having an adsorptive insert in a speaker back volume, is disclosed. More particularly, an embodiment includes an adsorptive insert having a rigid open-pore body formed by bonded adsorptive particles. The rigid open-pore body includes interconnected macropores that transport air from the speaker back volume to adsorptive micropores in the bonded adsorptive particles during sound generation. Other embodiments are also described and claimed.
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