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公开(公告)号：US20190081615A1
公开(公告)日：2019-03-14
申请号：US15700580
申请日：2017-09-11
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Yijun Zhou , Yiren Wang , Hao Xu , Ming-Ju Tsai , Victor C. Lee , Liang Han , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with wireless circuitry and control circuitry. The wireless circuitry may include an antenna with an inverted-F antenna resonating element formed from portions of a peripheral conductive electronic device housing structure and may have an antenna ground that is separated from the antenna resonating element by a gap. The antenna may include a first adjustable component coupled between the antenna resonating element arm and the antenna ground on a first side of the antenna feed and a second adjustable component coupled between the antenna resonating element arm and the antenna ground on a second side of the antenna feed. Control circuitry in the electronic device may adjust the first and second adjustable components between a first tuning mode, a second tuning mode, and a third tuning mode.
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公开(公告)号：US09444130B2
公开(公告)日：2016-09-13
申请号：US13860396
申请日：2013-04-10
Applicant: Apple Inc.
Inventor： Peter Bevelacqua , Hao Xu , Jayesh Nath , Jennifer M. Edwards , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q7/00 , H01Q9/0442
Abstract: Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include a dual arm inverted-F antenna resonating element and an antenna ground. An antenna feed may be coupled between the inverted-F antenna resonating element and the antenna ground. An adjustable component such as an adjustable inductor may be coupled between the inverted-F antenna resonating element and the antenna ground in parallel with the antenna feed. The adjustable component may be operable in multiple states such as an open circuit state, a short circuit state, and a state in which the adjustable component exhibits a non-zero inductance. Antenna bandwidth can be broadened by coupling a loop antenna resonating element across the antenna feed. A portion of the antenna ground may overlap the loop antenna resonating element to further enhance antenna bandwidth.
Abstract translation: 电子设备可以包括射频收发器电路和天线结构。 天线结构可以包括双臂倒F天线谐振元件和天线接地。 天线馈送可以耦合在倒F天线谐振元件和天线接地之间。 诸如可调节电感器的可调节部件可以与天线馈送并联连接在倒F天线谐振元件和天线接地之间。 可调组件可以在诸如开路状态，短路状态和可调部件呈现非零电感的状态的多种状态下工作。 通过将环形天线谐振元件耦合到天线馈电上，可以拓宽天线带宽。 天线接地的一部分可能与环形天线谐振元件重叠，以进一步增强天线带宽。
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公开(公告)号：US20240356225A1
公开(公告)日：2024-10-24
申请号：US18306063
申请日：2023-04-24
Applicant: Apple Inc.
Inventor： Trang T. Thai , Jennifer M. Edwards , Sidharth S. Dalmia , Menglu Li , Taegui Kim , Hai H. Ta
CPC classification number: H01Q9/0407 , H01Q1/14 , H01Q1/48 , H01Q1/50 , H01Q23/00
Abstract: An electronic device may be provided with a phased antenna array with antennas on an antenna module. The module may include a primary substrate and a secondary substrate mounted to the primary substrate by an interconnect. An antenna may include patch elements in the primary substrate and patch elements in the secondary substrate that are fed using conductive vias. Fences of conductive vias may couple the patch elements in the primary substrate to ground to isolate the patch elements in the primary substrate from the patch elements in the secondary substrate. The secondary substrate may be smaller than the primary substrate, allowing the secondary substrate to fit into relatively small portions of the electronic device while locating the patch elements in the secondary substrates closer to free space, thereby maximizing antenna performance.
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公开(公告)号：US11863224B2
公开(公告)日：2024-01-02
申请号：US17223888
申请日：2021-04-06
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Jennifer M. Edwards , Simone Paulotto , Siwen Yong
CPC classification number: H04B1/40 , H01Q5/335 , H01Q9/0485 , H04M1/026 , H01Q1/243
Abstract: An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.
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公开(公告)号：US11735821B2
公开(公告)日：2023-08-22
申请号：US17112191
申请日：2020-12-04
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Mattia Pascolini
CPC classification number: H01Q9/0407 , H01Q1/241 , H01Q3/267 , H01Q3/2658 , H01Q5/40
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a probe-fed dielectric resonator antenna. The antenna may include a dielectric resonating element mounted to a flexible printed circuit. A feed probe may be formed from a patch of conductive traces on a sidewall of the resonating element. The feed probe may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the display cover layer. An additional feed probe may be mounted to an orthogonal sidewall of the resonating element for covering additional polarizations. Probe-fed dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the phased antenna array.
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Patent Agency Ranking
公开(公告)号：US11677160B2
公开(公告)日：2023-06-13
申请号：US17212935
申请日：2021-03-25
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Hao Xu , Rodney A. Gomez Angulo , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q21/065 , H01Q1/38 , H01Q5/28 , H01Q5/357 , H01Q21/064
Abstract: An electronic device may be provided with a cover layer and a phased antenna array mounted against the cover layer. Each antenna in the array may include a first patch element that is directly fed using first and second feeds and a second patch element that is directly fed using third and fourth feeds. A slot element may be formed in the first patch element. The first patch element may radiate in a first frequency band through the cover layer. The slot element may radiate in a second frequency band that is higher than the first frequency band through the cover layer. The second patch element may indirectly feed the slot element. Locating the radiating elements for each frequency band in the same plane may allow the antenna to radiate through the cover layer in both frequency bands with satisfactory antenna efficiency.
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公开(公告)号：US11335992B2
公开(公告)日：2022-05-17
申请号：US16990879
申请日：2020-08-11
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Siwen Yong , Jiangfeng Wu , Harish Rajagopalan , Bilgehan Avser , Simone Paulotto , Mattia Pascolini
Abstract: An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.
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公开(公告)号：US10978797B2
公开(公告)日：2021-04-13
申请号：US15950072
申请日：2018-04-10
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer and a conductive layer on the dielectric cover layer. The conductive layer may define an opening. A dielectric spacer may be mounted to the cover layer within the opening. A substrate may be mounted to the spacer. Vertical conductive structures may extend from the conductive layer to the substrate and may laterally surround the spacer. A phased antenna array may be formed on the substrate and aligned with the opening. The cover layer may have a dielectric constant and thickness that are selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The spacer and the conductive structures may exhibit a cavity resonance at the wavelength. The array and the conductive structures may radiate radio-frequency signals at millimeter wave frequencies through the dielectric cover layer.
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公开(公告)号：US20210098882A1
公开(公告)日：2021-04-01
申请号：US16584067
申请日：2019-09-26
Applicant: Apple Inc.
Inventor： Simone Paulotto , Jennifer M. Edwards , Harish Rajagopalan , Bilgehan Avser
Abstract: An electronic device may be provided with a phased antenna array. The array may convey signals greater than 10 GHz and may be formed on a substrate having transmission line layers and antenna layers. An antenna in the array may have a radiating element that includes first, second, and third overlapping patch elements on the antenna layers. The antenna may be fed using a differential transmission line coupled to a differential feed on the first patch element. The differential transmission line may include first and second signal traces. A first via may couple the first signal trace to the first, second, and third patch elements. A second via may couple the second signal trace to the first, second, and third patch elements. The patch elements may introduce capacitances to the radiating element that help to compensate for inductances associated with the distance between the radiating element and the signal traces.
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公开(公告)号：US20210091472A1
公开(公告)日：2021-03-25
申请号：US17112191
申请日：2020-12-04
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Mattia Pascolini
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a probe-fed dielectric resonator antenna. The antenna may include a dielectric resonating element mounted to a flexible printed circuit. A feed probe may be formed from a patch of conductive traces on a sidewall of the resonating element. The feed probe may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the display cover layer. An additional feed probe may be mounted to an orthogonal sidewall of the resonating element for covering additional polarizations. Probe-fed dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the phased antenna array.
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