公开(公告)号：US20240356225A1

公开(公告)日：2024-10-24

申请号：US18306063

申请日：2023-04-24

Applicant: Apple Inc.

Inventor： Trang T. Thai ,  Jennifer M. Edwards ,  Sidharth S. Dalmia ,  Menglu Li ,  Taegui Kim ,  Hai H. Ta

IPC: H01Q9/04 ,  H01Q1/14 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q23/00

CPC classification number: H01Q9/0407 ,  H01Q1/14 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q23/00

Abstract: An electronic device may be provided with a phased antenna array with antennas on an antenna module. The module may include a primary substrate and a secondary substrate mounted to the primary substrate by an interconnect. An antenna may include patch elements in the primary substrate and patch elements in the secondary substrate that are fed using conductive vias. Fences of conductive vias may couple the patch elements in the primary substrate to ground to isolate the patch elements in the primary substrate from the patch elements in the secondary substrate. The secondary substrate may be smaller than the primary substrate, allowing the secondary substrate to fit into relatively small portions of the electronic device while locating the patch elements in the secondary substrates closer to free space, thereby maximizing antenna performance.