Abstract:
An electronic device may have peripheral conductive housing structures divided into first and second segments. First and second antennas may be formed from the segments and may be fed using a flexible printed circuit structure. The structure may include a first substrate attached to the first segment, a second substrate soldered to the first substrate and attached to the second segment, and a third substrate soldered to the second substrate. Third and fourth antennas may be formed on the first substrate whereas fifth and sixth antennas are be formed on the second substrate. The second substrate may be folded and may have a lateral area oriented perpendicular to the third, fourth, fifth, and sixth antennas. Modularly forming the structure in this way may maximize the flexibility with which the structure can accommodate other components, thereby minimizing the space consumption associated with mounting and feeding the antennas without sacrificing wireless performance.
Abstract:
Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. An inverted-F antenna may have first and second short circuit legs and a feed leg. The first and second short circuit legs and the feed leg may be connected to a folded antenna resonating element arm. The antenna resonating element arm and the first short circuit leg may be formed from portions of a conductive electronic device bezel. The folded antenna resonating element arm may have a bend. The bezel may have a gap that is located at the bend. Part of the folded resonating element arm may be formed from a conductive trace on a dielectric member. A spring may be used in connecting the conductive trace to the electronic device bezel portion of the antenna resonating element arm.
Abstract:
A test system is provided for performing radio-frequency tests on an electronic device under test (DUT) having multiple antennas. The test system may include a test unit for generating radio-frequency test signals, a test enclosure, and a test antenna fixture. The test fixture may include tunable antenna circuitry, antenna tuning elements, a test sensor, a microcontroller, a battery, and a solar cell that charges the battery, each of which is mounted on a test fixture within the test enclosure. The test sensor may be used to detect stimuli issued by the DUT. In response to detecting the stimuli, the microcontroller may send control signals to the antenna tuning elements to configure the antenna circuitry in different modes. Each of the different modes may be optimized to test a selected one of the multiple antennas in the DUT when operating using different radio access technologies and at different frequencies.
Abstract:
Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. An inverted-F antenna may have first and second short circuit legs and a feed leg. The first and second short circuit legs and the feed leg may be connected to a folded antenna resonating element arm. The antenna resonating element arm and the first short circuit leg may be formed from portions of a conductive electronic device bezel. The folded antenna resonating element arm may have a bend. The bezel may have a gap that is located at the bend. Part of the folded resonating element arm may be formed from a conductive trace on a dielectric member. A spring may be used in connecting the conductive trace to the electronic device bezel portion of the antenna resonating element arm.
Abstract:
Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.
Abstract:
Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.
Abstract:
A manufacturing system for assembling wireless electronic devices is provided. The manufacturing system may include test stations for testing the radio-frequency performance of components that are to be assembled within the electronic devices. A reference test station may be calibrated using calibration coupons having known radio-frequency characteristics. The calibration coupons may include transmission line structures. The reference test station may measure verification standards to establish baseline measurement data. The verification standards may include circuitry having electrical components with given impedance values. Many verification coupons may be measured to enable testing for a wide range of impedance values. Test stations in the manufacturing system may subsequently measure the verification standards to generate test measurement data. The test measurement data may be compared to the baseline measurement data to characterize the performance of the test stations to ensure consistent test measurements across the test stations.
Abstract:
Radio frequency test systems for characterizing antenna performance in various radio coexistence scenarios are provided. In one suitable arrangement, a test system may be used to perform passive radio coexistence characterization. During passive radio coexistence characterization, at least one signal generator may be used to feed aggressor signals directly to antennas within an electronic device under test (DUT). The aggressor signals may generate undesired interference signals in a victim frequency band, which can then be received and analyzed using a spectrum analyzer. During active radio coexistence characterization, at least one radio communications emulator may be used to communicate with a DUT via a first test antenna. While the DUT is communicating with the at least one radio communications emulator, test signals may also be conveyed between DUT 10 and a second test antenna. Test signals conveyed through the second test antenna may be used in obtaining signal interference level measurements.