公开(公告)号：US20240348961A1

公开(公告)日：2024-10-17

申请号：US18626024

申请日：2024-04-03

Applicant: APPLE INC.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  G01V3/08 ,  H01F7/02 ,  H04B1/38 ,  H04B1/3827 ,  H04R1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H04R1/1016 ,  A45C11/00 ,  A45C13/005 ,  E05F1/1261 ,  E05F3/20 ,  G01V3/081 ,  H01F7/02 ,  H04R1/023 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1091 ,  H05K5/0086 ,  H05K5/0217 ,  H05K5/0226 ,  H05K5/03 ,  A45C2011/001 ,  E05Y2201/224 ,  E05Y2999/00 ,  H04B1/38 ,  H04B2001/3866 ,  H04R1/1025 ,  H04R2400/11 ,  H04R2420/07 ,  H04R2460/11

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US11540039B2

公开(公告)日：2022-12-27

申请号：US17207497

申请日：2021-03-19

Applicant: Apple Inc.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02 ,  H04B1/38 ,  H04B1/3827

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US20210243514A1

公开(公告)日：2021-08-05

申请号：US17234441

申请日：2021-04-19

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Shota Aoyagi ,  Timothy E. Emmott ,  Ethan L. Huwe ,  Mitchell R. Lerner ,  Sean T. McIntosh ,  Yi-Fang D. Tsai ,  Jason C. Della Rosa ,  Patrick W. Sheppard ,  Samuel G. Parker ,  David J. Feathers ,  Brian R. Twehues ,  Daniel Strongwater

IPC: H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

公开(公告)号：US11012770B2

公开(公告)日：2021-05-18

申请号：US16584940

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Shota Aoyagi ,  Timothy E. Emmott ,  Ethan L. Huwe ,  Mitchell R. Lerner ,  Sean T. McIntosh ,  Yi-Fang D. Tsai ,  Jason C. Della Rosa ,  Patrick W. Sheppard ,  Samuel G. Parker ,  David J. Feathers ,  Brian R. Twehues ,  Daniel Strongwater

IPC: H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

公开(公告)号：US10986433B2

公开(公告)日：2021-04-20

申请号：US16584894

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02 ,  H04B1/38 ,  H04B1/3827

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US20200154184A1

公开(公告)日：2020-05-14

申请号：US16733841

申请日：2020-01-03

Applicant: Apple Inc.

Inventor： Meiting Wu ,  Simon K. Porter ,  Glenn K. Trainer ,  Jacob A. Pfitsch ,  Rex P. Price ,  Samuel G. Parker ,  Ethan L. Huwe ,  Craig M. Stanley

IPC: H04R1/02 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R1/26

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US10524044B2

公开(公告)日：2019-12-31

申请号：US15613063

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： John H. Sheerin ,  Samuel G. Parker ,  Ethan L. Huwe ,  Meiting Wu ,  Craig M. Stanley

IPC: H04R1/28 ,  H04R1/02 ,  G06F3/01 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/00 ,  H03K17/96 ,  H05K1/02 ,  G06F3/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R3/12 ,  G06F3/16 ,  F21V3/00 ,  F21V5/00 ,  F21V23/04 ,  F21V33/00 ,  G06F3/044 ,  H01H13/02 ,  H05K1/14

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20180227661A9

公开(公告)日：2018-08-09

申请号：US15613063

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： John H. Sheerin ,  Samuel G. Parker ,  Ethan L. Huwe ,  Meiting Wu ,  Craig M. Stanley

IPC: H04R1/28 ,  H04R1/02 ,  H04R1/40 ,  H04R3/12

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20180220213A1

公开(公告)日：2018-08-02

申请号：US15937587

申请日：2018-03-27

Applicant: Apple Inc.

Inventor： Meiting Wu ,  Simon K. Porter ,  Glenn K. Trainer ,  Jacob A. Pfitsch ,  Rex P. Price ,  Samuel G. Parker ,  Ethan L. Huwe ,  Craig M. Stanley

IPC: H04R1/02 ,  H04R1/40 ,  H04R9/06 ,  H04R9/02

CPC classification number: H04R1/026 ,  H04R1/025 ,  H04R1/26 ,  H04R1/2888 ,  H04R1/403 ,  H04R9/025 ,  H04R9/06 ,  H04R27/00 ,  H04R2201/029 ,  H04R2201/401 ,  H04R2227/003

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20180091894A1

公开(公告)日：2018-03-29

申请号：US15613063

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： John H. Sheerin ,  Samuel G. Parker ,  Ethan L. Huwe ,  Meiting Wu ,  Craig M. Stanley

IPC: H04R1/28 ,  H04R1/02 ,  H04R1/40 ,  H04R3/12

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.