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11.
公开(公告)号:US20210358819A1
公开(公告)日:2021-11-18
申请号:US17317501
申请日:2021-05-11
Applicant: Applied Materials, Inc.
Inventor: Kun Xu , Kiran Lall Shrestha , Doyle E. Bennett , David Maxwell Gage , Benjamin Cherian , Jun Qian , Harry Q. Lee
IPC: H01L21/66 , G06N3/08 , G06F17/15 , H01L21/304
Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.
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公开(公告)号:US20140273296A1
公开(公告)日:2014-09-18
申请号:US13840554
申请日:2013-03-15
Applicant: Applied Materials, Inc.
Inventor: Kiran Lall Shrestha
IPC: H01L21/66
CPC classification number: H01L22/26 , B24B37/005 , B24B49/12 , H01L22/12
Abstract: A method of controlling polishing of a substrate is described. A controller stores a library having a plurality of reference spectra. The controller polishes a substrate and measures a sequence of spectra of light from the substrate during polishing. For each measured spectrum of the sequence of spectra, the controller finds a best matching reference spectrum from the plurality of reference spectra and generates a sequence of best matching reference spectra. The controller uses a cell counting technique for finding the best matching reference spectrum. The controller determines at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra.
Abstract translation: 描述了一种控制衬底抛光的方法。 控制器存储具有多个参考光谱的库。 控制器抛光衬底并且在抛光期间测量来自衬底的光的光谱序列。 对于光谱序列的每个测量光谱,控制器从多个参考光谱中找到最佳匹配的参考光谱,并产生最佳匹配参考光谱的序列。 控制器使用细胞计数技术来找到最佳匹配参考光谱。 控制器基于最佳匹配参考光谱的顺序来确定抛光终点或抛光速率的调整中的至少一个。
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13.
公开(公告)号:US12136574B2
公开(公告)日:2024-11-05
申请号:US18471893
申请日:2023-09-21
Applicant: Applied Materials, Inc.
Inventor: Kun Xu , Kiran Lall Shrestha , Doyle E. Bennett , David Maxwell Gage , Benjamin Cherian , Jun Qian , Harry Q. Lee
IPC: H01L21/304 , B24B37/013 , B24B49/10 , G06F17/15 , G06N3/08 , H01L21/321 , H01L21/66
Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.
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公开(公告)号:US12090599B2
公开(公告)日:2024-09-17
申请号:US18365527
申请日:2023-08-04
Applicant: Applied Materials, Inc.
Inventor: Kun Xu , Benjamin Cherian , Jun Qian , Kiran Lall Shrestha
IPC: B24B37/00 , B24B37/013 , G05B19/418 , G06N3/045 , G06N3/08 , H01L23/00
CPC classification number: B24B37/013 , G05B19/4188 , G06N3/045 , G06N3/08 , H01L23/00 , G05B2219/32335
Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.
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15.
公开(公告)号:US20210407066A1
公开(公告)日:2021-12-30
申请号:US17359345
申请日:2021-06-25
Applicant: Applied Materials, Inc.
Inventor: Sivakumar Dhandapani , Arash Alahgholipouromrani , Dominic J. Benvegnu , Jun Qian , Kiran Lall Shrestha
IPC: G06T7/00 , G06T7/60 , B24B37/013
Abstract: A neural network is trained for use in a substrate thickness measurement system by obtaining ground truth thickness measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to thickness measurements for the top layer in the die region. The training is performed using training data that includes the plurality of color images and ground truth thickness measurements with each respective color image paired with a ground truth thickness measurement for the die region associated with the respective color image.
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16.
公开(公告)号:US20210379723A1
公开(公告)日:2021-12-09
申请号:US17280163
申请日:2018-09-26
Applicant: APPLIED MATERIALS, INC.
Inventor: Kun Xu , David Maxwell Gage , Harry Q. Lee , Denis Anatolyevich Ivanov , Hassan G. Iravani , Doyle E. Bennett , Kiran Lall Shrestha
IPC: B24B37/013 , H01L21/66
Abstract: A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modified reference trace represents measurements of a bare doped reference semiconductor wafer by an in-situ electromagnetic induction monitoring system as modified by a neutral network. The substrate is monitored with an in-situ electromagnetic induction monitoring system to generate a measured trace that depends on a thickness of the conductive layer, and at least a portion of the measured trace is applied to a neural network to generate a modified measured trace. An adjusted trace is generated, including subtracting the modified reference trace from the modified measured trace.
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公开(公告)号:US09482610B2
公开(公告)日:2016-11-01
申请号:US13674667
申请日:2012-11-12
Applicant: Applied Materials, Inc.
Inventor: Kiran Lall Shrestha , Boguslaw A. Swedek , Jeffrey Drue David , Harry Q. Lee
IPC: G01R23/16 , G01N21/47 , B24B49/12 , B24B37/005 , H01L21/66
CPC classification number: G01N21/47 , B24B37/005 , B24B49/12 , H01L22/12 , H01L22/20
Abstract: A method of controlling processing of a substrate includes measuring a spectrum reflected from the substrate, for each partition of a plurality of partitions of the measured spectrum, computing a partition value based on the measured spectrum within the partition to generate a plurality of partition values, for each reference spectrum signature of a plurality of reference spectrum signatures, determining a membership function for each partition, for each partition, computing a membership value based on the membership function for the partition and the partition value for the partition to generate a plurality of groups of membership values with each group of the plurality of groups associated with a reference spectrum signature, selecting a best matching reference spectrum signature from the plurality of reference spectra signatures based on the plurality of groups of membership values, and determining a characterizing value associated with the best matching reference spectrum signature.
Abstract translation: 一种控制衬底处理的方法包括:测量从所述衬底反射的光谱,对于测量光谱的多个分区的每个分区,基于所述分区内的测量光谱计算分区值,以生成多个分区值, 对于多个参考频谱签名的每个参考频谱签名,为每个分区确定每个分区的隶属函数,基于分区的隶属函数和分区的分区值计算隶属度值以生成多个组 与参考频谱签名相关联的多个组的每个组的成员资格值,基于所述多个隶属度值组从所述多个参考频谱签名中选择最佳匹配参考频谱签名,以及确定与所述参考频谱签名相关联的特征值 最佳匹配参考频谱签名 。
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公开(公告)号:US20140134758A1
公开(公告)日:2014-05-15
申请号:US13674667
申请日:2012-11-12
Applicant: Applied Materials, Inc.
Inventor: Kiran Lall Shrestha , Boguslaw A. Swedek , Jeffrey Drue David , Harry Q. Lee
IPC: H01L21/66
CPC classification number: G01N21/47 , B24B37/005 , B24B49/12 , H01L22/12 , H01L22/20
Abstract: A method of controlling processing of a substrate includes measuring a spectrum reflected from the substrate, for each partition of a plurality of partitions of the measured spectrum, computing a partition value based on the measured spectrum within the partition to generate a plurality of partition values, for each reference spectrum signature of a plurality of reference spectrum signatures, determining a membership function for each partition, for each partition, computing a membership value based on the membership function for the partition and the partition value for the partition to generate a plurality of groups of membership values with each group of the plurality of groups associated with a reference spectrum signature, selecting a best matching reference spectrum signature from the plurality of reference spectra signatures based on the plurality of groups of membership values, and determining a characterizing value associated with the best matching reference spectrum signature.
Abstract translation: 一种控制衬底处理的方法包括:测量从所述衬底反射的光谱,对于测量光谱的多个分区的每个分区,基于所述分区内的测量光谱计算分区值,以生成多个分区值, 对于多个参考频谱签名的每个参考频谱签名,为每个分区确定每个分区的隶属函数,基于分区的隶属函数和分区的分区值计算隶属度值以生成多个组 与参考频谱签名相关联的多个组的每个组的成员资格值,基于所述多个隶属度值组从所述多个参考频谱签名中选择最佳匹配参考频谱签名,以及确定与所述参考频谱签名相关联的特征值 最佳匹配参考频谱签名 。
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公开(公告)号:US12272047B2
公开(公告)日:2025-04-08
申请号:US18496303
申请日:2023-10-27
Applicant: Applied Materials, Inc
Inventor: Sivakumar Dhandapani , Arash Alahgholipouromrani , Dominic J. Benvegnu , Jun Qian , Kiran Lall Shrestha
IPC: G06T7/00 , B24B37/013 , G06T7/60
Abstract: A neural network is trained for use in a substrate residue classification system by obtaining ground truth residue level measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to residue level measurements for the top layer in the die region.
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公开(公告)号:US20240054634A1
公开(公告)日:2024-02-15
申请号:US18496303
申请日:2023-10-27
Applicant: Applied Materials, Inc
Inventor: Sivakumar Dhandapani , Arash Alahgholipouromrani , Dominic J. Benvegnu , Jun Qian , Kiran Lall Shrestha
IPC: G06T7/00 , G06T7/60 , B24B37/013
CPC classification number: G06T7/001 , G06T7/60 , B24B37/013 , G06T2207/30148 , G06T2207/20081 , G06T2207/20084 , G06T2207/10024 , G06T2207/20021
Abstract: A neural network is trained for use in a substrate residue classification system by obtaining ground truth residue level measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to residue level measurements for the top layer in the die region.
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