公开(公告)号：US20220404712A1

公开(公告)日：2022-12-22

申请号：US17772529

申请日：2020-10-01

Applicant: ASML NETHERLANDS B.V.

Inventor： Qiang ZHANG ,  Yunbo GUO ,  Yu CAO ,  Jen-Shiang WANG ,  Yen-Wen LU ,  Danwu CHEN ,  Pengcheng YANG ,  Haoyi LIANG ,  Zhichao CHEN ,  Lingling PU

IPC: G03F7/20 ,  G06V10/774 ,  G06V10/82 ,  G06T7/32 ,  G06T7/33

Abstract: A method for training a machine learning model to generate a predicted measured image, the method including obtaining (a) an input target image associated with a reference design pattern, and (b) a reference measured image associated with a specified design pattern printed on a substrate, wherein the input target image and the reference measured image are non-aligned images; and training, by a hardware computer system and using the input target image, the machine learning model to generate a predicted measured image.

公开(公告)号：US20220068590A1

公开(公告)日：2022-03-03

申请号：US17418741

申请日：2019-12-19

Applicant: ASML Netherlands B.V.

Inventor： Ying LUO ,  Zhonghua DONG ,  Xuehui YIN ,  Long DI ,  Nianpei DENG ,  Wei FANG ,  Lingling PU ,  Ruochong FEI ,  Bohang ZHU ,  Yu LIU

IPC: H01J37/147 ,  H01J37/20 ,  H01J37/21 ,  H01J37/28

Abstract: Systems and methods for irradiating a sample with a charged-particle beam are disclosed. The charged-particle beam system may comprise a stage configured to hold a sample and is movable in at least one of X-Y-Z axes. The charged-particle beam system may further comprise a position sensing system to determine a lateral and vertical displacement of the stage, and a beam deflection controller configured to apply a first signal to deflect a primary charged-particle beam incident on the sample to at least partly compensate for the lateral displacement, and to apply a second signal to adjust a focus of the deflected charged-particle beam incident on the sample to at least partly compensate for the vertical displacement of the stage. The first and second signals may comprise an electrical signal having a high bandwidth in a range of 10 kHz to 50 kHz, and 50 kHz to 200 kHz, respectively.

公开(公告)号：US20250102923A1

公开(公告)日：2025-03-27

申请号：US18716117

申请日：2022-11-18

Applicant: ASML Netherlands B.V.

Inventor： Lingling PU ,  Zijian DU

IPC: G03F7/00

Abstract: A method for processing images for metrology using a charged particle beam tool may include obtaining, from the charged particle beam tool, an image of a portion of a sample. The method may further include processing the image using a first image processing module to generate a processed image. The method may further include determining image quality characteristics of the processed image and determining whether the image quality characteristics of the processed image satisfy predetermined imaging criteria. The method may further include in response to the image quality characteristics of the processed image not satisfying the imaging criteria, updating a tuning condition of the charged-particle beam tool, acquiring an image of the portion of the sample using the charged-particle beam tool that has the updated tuning condition, and processing the acquired image using the first image processing module to enable the processed acquired image to satisfy the predetermined imaging criteria.

公开(公告)号：US20250003899A1

公开(公告)日：2025-01-02

申请号：US18708929

申请日：2022-10-14

Applicant: ASML Netherlands B.V.

Inventor： Tim HOUBEN ,  Maxim PISARENCO ,  Thomas Jarik HUISMAN ,  Lingling PU ,  Jian ZHOU ,  Liangjiang YU ,  Yi-Hsin CHANG ,  Yun-Ling YEH

IPC: G01N23/2251 ,  G06T7/00

Abstract: Systems and methods for image analysis include obtaining a plurality of simulation images and a plurality of non-simulation images both associated with a sample under inspection, at least one of the plurality of simulation images being a simulation image of a location on the sample not imaged by any of the plurality of non-simulation images; and training an unsupervised domain adaptation technique using the plurality of simulation images and the plurality of non-simulation images as inputs to reduce a difference between first intensity gradients of the plurality of simulation images and second intensity gradients of the plurality of non-simulation images.

公开(公告)号：US20230117237A1

公开(公告)日：2023-04-20

申请号：US17799576

申请日：2021-01-27

Applicant: ASML Netherlands B.V.

Inventor： Lingling PU ,  Wei FANG

IPC: G06T5/00 ,  G06V10/44 ,  G06V10/26 ,  G06T5/50 ,  G06T7/00

Abstract: An improved apparatus and method for extracting pattern contour information from an inspection image in a multiple charged-particle beam inspection system are disclosed. An improved method for extracting pattern contour information from an inspection image comprises identifying, from an inspection image obtained from a charged-particle beam inspection system, a first pattern and a second pattern that partially overlap in the inspection image. The method also comprises generating a first separation image by removing an image area corresponding to the second pattern from the inspection image. The first separation image includes the first pattern of which a first part is removed when removing the image area corresponding to the second pattern. The method also comprises updating the first separation image to include image data representing the removed first part of the first pattern based on a first reference image corresponding to the first pattern.

公开(公告)号：US20230012946A1

公开(公告)日：2023-01-19

申请号：US17786190

申请日：2020-12-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Wei FANG ,  Zhengwei ZHOU ,  Lingling PU

IPC: H01J37/28 ,  H01J37/24 ,  H01J37/26 ,  H01J37/244

Abstract: A system and method for defect inspection using voltage contrast in a charged particle system are provided. Some embodiments of the system and method include positioning the stage at a first position to enable a first beam of the plurality of beams to scan a first surface area of the wafer at a first time to generate a first image associated with the first surface area; positioning the stage at a second position to enable a second beam of the plurality of beams to scan the first surface area at a second time to generate a second image associated with the first surface area; and comparing the first image with the second image to enable detecting whether a defect is identified in the first surface area of the wafer.

公开(公告)号：US20220319805A1

公开(公告)日：2022-10-06

申请号：US17639322

申请日：2020-08-20

Applicant: ASML Netherlands B.V.

Inventor： Wei FANG ,  Lingling PU

IPC: H01J37/26 ,  H01J37/28

Abstract: Systems and methods for image enhancement are disclosed. A method for enhancing an image may include receiving records of a performance metric for beams of the multi-beam system in an imaging process, each record associated with a beam. The method may also include determining whether an abnormality of a beam occurs based on a baseline value determined using a portion of the records. The method may further include providing an abnormality indication in response to the determination that the abnormality has occurred.

公开(公告)号：US20200074610A1

公开(公告)日：2020-03-05

申请号：US16554110

申请日：2019-08-28

Applicant: ASML Netherlands B.V.

Inventor： Lingling PU ,  Wei FANG ,  Nan ZHAO ,  Wentian ZHOU ,  Teng WANG ,  Ming XU

IPC: G06T7/00 ,  G06T7/60

Abstract: Systems and methods for optimal electron beam metrology guidance are disclosed. According to certain embodiments, the method may include receiving an acquired image of a sample, determining a set of image parameters based on an analysis of the acquired image, determining a set of model parameters based on the set of image parameters, generating a set of simulated images based on the set of model parameters. The method may further comprise performing measurement of critical dimensions on the set of simulated images and comparing critical dimension measurements with the set of model parameters to provide a set of guidance parameters based on comparison of information from the set of simulated images and the set of model parameters. The method may further comprise receiving auxiliary information associated with target parameters including critical dimension uniformity.

公开(公告)号：US20250078478A1

公开(公告)日：2025-03-06

申请号：US18882681

申请日：2024-09-11

Applicant: ASML Netherlands B.V.

Inventor： Wentian ZHOU ,  Liangjiang YU ,  Teng WANG ,  Lingling PU ,  Wei FANG

IPC: G06V10/774 ,  G06F18/214 ,  G06T7/00 ,  G06V10/776 ,  G06V10/98

Abstract: Disclosed herein is a method of automatically obtaining training images to train a machine learning model that improves image quality. The method may comprise analyzing a plurality of patterns of data relating to a layout of a product to identify a plurality of training locations on a sample of the product to use in relation to training the machine learning model. The method may comprise obtaining a first image having a first quality for each of the plurality of training locations, and obtaining a second image having a second quality for each of the plurality of training locations, the second quality being higher than the first quality. The method may comprise using the first image and the second image to train the machine learning model.

公开(公告)号：US20250006456A1

公开(公告)日：2025-01-02

申请号：US18787932

申请日：2024-07-29

Applicant: ASML Netherlands B.V.

Inventor： Wei FANG ,  Lingling PU ,  Bo WANG ,  Zhonghua DONG ,  Yongxin WANG

IPC: H01J37/22 ,  G01N23/2251 ,  G06T5/50 ,  G06T5/77 ,  G06T5/80 ,  H01J37/244 ,  H01J37/28

Abstract: An improved apparatus and method for enhancing an image, and more particularly an apparatus and method for enhancing an image through cross-talk cancellation in a multiple charged-particle beam inspection are disclosed. An improved method for enhancing an image includes acquiring a first image signal of a plurality of image signals from a detector of a multi-beam inspection system. The first image signal corresponds to a detected signal from a first region of the detector on which electrons of a first secondary electron beam and of a second secondary electron beam are incident. The method includes reducing, from the first image signal, cross-talk contamination originating from the second secondary electron beam using a relationship between the first image signal and beam intensities associated with the first secondary electron beam and the second secondary electron beam. The method further includes generating a first image corresponding to first secondary electron beam after reduction.