Abstract:
A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of an electronic component such as a thin film electronic component. The planarization layer may be provided in multiple sub layers. The planarization layer may smooth over roughness caused by removal of material from a blank to form burls on the substrate holder.
Abstract:
A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of an electronic component such as a thin film electronic component. The planarization layer may be provided in multiple sub layers. The planarization layer may smooth over roughness caused by removal of material from a blank to form burls on the substrate holder.
Abstract:
A system including: a substrate support configured to hold a substrate; a conductive or semi-conductive element contacting the substrate support and covering at least part of the substrate support; and a charging device configured to apply a positive potential to the conductive or semi-conductive element with respect to the part of the substrate support that is covered by the conductive or semi-conductive element.
Abstract:
A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of an electronic component such as a thin film electronic component. The planarization layer may be provided in multiple sub layers. The planarization layer may smooth over roughness caused by removal of material from a blank to form burls on the substrate holder.
Abstract:
A substrate holder for use in a lithographic apparatus, the substrate holder including: a main body having a surface; a plurality of burls projecting from the surface and having end surfaces to support a substrate; and a thin film stack on the main body surface and forming an electric component, the thin film stack having a conductive layer configured to distribute electrical charge substantially uniformly throughout a plane of the stack in which the conductive layer is positioned.
Abstract:
A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of an electronic component such as a thin film electronic component. The planarization layer may be provided in multiple sub layers. The planarization layer may smooth over roughness caused by removal of material from a blank to form burls on the substrate holder.
Abstract:
An object holder for a lithographic apparatus has a main body having a surface. A plurality of burls to support an object is formed on the surface or in apertures of a thin-film stack. At least one of the burls is formed by laser-sintering. At least one of the burls formed by laser-sintering may be a repair of a damaged burl previously formed by laser-sintering or another method.
Abstract:
An object holder (100) for a lithographic apparatus has a main body (400) having a surface (400a). A plurality of burls (406) to support an object are formed on the surface or in apertures of a thin-film stack (410, 440, 450). At least one of the burls is formed by laser-sintering. At least one of the burls formed by laser-sintering may be a repair of a damaged burl previously formed by laser-sintering or another method.
Abstract:
A substrate holder for use in a lithographic apparatus, the substrate holder including: a main body; a plurality of first burls provided on a first side of the main body and having end surfaces to support a substrate, wherein the first burls each include CrN; and a plurality of second burls provided on a second side of the main body.
Abstract:
An object holder for a lithographic apparatus has a main body having a surface. A plurality of burls to support an object is formed on the surface or in apertures of a thin-film stack. At least one of the burls is formed by laser-sintering. At least one of the burls formed by laser-sintering may be a repair of a damaged burl previously formed by laser-sintering or another method.