Method for process metrology
    11.
    发明授权

    公开(公告)号:US12007697B2

    公开(公告)日:2024-06-11

    申请号:US17836066

    申请日:2022-06-09

    CPC classification number: G03F7/70625 G03F7/70641

    Abstract: A method of evaluating a patterning process, the method including: obtaining the result of a first measurement of a first metrology target; obtaining the result of a second measurement of a second metrology target, the second metrology target having a structural difference from the first metrology target that generates a sensitivity difference and/or an offset, of a process parameter of the patterning process between the first and second metrology targets; and determining a value pertaining to the patterning process based on the results of the first and second measurements.

    Method of Determining Dose and Focus, Inspection Apparatus, Patterning Device, Substrate and Device Manufacturing Method
    17.
    发明申请
    Method of Determining Dose and Focus, Inspection Apparatus, Patterning Device, Substrate and Device Manufacturing Method 有权
    确定剂量和焦点的方法,检测装置,图案化装置,基板和装置制造方法

    公开(公告)号:US20150293458A1

    公开(公告)日:2015-10-15

    申请号:US14648445

    申请日:2013-11-22

    Abstract: A method of determining exposure dose of a lithographic apparatus used in a lithographic process on a substrate. Using the lithographic process to produce a first structure on the substrate, the first structure having a dose-sensitive feature which has a form that depends on exposure dose of the lithographic apparatus on the substrate. Using the lithographic process to produce a second structure on the substrate, the second structure having a dose-sensitive feature which has a form that depends on the exposure dose of the lithographic apparatus but which has a different sensitivity to the exposure dose than the first structure. Detecting scattered radiation while illuminating the first and second structures with radiation to obtain first and second scatterometer signals. Using the first and second scatterometer signals to determine an exposure dose value used to produce at least one of the first and second structures.

    Abstract translation: 一种确定在光刻工艺中使用的光刻设备在衬底上的曝光剂量的方法。 使用光刻工艺在衬底上产生第一结构,第一结构具有剂量敏感特征,其具有取决于光刻设备在衬底上的曝光剂量的形式。 使用光刻工艺在衬底上产生第二结构,第二结构具有剂量敏感特征,其具有取决于光刻设备的曝光剂量但与第一结构具有不同于曝光剂量的灵敏度的形式 。 检测散射辐射,同时用辐射照射第一和第二结构,以获得第一和第二散射仪信号。 使用第一和第二散射仪信号来确定用于产生第一和第二结构中的至少一个的曝光剂量值。

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