公开(公告)号：US20220035259A1

公开(公告)日：2022-02-03

申请号：US17501911

申请日：2021-10-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Hakki Ergün CEKLI ,  Masashi ISHIBASHI ,  Wendy Johanna Martina VAN DE VEN ,  Willem Seine Christian ROELOFS ,  Elliott Gerard MC NAMARA ,  Rizvi RAHMAN ,  Michiel KUPERS ,  Emil Peter SCHMITT-WEAVER ,  Erik Henri Adriaan DELVIGNE

IPC: G03F7/20 ,  G01N21/956 ,  G03F9/00 ,  H01L21/66

Abstract: Measurements are obtained from locations across a substrate before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of a performance parameter such as overlay, after a pattern has been applied. A set of measurement locations is selected from among all possible measurement locations. At least a subset of the selected measurement locations are selected dynamically, in response to measurements obtained using a preliminary selection of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect, outlier measurements are detected based on supplementary data such as height measurements or historic data.

公开(公告)号：US20200004164A1

公开(公告)日：2020-01-02

申请号：US16480706

申请日：2018-01-03

Applicant: ASML NETHERLANDS B.V.

Inventor： Emil Peter SCHMITT-WEAVER ,  Kaustuve BHATTACHARYYA ,  Wim Tjibbo TEL ,  Frank STAALS ,  Leon Martin LEVASIER

IPC: G03F7/20 ,  G03F9/00

Abstract: A method for monitoring a lithographic process, and associated lithographic apparatus. The method includes obtaining height variation data relating to a substrate supported by a substrate support and fitting a regression through the height variation data, the regression approximating the shape of the substrate; residual data between the height variation data and the regression is determined; and variation of the residual data is monitored over time. The residual data may be deconvolved based on known features of the substrate support.

公开(公告)号：US20190137892A1

公开(公告)日：2019-05-09

申请号：US16098165

申请日：2017-04-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Hakki Ergün CEKLI ,  Masashi ISHIBASHI ,  Wendy Johanna Marthina VAN DE VEN ,  Willem Seine Christian ROELOFS ,  Elliott Gerard MC NAMARA ,  Rizvi RAHMAN ,  Michiel KUPERS ,  Emil Peter SCHMITT-WEAVER ,  Erilk Henri Adriaan DELVIGNE

IPC: G03F7/20 ,  G03F9/00 ,  G01N21/956 ,  H01L21/66

Abstract: Measurements are obtained from locations across a substrate before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of a performance parameter such as overlay, after a pattern has been applied. A set of measurement locations is selected from among all possible measurement locations. At least a subset of the selected measurement locations are selected dynamically, in response to measurements obtained using a preliminary selection of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect, outlier measurements are detected based on supplementary data such as height measurements or historic data.

公开(公告)号：US20190094713A1

公开(公告)日：2019-03-28

申请号：US16085608

申请日：2017-04-04

Applicant: ASML NETHERLANDS B.V.

Inventor： Rene Marinus Gerardus Johan QUEENS ,  Emil Peter SCHMITT-WEAVER

IPC: G03F7/20

CPC classification number: G03F7/70641 ,  G03F7/70625 ,  G03F9/7026

Abstract: A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A functional relationship between local height deviations across a substrate and focus information, such as a determined focus amount, is determined for a substrate, e.g., a reference substrate. Height deviations are subsequently measured for another substrate, e.g. a production substrate. The height deviations for the subsequent substrate and the functional relationship are used to determine predicted focus information for the subsequent substrate. The predicted focus information is then used to control the lithographic apparatus to apply a product pattern to the product substrate.

公开(公告)号：US20160370711A1

公开(公告)日：2016-12-22

申请号：US15121340

申请日：2014-12-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Emil Peter SCHMITT-WEAVER ,  Wolfgang HENKE ,  Christopher PRENTICE ,  Frank STAALS ,  Wim Tjibbo TEL

IPC: G03F7/20

CPC classification number: G03F7/70641 ,  G03F7/70725 ,  G03F9/7019 ,  G03F9/7026 ,  G03F9/7092

Abstract: A lithographic apparatus applies a pattern onto a substrate using an optical projection system. The apparatus includes an optical level sensor and an associated processor for obtaining a height map of the substrate surface prior to applying the pattern. A controller uses the height map to control focusing with respect to the projection system when applying the pattern. The processor is further arranged to use information relating to processing previously applied to the substrate to define at least first and second regions of the substrate and to vary the manner in which the measurement signals are used to control the focusing, between the first and second regions. For example, an algorithm to calculate height values from optical measurement signals can be varied according to differences in known structure and/or materials. Measurements from certain regions can be selectively excluded from calculation of the height map and/or from use in the focusing.

Abstract translation: 光刻设备使用光学投影系统将图案施加到基板上。 该装置包括光学水平传感器和相关联的处理器，用于在施加图案之前获得衬底表面的高度图。 当应用图案时，控制器使用高度图来控制相对于投影系统的聚焦。 处理器还被布置成使用与先前施加到衬底上的处理相关的信息来限定衬底的至少第一和第二区域，并且改变在第一和第二区域之间使用测量信号来控制聚焦的方式 。 例如，可以根据已知结构和/或材料的差异来改变从光学测量信号计算高度值的算法。 可以从高度图的计算和/或聚焦中的使用中选择性地排除来自某些区域的测量。

公开(公告)号：US20140168627A1

公开(公告)日：2014-06-19

申请号：US14069287

申请日：2013-10-31

Applicant: ASML Netherlands B.V.

Inventor： Emil Peter SCHMITT-WEAVER ,  Paul Frank Luehrmann ,  Eduardus Johannes Gerardus Boon ,  Daan Maurits Slotboom ,  Jean-Philippe Xavier Van Damme ,  Wolfgang Henke ,  Alexander Ypma ,  Marc Jurian Kea

IPC: G03F7/20

CPC classification number: G03F7/70908 ,  G03F7/707 ,  G03F7/7085 ,  G03F7/70916 ,  G03F9/70

Abstract: A reticle is loaded into a lithographic apparatus. The apparatus performs measurements on the reticle, so as to calculate alignment parameters for transferring the pattern accurately to substrates. Tests are performed to detect possible contamination of the reticle or its support. Either operation proceeds with a warning, or the patterning of substrates is stopped. The test uses may use parameters of the alignment model itself, or different parameters. The integrity parameters may be compared against reference values reflecting historic measurements, so that sudden changes in a parameter are indicative of contamination. Integrity parameters may be calculated from residuals of the alignment model. In an example, height residuals are used to calculate parameters of residual wedge (Rx′) and residual roll (Ryy′). From these, integrity parameters expressed as height deviations are calculated and compared against thresholds.

Abstract translation: 将掩模版加载到光刻设备中。 该装置对掩模版进行测量，以便计算用于将图案精确地转印到基底上的对准参数。 执行测试以检测掩模版或其支撑体的可能污染。 任一操作都进行警告，或者停止基板的图案化。 测试使用可以使用对齐模型本身的参数或不同的参数。 可以将完整性参数与反映历史测量的参考值进行比较，使得参数中的突然变化指示污染。 可以从对齐模型的残差计算完整性参数。 在一个例子中，高度残差用于计算残余楔（Rx'）和残余辊（Ryy'）的参数。 从这些，计算表示为高度偏差的完整性参数，并将其与阈值进行比较。