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1.
公开(公告)号:US20180239267A1
公开(公告)日:2018-08-23
申请号:US15752658
申请日:2016-08-23
Applicant: ASML NETHERLANDS B.V.
Inventor: Rene Marinus Gerardus Johan QUEENS , Arend Johannes DONKERBROEK , Pietro ANDRICCIOLA , Ewoud Frank VAN WEST
IPC: G03F9/00
CPC classification number: G03F9/7026 , G03F9/7019 , G03F9/7034 , G03F9/7049 , G03F9/7057 , G03F9/7088 , G03F9/7092
Abstract: A lithographic apparatus uses a height sensor to obtain height sensor data representing a topographical variation across a substrate. The height sensor data is used to control focusing of a device pattern at multiple locations across the substrate. A controller identifies one or more first areas where height sensor data is judged to be reliable and one or more second areas where the height sensor data is judged to be less reliable. Substitute height data is calculated for the second areas using height sensor data for the first areas together with prior knowledge of expected device-specific topography. The focusing of the lithographic apparatus is controlled using a combination of the height data from the sensor and the substitute height data.
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2.
公开(公告)号:US20190384188A1
公开(公告)日:2019-12-19
申请号:US16479959
申请日:2017-12-20
Applicant: ASML NETHERLANDS B.V.
Inventor: Rene Marinus Gerardus Johan QUEENS , Wolfgang Helmut HENKE , Arend Johannes DONKERBROEK , Jeroen COTTAAR
IPC: G03F9/00
Abstract: A method of controlling a lithographic apparatus to manufacture a plurality of devices, the method including: obtaining a parameter map representing a parameter variation across a substrate by measuring the parameter at a plurality of points on the substrate; decomposing the parameter map into a plurality of components, including a first parameter map component representing parameter variations associated with the device pattern and one or more further parameter map components representing other parameter variations; deriving a scale factor, configured to correct for errors in measurement of the parameter variation, from measurements of a second parameter of a substrate; and controlling the lithographic apparatus using the parameter map and scale factor to apply a device pattern at multiple locations across the substrate.
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3.
公开(公告)号:US20180210351A1
公开(公告)日:2018-07-26
申请号:US15743661
申请日:2016-07-05
Applicant: ASML NETHERLANDS B.V.
CPC classification number: G03F9/7026 , G03F7/70616 , G03F9/7034 , G03F9/7046 , G03F9/7049
Abstract: A lithographic apparatus applies a device pattern at multiple fields across a substrate. A height map is decomposed into a plurality of components. A first height map component represents topographical variations associated with the device pattern. One or more further height map components represent other topographical variations. Using each height map component, control set-points are calculated according to a control algorithm specific to each component. The control set-points calculated for the different height map components are then combined and used to control imaging of the device pattern to the substrate. The specific control algorithms can be different from one another, and may have differing degrees of nonlinearity. The combining of the different set-points can be linear. Focus control in the presence of device-specific topography and other local variations can be improved.
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4.
公开(公告)号:US20200081355A1
公开(公告)日:2020-03-12
申请号:US15748643
申请日:2016-08-09
Applicant: ASML NETHERLANDS B.V.
Inventor: Rene Marinus Gerardus Johan QUEENS
Abstract: A lithographic apparatus is used to manufacture a plurality of devices on a substrate. A height map is obtained representing a topographical variation across the substrate. Using the height map the apparatus controls imaging of a field pattern at multiple field locations across the substrate. The field pattern includes a plurality of individual device areas. For field locations near the substrate's edge, the height map data is used selectively so as to ignore topographical variations in one or more individual device areas. Whether a device area is to be ignored is determined at least partly based on the height map data obtained for the current exposure. Alternatively or in addition, the selection can be based on measurements made at the corresponding device area and field location on one or more prior substrates, and/or on the same substrate in a previous layer.
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公开(公告)号:US20190094713A1
公开(公告)日:2019-03-28
申请号:US16085608
申请日:2017-04-04
Applicant: ASML NETHERLANDS B.V.
IPC: G03F7/20
CPC classification number: G03F7/70641 , G03F7/70625 , G03F9/7026
Abstract: A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A functional relationship between local height deviations across a substrate and focus information, such as a determined focus amount, is determined for a substrate, e.g., a reference substrate. Height deviations are subsequently measured for another substrate, e.g. a production substrate. The height deviations for the subsequent substrate and the functional relationship are used to determine predicted focus information for the subsequent substrate. The predicted focus information is then used to control the lithographic apparatus to apply a product pattern to the product substrate.
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