公开(公告)号：US20140252595A1

公开(公告)日：2014-09-11

申请号：US13789382

申请日：2013-03-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Han-Chee Yen ,  Shih-Yuan Chen ,  Chien-Pai Lai ,  Ming-Hsien Cheng

IPC: H01L23/498

CPC classification number: H01L23/498 ,  H01L21/561 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/73259 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括衬底，半导体芯片，封装体和天线层。 半导体芯片设置在基板上。 封装体封装半导体芯片并且包括上表面。 天线层形成在封装主体的上表面上并且包括连接在一起的两个天线插槽组。 每个天线槽组包括沿着第一方向延伸的波导槽和沿着第二方向延伸的照射槽群，其中照射槽组连接到波导槽。