公开(公告)号：US10177283B2

公开(公告)日：2019-01-08

申请号：US15492808

申请日：2017-04-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsun-Wei Chan

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62

Abstract: An LED package with trenches traversing a die pad to provide a mechanical interlock mechanism to strengthen bonding between the die pad and an insulator such that de-lamination is less likely to occur between the die pad and the insulator. A chip carrying region is defined by a barrier portion formed by the insulator in the trenches and in gaps between electrodes and the die pad, such that a light converting layer is confined within the barrier portion.

公开(公告)号：US10069051B2

公开(公告)日：2018-09-04

申请号：US15403057

申请日：2017-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: H01L33/58 ,  H01L21/56 ,  H01L33/56 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00 ,  H01L25/16

Abstract: A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.

公开(公告)号：US20170110426A1

公开(公告)日：2017-04-20

申请号：US15294598

申请日：2016-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Han Chen ,  Hsun-Wei Chan ,  Mei-Yi Wu

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L23/10 ,  H01L23/04 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/16153 ,  H01L2924/164 ,  H01L2224/45099

Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.

公开(公告)号：US12094995B2

公开(公告)日：2024-09-17

申请号：US17899552

申请日：2022-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin Tsai ,  Yu-Che Huang ,  Hsun-Wei Chan

IPC: H01L31/12

CPC classification number: H01L31/125

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

公开(公告)号：US12040422B2

公开(公告)日：2024-07-16

申请号：US17899552

申请日：2022-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin Tsai ,  Yu-Che Huang ,  Hsun-Wei Chan

IPC: H01L31/12

CPC classification number: H01L31/125

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

公开(公告)号：US11588081B2

公开(公告)日：2023-02-21

申请号：US16809506

申请日：2020-03-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Shih-Chieh Tang ,  Lu-Ming Lai

IPC: H01L33/58

Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.

公开(公告)号：US11276797B2

公开(公告)日：2022-03-15

申请号：US16384847

申请日：2019-04-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng Tsai ,  Lu-Ming Lai ,  Hsun-Wei Chan ,  Ying-Chung Chen

IPC: H01L31/12 ,  H01L31/0203 ,  H01L31/0232

Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.

公开(公告)号：US10508910B2

公开(公告)日：2019-12-17

申请号：US14975083

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Kuang-Hsiung Chen

IPC: G01C3/08

Abstract: An optical module includes a carrier, a light source disposed on an upper side of the carrier, an optical sensor disposed on the upper side of the carrier, and a housing disposed on the upper side of the carrier over the light source and the optical sensor. The housing defines a first aperture exposing at least a portion of the light source and a second aperture exposing at least a portion of the optical sensor. An outer sidewall of the housing includes at least one singulation portion adjacent to the upper side of the carrier and perpendicular to the upper side of the carrier.

公开(公告)号：US10381294B2

公开(公告)日：2019-08-13

申请号：US15396087

申请日：2016-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsun-Wei Chan

IPC: H01L23/495 ,  H01L23/06 ,  H01L25/065

Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.

公开(公告)号：US09881845B1

公开(公告)日：2018-01-30

申请号：US15291971

申请日：2016-10-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Yi Chang ,  Hsun-Wei Chan ,  Ching-Han Huang

IPC: H01L27/14 ,  H01L23/055 ,  G01N27/12 ,  G01N33/00

CPC classification number: H01L23/055 ,  G01N27/12 ,  G01N27/125 ,  G01N33/0011 ,  G01N33/0027

Abstract: An electronic device includes a transducer including a sensing area and a covering structure that covers the transducer. The covering structure includes a shelter portion and defines at least one aperture. The shelter portion covers the sensing area. The aperture includes a first curved surface and a second curved surface farther away from the sensing area than the first curved surface, and a first center of a first curvature of the first curved surface is at a different location than a second center of a second curvature of the second curved surface.